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Thermal Performance Of Power MOSFET Packages
This paper introduces the PowerPAK family of power MOSFET packages, which provide increased levels of performance for a given footprint and profile |
2001-07-03 |
MOSFET selection for cellular phones
This paper focuses on the cellular phone and discuss the various Power MOSFETs offered in the market for cellular phone application and the trend toward application specific MOSFETs. Elements in power management, power conversion are discussed in relation to the selection of the most appropriate and cost-effective MOSFET |
1999-09-09 |
MOSFET answers multimarket power needs
MOSFETs are the key elements in a dc-dc conversion solution designed for high-frequency power switching |
2005-09-01 |
Deriving optimum MOSFET ON-resistance for target applications
This paper shows how to design MOSFETs for target applications to produce the best performance. |
2004-04-22 |
Fast-diode MOSFETs incurrent commutation
A MOSFET with a fast-recover diode can improve the body diode performance in a three-phase inverter topology providing six-step current commutation |
2007-06-01 |
Hot-swap circuits for digital comms boards
The basic hot-swap circuit consists of a hot-swap controller, a power N-Channel MOSFET and a power sense resistor. There are two types of hot-swap controllers, voltage-controlled and current-controlled |
2004-01-16 |
Using Bipolar Transistors for Power Management in Low Voltage Systems
This paper presents general overview of new bipolar transistor technologies with respect to selection criteria against competing MOSFET solutions for low-voltage applications |
1999-06-29 |
The future of mixed-signal design
I hear two contradictory things regarding mixed-signal IC design. One set of voices says the systems-on-chip (SoC) of the future will be large mixed-signal systems, and the proportion of these being built will double from about 33 percent currently to 66 percent by 2005. The other set of voices says everything will be big digital chips constructed in ever-deeper submicron CMOS, in that the ASICs of the future will use as many 15 million logic gates, but that the analog and mixed-signal circuitry will be left off-chip. |
2000-02-01 |
Extraction critical for RF design
Current CMOS technology is a viable candidate for portable communications devices. Modern deep-submicron MOS transistors have more than enough speed to handle high-frequency or RF signals. |
2000-11-01 |
Package efficiency: A boost to power MOSFETs
DirectFET technology has radically reduced package resistance and inductance, and facilitated a large reduction in the thermal resistance. |
2003-04-16 |
Enhancing power circuit design
This technical article demonstrates how discrete design information can be used to enhance the design of power circuits for computers and handheld devices. |
2002-09-01 |
Interface logic technology will never die
Logic continues to have a bright future and it will always be regarded as the stop-gap solution when advanced ASICs or FPGAs fail to provide the best performance-to-cost ratio. |
2003-07-16 |
SiC Schottky diodes fit for PFC apps
The unique features of SiC as a device material allow producing boost diodes with nearly ideal performance characteristics suitable for all power ranges in PFC applications |
2006-11-16 |
New standard in hot-swap reliability
Improve your devices' hot-swap controller to avoid the hassles of interrupted power supplies. Here's how. |
2005-04-01 |
Power MOSFETs for smaller dc-dc converters
Developing power MOSFETs mounted in dc-dc converters minimizes power constraints as the speed of CPUs and memory installed in PCs and servers continue to integrate more sophisticated functions. |
2005-01-17 |
| ---Total Search 40 Articles,Total 3 Pages--- |
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