Power ICs simplify Li-ion battery charging
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2006-07-17 |
| Autonomous power manager ICs offer full-featured standalone battery chargers, integrated with PowerPath controllers and ideal diode devices that efficiently manage a wide variety of input power sources and reduce power dissipation, all with extremely small form factors |
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| Estimate die-junction temp in power ICs
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2007-11-16 |
| A circuit simulator can calculate the total thermal response in power ICs. It allows engineers to observe the effect of the thermal system on the circuit?s parametric performance. Adding a quasidynamic thermal wrapper model to the static 25C device model will further account for self-heating in such devices |
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| GaAs optoelectronic ICs for Gigabit Ethernet
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2000-03-20 |
| This paper describes the Gigabit Ethernet market and the various GaAs ICs and OEICs available |
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| Smart-card ICs secure secrets safe and sound
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2005-08-16 |
| Smart-card ICs provide a portable environment in which secure storage and processing of private and transaction data can take place |
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| Advanced ICs allow security integration
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2002-12-16 |
| Merchant-market ICs are letting designers integrate SSL and IPSec into their system and still maintain throughput |
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| Designing 3D-ICs (Part 1
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2011-12-07 |
| Learn about the tools that can be used to handle a complete backend flow, and enable true 3D design partitioning, synthesis, placement, and routing. |
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| Double-zone acoustic scanning of plastic-encapsulated ICs
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2011-04-19 |
| Learn about the double-zone scanning system and how it can increase throughput. |
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| Integrate power-manager ICs in high-end handsets
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2007-06-18 |
| The need for high-efficiency charging, high levels of feature integration in the battery-charger IC, efficient use of board space, and increased product reliability exert considerable pressure on the design of battery-powered electronic devices. |
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| Signal conditioning car ICs go green
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2006-06-16 |
| The challenges of converting to green, lead free packaging in the automotive environment can be daunting. However, by considering devices that meet and exceed requirements, a system designer will be able to successfully mitigate the associated engineering risks. |
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| Designing 3D-ICs (Part 2
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2011-12-08 |
| Here's the second instalment of this series that tackles the tools that can be used to handle a complete backend flow, and enable true 3D design partitioning, synthesis, placement, and routing. |
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| Process design kits take aim at custom ICs
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2001-04-15 |
| This technical article describes Cadence Design Systems' process design kits for 0.25µm and 0.18µm process simulations. |
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| Silicon germanium ICs target wireless basestation transceivers
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2001-08-09 |
| This conference technical paper describes high performance active silicon germanium components designed specifically for wireless basestation applications. |
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| Hopper hierarchical flow: Improvements for large ICs
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2001-09-16 |
| This technical article describes the Hopper software hierarchical flow implemented to maximize large, high-performance IC design. |
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| ICs for wireless comms beyond 3G
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2006-09-18 |
| B3G promises to take mobile data rates to up to 100Mbps in the downlink and up to 50Mbps in the uplink. |
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| Effective testing for Bluetooth transceiver ICs
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2002-02-01 |
| This technical article describes how the RF front-end transceiver can effectively address the respective types of test parameters defined in Bluetooth technology. |
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| High-side ICs simplify current measurements
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2004-03-16 |
| This article discusses how much of today's equipment requires a current measurment capability that presents multiple and competing design options. |
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| Differential Hall ICs under aggressive conditions
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2004-09-16 |
| Learn how Infineon combined two Hall cells, a differential amplifier and evaluating circuitry on a single chip. |
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| Accounting for LO noise in Tx/Rx mixer ICs
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2006-06-16 |
| Wide-band noise in the buffer amplifier stages impairs the received and transmitted signal. By introducing a noise parameter in dBc/Hz for the passive mixer IC, the user can calculate the system-related impairments when using the IC in base-station transmit and receive applications. |
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| Drive your large LCD with PPDS
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2008-04-01 |
| There is a need for a robust and reliable LCD interface solution to transmit through less data lines working at higher frequency. Point-to-Point Differential Signaling (PPDS) ensures reliable data transmission from the timing controller to the column driver/driver ICs through fewer data lines compared to the traditional multi-drop architecture |
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| Implementing synchronous rectifiers in isolated topologies
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2002-04-16 |
| The digital control method facilitates smart driver ICs that help solve problems in controlling synchronous rectification in isolated topologies |
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| RF Micro, IBM form alliance for SiGe-based RFIC development
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1999-10-15 |
| RF Micro Devices Inc. and IBM Corp. have agreed to jointly develop radio frequency ICs (RFICs) based on IBM's SiGe process technology |
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| Signal integrity moving beyond high-speed design
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2001-05-01 |
| Shrinking edge rates on today's deep submicron ICs make a strong argument for SI signoff on every board design. Signal integrity analysis is not just for high-speed design anymore |
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| Web-based EDA tools come to Asia
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2000-09-01 |
| We can shop for clothing and record albums over the Internet; we can order food, and even have love affairs! Why not design ICs? This was the underlying theme at the recently concluded Design Automation Conference (DAC 2000) in Los Angeles. Look, for example, at the thinking process harnessed by Barcelona Design Systems |
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| Advancing GaAs potential via pHEMT/HBT mix
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2006-12-01 |
| Monolithic pHEMT/HBT ICs represent a significant step in advancing the potential for GaAs capabilities by maximizing the advantages of both bipolar and FET circuits |
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| Fighting jitter in Fiber Channel designs
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2001-05-22 |
| Routing multiple serial signals can be daunting when developing Fiber Channel systems. Digital repeaters and re-timer ICs clean up signals and counteract jitter to ensure spec compliance |
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| Low-cost solutions for PoE-powered devices
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2005-11-01 |
| Create reliable solutions that are low-cost, energy efficient and easy to manufacture using integrated power ICs |
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| Addressing IC reliability issues (Part 1)
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2010-02-26 |
| Advanced short-geometry CMOS processes are subject to aging that causes major reliability issues, degrading the performance of ICs over time. This article describes the industrial challenges associated with accurate modeling of aging problems, with a particular emphasis on NBTI |
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| Bringing the MOST in interface controllers
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2008-08-01 |
| MOST is a networking standard enabling seamless transport of digital audio, video and packet-based data, along with real-time control information, within the car. The latest MOST ICs simplify the network interface by integrating all low-level, real-time network operations, including the network driver, on a single chip |
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| 2004 Design Trends and EDA Tools
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2004-10-07 |
| Global Sources and Gartner announced the results of their annual joint study, which indicates growing use of finer process technologies in the design of standard ICs and ASICs in mainland China and Taiwan |
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| Design for Test considerations for ATPG
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1999-10-01 |
| This article describes techniques for designing ICs to facilitate ATPG, and explains the importance of compact test vector generation in the overall design flow |
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