IP core enhances capacity of next IEEE standard
IPextreme claims the industry's first synthesizable IP core that will manage the upcoming IEEE 1149.7 standard. This will be in volume production by early 2009.
- Single test system for LTE debuts
- JTAG beefs up lineup with new tools, updates
- Femtocell baseband to integrate DSP core
- MOSFETs trim on-state resistance, gate charge
- Fan trays ensure thermal protection in cooling apps
- Oscillator handles 75-85MHz frequency range
- ASA rolls M1 scope tools ver6.01
- V8 powers Google's Chrome
- Agilent eases testing of five major display formats
- Avago intros GPS LNA with integrated FBAR filter
- Crystal oscillators upgrade functionality of bus interfaces
Intel plugs Internet into TV, STB platforms
The CE 3100, aka Canmore, represents an initiative that speaks to everything from Intel's growing SoC capabilities to its drive toward Internet TV.
Learn how National Instruments combines Graphical Programming (NI LabVIEW) with NI Technologies (NI Smart Camera, NI CompactRio, NI Compact FieldPoint) to help you increase productivity, reduce costs and smoothen your programming process.
Optimizing power consumption in SoCs, DSPs and MCUs has provided good results, but even more can be gained in a joint effort between ICs and the teams that design them. The Texas Instruments article addresses some solutions to today's growing power issues.
Implement safe battery charging between gadgets
One of the challenges consumers, and especially business travelers, face today is finding a common yet practical technique to charge the wide variety of portable devices such as cellphones, wireless headsets, and MP3 players now at their disposal. Addressing this challenge requires safe charging methods that allow portable devices with higher energy storage to charge portable devices with lower power requirements.
Sharp catches up on 'cool' handset craze
A look inside Sharp's 922SH mobile phone yields insights into whether the Japanese remain ahead of their global counterparts.
16bit MCU: ready for 32bit action
The C166 architecture is one of the most successful 16bit MCU families in a wide variety of industrial and automotive applications. The C166 was designed for high real-time performance, with fast execution of instructions, rapid response times and intelligent peripheral functionality.
Mobile Internet Edges into ULC market
The ultralow-cost (ULC) handset market currently sees high levels of interest from all industry players. This interest driving the market is justified for a number of key reasons. Here's how mobile Internet is entering the ULC market.
Meeting the challenges of handset design and interoperability
For wireless operators, content providers and handset manufacturers, the increasing popularity of wireless multimedia messaging is driving the evolution of the industry as we know it today.
Develop, test handset apps with simulation tools
Simulation technology helps software developers write and test high-level application code on the desired OS, then run the application on a particular hardware platform even before the hardware is available.
Conquer the car audio challenge
As premium sound systems grow in size and power requirements, Class D audio amplifiers are being redesigned to answer the unique automotive challenge.
Build distributed test system with LXI oscilloscope
The purpose of creating LXI alliance is to simply integrate test systems; improve the throughputs of the test systems; reduce the cost; utilize the mature technologies like Ethernet and 1588; and assure the compatibility among different providers.
3D-TSVs spark packaging
revolution
3D integration with through-silicon vias (3D-TSV) will accelerate the consolidation happening in CMOS wafer fabs and the shift toward the fabless foundry model.
Opinion: Google's Chrome not yet for mainstream computing
A short test drive of the Chrome beta made it clear this application is not ready for mainstream computing as it needs some polishing in areas such as plug-ins.
- Plexus sees Hangzhou as manufacturing site
- X-Fab Sarawak all set to start 0.35µm process tech
- Hong Kong is last stop for Agilent's test tour
- Infineon shares up on Qimonda sale rumors
- Intel acquires mobile Linux developer
- Canadian Solar, GCL ink long-term supply deal
- Alchip taps Sony Semi's packaging tech for ASICs
- Spansion inaugurates security tech office in Milan
- Slowdown becomes boon for consumer electronics
- Researchers create 'nanonets' for electronics
- Firms agree to supply solar cells in Europe by 2013
- Slump in DRAM, NAND flash prices lingers
Compact step-down DC/DC regulatorNEW
Linear's ideal diodesNEW
TI's approach to driving a WLEDNEW
TFT LCD bias supply, WLED driver
75 years of innovation
IIC-Taiwan kicks off innovation
What is the next trend that design engineers in Taiwan must grasp? Despite the impact of the U.S. sub-prime mortgage crisis and soaring oil prices on the global economy, there is still good news.
Internet transforms CE into computing devices
To see the future of computing, look to the Adobe Open Screen Project, an ambitious effort to bring full-featured Internet experience to devices ranging from TVs to mobile handsets.
Amid continued debate on whether IC R&D is an endangered species or is successfully evolving to adapt to changing realities, Intermolecular and Semiconductor Research braved the debacle, each announcing their own R&D initiatives.
Association gauges Blu-ray's 3D future
The Blu-ray Disc Association is developing its position on stereoscopic 3D under growing pressure from Hollywood studios who want to create a home video market for their rising number of stereo 3D movies.
Qimonda extends XDR DRAM to PlayStation 3
Qimonda AG has started shipping XDR DRAM in volume production for Sony's PlayStation 3 computer entertainment system.
ST, Ericsson must decide on new JV's future
STMicroelectronics and Ericsson have accomplished the easier task of forming a joint venture IC and mobile platform business. But both must now decide the real future of the new JV and their continued role in its management.
Analysts see IC market slowdown in 2H 08
A bad sign for the industry? An investment banking firm has cut both its third- and fourth-quarter estimates for Taiwan Semiconductor Manufacturing Co. Ltd.
2009 outlook gets brighter with 70 fab projects
A decline in global semiconductor fab equipment spending of 20 percent is expected this year, but a rebound of over 20 percent in spending is expected in 2009, driven by over 70 fab projects, reported SEMI.
Tech firms go head-to-head on SSDs
The solid-state drive (SSD) battle is brewing with an endless stream of companies that are expanding or entering the market, leaving analysts to predict a shakeout in the arena.
Green hybrid cars drive change in IC landscape
For years automotive manufacturers have been working on drive technologies intended to reduce the dependency on oil and at improving emissions.
Renewable energy initiatives explore hydrogen, photosynthesis
Green energy projects are looking into ways to replace fossil fuels with renewable resources like hydrogen and photosynthesis.
Solarfun to supply PV modules to Q-Cells
Solarfun Power Holdings has entered a three-year supply agreement with Q-Cells International, a subsidiary of solar cell provider Q-Cells AG.
eeForum:
Design Houses in the Philippines
BusinessWeek's Dennis Posadas posited that the Philippines can no longer compete on the basis of cheap labor; that it must switch to a higher value strategy. What do you think?
Op amp precision design: Random noise
This application note covers the essential background information and design theory needed to design low noise, precision op amp circuits.
Green trends heat up for next designs
Gone are the days when design was, well, design. Today it's DFM, design-for-quality, design-for-cost and DfE.
Consider FFT module reuse in OFDM modulation
This article provides an example for implementing OFDM modulation and demodulation in reconfigurable wireless systems.













