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PCIE series Final Inch designs in PCI Express applications generation 1-2.5Gbps 2007-03-12
A single Samtec PCIE Series through hole connector in a board-to-edge card configuration can be used in PCI Express systems with total trace lengths not to exceed 13.9 inches when used with Samtec's Final Inch outing, breakout, and trace width solutions. Because loss is the dominant contributor to system degradation, designers should be aware that using smaller trace widths, laminates with higher loss tangent, and sub optimal routing solutions with higher pair-to-pair coupling and additional via stubs will decrease overall performance and the maximum allowable trace length  
PCIE series Final Inch designs in PCI Express applications Generation 2-5Gbps 2007-04-02
To ensure interoperability between PCI Express transmitter and receiver devices, we will stress a typical interconnect design by stimulating their SPICE model components and devices with stressed data patterns. This paper will cover techniques to stress the system with reduced driver amplitude as well as jitter and noise injection.  
Choose and use high-speed serial data analysis tools 2008-08-01
Serial bus technology raised the bar in performance requirements for high-performance test and measurement instruments used in design, validation and troubleshooting. High data rates are only the initial steps. Designers need better tools to support critical SI measurements and eye diagram analysis.  
Edge Rate ERM8/ERF8 Series 10mm stack height Final Inch designs in PCI Express applications Generation 2—5.0Gbps 2008-06-26
This paper describes a measurement method applied to demonstrate the feasibility of using Samtec Edge Rate ERM8/ERF8 Series connectors with standard FR4 epoxy PCBs.  
Powering and configuring Spartan-3 Generation FPGAs in compliant PCI applications 2008-05-26
The information presented in this application note applies to compliant PCI applications using Spartan-3 Generation FPGAs.  


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