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EE Times Asia - total search 1670 articles sort by date sort by relevance
Testing designs containing embedded blocks 2000-05-01
Deep-submicron processes enable increased complexity, which means that many of the embedded blocks cannot be tested using traditional methods. You must find new solutions to avoid risking product quality  
Testing beyond the required specs 2007-12-03
An increasing number of new and proposed EMC standards are pushing the upper frequency test limits further up the microwave spectrum. The latest EMC standard released, IEC 61000-4-3:2006, is no exception  
Test EMC using novel time-domain methods 2004-02-02
This article covers new ways of signal processing to use time-domain measurement techniques to perform accurate and time efficient EMI measurements  
Technologies boost virtual instrumentation 2008-03-17
At present, virtual instrumentation has been used in all fields of measurement and automation. More engineers create high-performance and expandable test systems with the help of virtual instrumentation--signaling a new era of instrumentation is coming  
Taking advantage of MCU sleep modes to boost energy savings 2012-03-21
Learn about the different MCU modes that allow energy conservation  
Systems approach delivers SiP design 2006-05-01
System-in-Package isn't just about size. Boasting faster development and lower cost, SiP allows the combination of different wafer process chips in one solution, making it not only a package but also a true system  
System specs drive multiprocessor SoC 2002-02-16
SoC design requires new tools and a different skill set than traditional ASIC chip design. The case study illustrates new challenges and describes methodologies to address them  
Syntax raises RTL abstraction level 2001-05-16
A University of Toronto professor has proposed a new RTL abstraction syntax that he claimed can be implemented by a modest extension to traditional imperative programming languages  
Survival guide to high-speed ADC digital outputs 2012-04-18
Learn about the key attributes of CMOS, LVDS, and CML outputs, and their performance tradeoffs  
Sub-GHz wireless for long range IoT connectivity 2014-12-03
Learn about the role of the sub-Gigahertz wireless radio spectrum in extending the range of wireless devices in an Internet of Things network  
Standard metal enables paradigm shift in ASIC technology 2005-08-16
Deep-submicron design and manufacturing issues drive the critical need for a new design technology to replace standard cell  
Speed enhancements for Model Tech upgrades 2001-04-15
This article discusses the ModelSim simulation upgrade, which promises faster performance, better memory use, new interactive debug features and improved testbench and regression test support  
Speech quality issues in mobile networks 1999-09-09
This paper describes the several sources of speech degradation in wireless mobile networks, and offer new methods for eliminating them. Sources of degradation including digital speech compression, tandem coding, background noise, hybrid echo, and acoustic echo will be described in detail. It also describe how modern signal processing technology, including echo and noise cancellation, automatic level control, and tandem CODEC avoidance is being used to eliminate these problems and improve speech quality  
Solving today's problem of SoC verification 2010-01-22
As more complex, mixed-signal SoC designs continue to stress verification methodologies and schedules, designers need new approaches in solving today's test challenges. Mixed-signal verification presents a unique challenge as the analog portion of the design requires highly accurate and time-consuming, analog simulation  
Solutions for dual-band GSM handset 1999-09-09
The growth of GSM networks, particularly in Asia-Pacific and China, is an ideal opportunity for new Chinese handset manufacturers to enter this market. However, producing a good and affordable voice-centric GSM phone is not trivial, and despite some serious efforts, quite some players have already experienced failures with currently available solutions. This paper describes the elements guiding the dual-band GSM handset with focus on mass production and key driving factors such as cost, power consumption, size, weight, quality, and time to market  
Solder masks: Examining rules of thumb 2001-02-01
Learn the plane facts about cuts in power planes and solder mask on surface layers  
Smart partitioning could be path to integration 2002-09-16
The paper talks about the trade-offs of implementing RF inside the chip against surrounding the mainly digital chip with the needed RF circuits  
Smart antennas: A design alternative 2005-02-16
With integrated GPS technology, today's smart antennas drive new alternatives in remote tracking  
Slashing design time with the IP evaluation model 1999-10-01
A new paradigm in design reuse eases your job of picking the right IP for your application, and lets you focus on more pressing issues in the design process. It calls for just downloading the IP, parametrizing it and evaluating it before licensing the core  
Simulation takes off with hardware 2002-12-02
This article talks about how simulation can help develop firmware in advance for a safe and successful integration  
Simplify automotive ASIC design with FMEA 2011-01-10
Learn about failure modes and effects analysis (FMEA), an essential tool to examine all aspects of a product specification  
Significance of RTL architecture to power analysis 2015-03-30
Learn about the advantages of a well defined RTL architecture for power estimation and analysis through a case study of a FIFO design  
Significance of data acquisition to smart grid 2015-03-17
The smart grid must automatically detect system faults and quickly isolate them for fast repair. Learn about the important role of data-acquisition systems in keeping electricity flowing  
Signal chain basics: How to deliberately boost THD in audio processing systems 2012-09-13
Here's a new concept for producing higher fidelity from audio system  
Signal chain basics: Clock jitter unveiled (Part 2) 2012-01-25
Learn about the practical aspects of jitter transfer and the limitations of phase noise measurement techniques  
Signal chain basics: Clock jitter unveiled (Part 1) 2012-01-24
Read about some of the key parameters of this critical specification, which affects many aspects of the signal chain  
SigmaRAM: The 24Gbps technology for wired world 2002-08-01
The SigmaRAM groups says it can meet the challenge of capturing multimedia data at wire speed at any point within the Internet by developing a new generation of ultra fast SRAM  
Serial ATA: Designing for high-speed storage 2005-03-16
Designing with SATA requires a new way of thinking for everyone. Here are layout rules to ensure a working implementation  
Self-repair boosts memory SoC yields 2002-04-01
This technical article describes the emergence of a new BIST and repair technology that is capable of running test, diagnostics and repair functions right on the chip  
Selecting DSPs for real-time signal processing 2000-03-01
Choosing the appropriate DSP for the system is one of the first and most critical decisions to be made, for the choice affects every aspect of the engineering cycle and can literally make the difference between project success and failure  


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