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DRAM Devices news and hot articles

2007-7-4 Macronix survives PowerChip's takeover bid
Powerchip Semiconductor has failed in its bid to gain control of another Taiwan memory supplier, Macronix International, according to reports from the Taipei Times.
2007-7-3 Micron posts $225M loss, drives cost-saving schemes
Even with its cost-cutting efforts, Micron Technology posted a Q3 loss of $225 million, or minus 29 cents per diluted share, on net sales of $1.3 million.
2007-7-3 Power supply IC saves space in car navigation systems
Renesas Technology Corp. launches the R2S25402FT single-chip power supply control IC for car navigation systems that promises to cut board space by up to 20 percent.
2007-7-2 Tap capacitive sensor UI in next-gen CE devices
A more efficient and reliable alternative to resistive touchscreens is a thin, transparent, capacitive sensor touchscreen that embedded users can place over any viewable surface for input and navigation.
2007-7-2 Boost switching systems with PXI/LXI devices
Although viewed to be competing standards, PXI and LXI in switching and instrumentation applications are sufficiently different so that leveraging existing PXI into LXI can produce highly flexible solutions.
2007-6-29 Winbond, Qimonda extend memory production deal
Winbond Electronics and Qimonda AG have signed an agreement to further expand their existing cooperation for the production of memory chips.
2007-6-28 DRAM assembly and test houses cautious on expansion
Although DRAM assembly and test houses traditionally follow DRAM makers' expansion moves, DRAMeXchange reported they are taking a cautious stance this year following last year's over expansion, which resulted in a severe DRAM price fall in the first half of 2007.
2007-6-28 Macronix struggles in the face of hostile takeover
A boardroom showdown will finally decide on the fate of Macronix International against Powerchip Semiconductor, which has snapped up enough shares in Macronix to make a bid for a handful of board seats.
2007-6-27 Toshiba unrolls RISC-based SoC for car TFT displays
Toshiba has rolled out an IC for automotive TFTs that it said offers the industry's highest level of integration to date.
2007-6-26 SIA slashes 2007 chip sales forecast
SIA has lowered its 2007 growth sales forecast for microchips to 1.8 percent, citing price drops in the microprocessor, DRAM and NAND flash markets.
2007-6-26 MOEA: 12-inch fabs drive Taiwan's chip industry
Taiwan's Ministry of Economic Affairs (MOEA) reported that the development of 12-inch plants has put local companies in the lead in the semiconductor market.
2007-6-26 Mosaid licenses patents to Taiwan DRAM vendor
Mosaid Technologies has licensed its patent portfolio to Taiwan DRAM vendor Etron Technology for a five-year term.
2007-6-26 Elpida sees promising 2H, halts DRAM price war
Elpida Memory said it has stopped an aggressive price war that hurt DRAM sales early in the year.
2007-6-25 Devices extend frequencies for signal analyzers
At MTT-S IMS 2007, Anritsu Co. unveiled its 2MHz and 6GHz cable and antenna frequency extensions to its S331D/S332D Site Master cable and antenna analyzers.
2007-6-25 Designing in the age of 3D systems
The optimal utilization of the third dimension requires a careful design of the overall 3D system architecture.
2007-6-25 Toshiba launches GaAs FETs, RF devices
TAEC featured an array of C-, X- and Ku-band gallium arsenide (GaAs) FETs developed by Toshiba Corp. as well as a broad line-up of RF and small signal devices at this year's IEEE MTT-S event.
2007-6-19 Low-cost, complete power solution for powered devices includes 12V buck converter
The MAX5953A provides a simple and inexpensive, yet complete, nonisolated power solution for a powered device in a PoE system.
2007-6-19 LabVIEW driver for UltraFast devices debuts
Strategic Test Corp. has announced the availability of a LabVIEW driver for their UltraFast range of digitizer, arbitrary waveform generator and high-speed digital I/O PCI cards.
2007-6-19 Samsung opens 300mm flash fab in Texas
Samsung Electronics Co. Ltd has opened its 1.6 million square foot 300mm NAND flash memory wafer plant in Austin, Texas.
2007-6-19 Graphics SoC targets small TFT LCDs in cars
TAEC has expaned its family of automotive graphics and display controllers with a new SoC targeted at instrument-cluster applications ranging from back-up camera displays to full-size, reconfigurable instrument clusters.
2007-6-18 Enhancing mobile devices with light sensors
This article looks at the different available light sensors, and covers trade-offs in resolution, dynamic range and cost. Using integrated circuitry with light sensors enables on-chip calibration, filtering and increased resolution. These advances are discussed with respect to two applications: an ambient-light sensor for a laptop and another for a cellphone display.
2007-6-18 Applying CTMs on FPGA-based devices
This article discusses better ways to predict temperature for these faster and denser FPGA components in a system environment.
2007-6-14 Micro switch touts improved turn-on voltage
NEC Corp., together with NIMS and JST, have improved the turn-on voltage of a new nanometer-scaled switch, NanoBridge, which enables the operation voltage of the switch to be adjusted to that of CMOS.
2007-6-14 Chartered to manufacture Tezzaron's 3D devices
Chartered Semiconductor Manufacturing and Tezzaron Semiconductor are working on the manufacture of the latter's 3D devices.
2007-6-13 IBM takes wraps off 45nm ASIC with SOI
IBM has unveiled the Cu-45HP custom chip, an ASIC based on a 45nm process and uses embedded DRAM implemented on SOI technology.
2007-6-13 Ultrathin MEMS-based sensor suits portable devices
Freescale Semiconductor has started sampling a MEMS-based sensor with a three-axis digital-output accelerometer that the company says is the thinnest on the market.
2007-6-12 Hitachi introduces 250Gbyte HDD for mobile devices
Hitachi Global Storage Technologies (Hitachi GST) announces the launch of its Travelstar 5K250 hard disk drive (HDD) with a quarter terabyte capacity.
2007-6-11 Tiny 24bit DACs target portable audio devices
Asahi Kasei EMD Corp. launches the latest addition to its Audio2go product family, the AK4370 and AK4371 ultralow power 24bit DACs with integrated high output headphone amplifiers for cellphones, smart phones and PMPs.
2007-6-8 Xilinx marks production qualification milestone of Virtex-5 devices
Xilinx has announced production qualification of its LX50 and LX50T FPGAs, the first two devices in the Virtex-5 65nm series.
2007-6-6 Report: TSMC, Hynix in discussion over $1B fab purchase
Taiwan Semiconductor Co. Ltd is reportedly hammering a deal with Hynix Semiconductor Inc. that would see the foundry shell out almost $1 billion to purchase a 200mm wafer fab with a capacity of 129,000 wafers per month.
2007-6-6 100Gbit network IC has integrated traffic manager
EZchip Technologies Ltd claims that its NP-4 network processors can offer system vendors a significant cost reduction by integrating all the key components of their line card into a single chip.
2007-6-5 Fluctuating forecasts muddle chipmakers' plans
Skepticism is growing about the outlook for 2007 and beyond with the mounting disconnect between consistently strong electronic end-equipment market demand and dwindling sales at semiconductor component suppliers.
2007-6-5 DRAM gain stirs Asian chip stock rally
A five-percent jump in DRAM prices in the spot market set off a chip stock rally in Asia late last week, Reuters reported.
2007-6-4 RF control devices enable remote keyless entry
Freescale's MC33696 PLL-tuned UHF transceiver and MC33596 low-voltage receiver are access and remote control devices designed to help developers streamline existing RF solutions and add the convenience of wireless control to their products.
2007-6-4 New interconnects, signal integrity devices roll
Samtec Inc. unveils new interconnects and signal integrity services for panel and I/O, cable assemblies and board-to-board applications.
2007-6-4 Gartner slashes chip industry outlook
Gartner has lowered its global sales outlook for the semiconductor industry for 2007, citing the continuing fall in DRAM and microprocessor prices.
2007-6-1 Micron CEO: Of memories and foundry models
Micron Technology Inc. has grabbed its share of headlines. What will Micron do next? To get a handle on the company, EE Times caught up with Steve Appleton, its president, CEO and chairman, who talked about the IC industry, foundry/fab-lite models, private-equity buyouts, its diversification strategy and universal memory.
2007-6-1 Design with serial EEPROM devices
Available with varying capacities, interface protocols, voltages and temperature ranges, serial EEPROM units are used in applications running the gamut from automotive to medical and consumer goods. Here are some do's and don'ts for designing with serial EEPROM devices.
2007-6-1 Devices retain logic states even without power
Utilizing FRAM technology, Ramtron launches the industry's first non-volatile state saver that retains the state of signals on demand and restores them to the correct state automatically upon power up.
2007-6-1 Lower-voltage DDR2 DRAMs target data center apps
Micron Technology Inc. recently launched low-voltage DDR2 DRAMs that aim to lower server power consumption.
2007-6-1 Multichip package's capacity swells to 4Gbyte
Samsung Electronics Co. Ltd is bumping up the storage capacity in 3G mobile phones with a 4Gbyte multichip package that it says will prompt some phone makers to design out external memory card slots.
2007-5-31 ADCs eye compact apps, devices
austriamicrosystems AG has rolled out the AS1524/25 ADC family suitable for small battery-powered devices and portable DAQ systems.
2007-5-31 iSuppli: South Korea's DRAM grip is loosening
iSuppli Corp. warns that South Korean DRAM makers may see their unit production lead over their foreign counterparts falter within the next three years.
2007-5-29 On-wafer solution brings power devices to market faster
Cascade Microtech's Tesla system touts a complete on-wafer solution for overtemperature, low contact resistance measurements of power semiconductors of up to 60A (current in pulsed mode) and 3,000V (coaxial measurement).
2007-5-29 Rumor: AMD, Micron among firms to go private
Various reports claim that AMD and Micron Technology are among firms mulling the private-equity route.
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