| Platform used for measuring wafers, PCBs
|
2006-04-27 |
| Cascade Microtech introduced the M150 measurement platform, which is used for semiconductor wafers, ICs, PCBs, MEMS and bioscience devices |
|
| MEMS tester works at wafer level
|
2006-04-10 |
| Tokyo Electron has delivered the Temeon, a new wafer-level microelectromechanical system tester to a MEMS device manufacturer located in Japan |
|
| NAND flash MCP designed for multimedia cellphones
|
2006-03-02 |
| STMicroelectronics announced a new multi-chip package memory portfolio that aims to meet the needs of multimedia applications in 3G and CDMA cellphones. |
|
| Startup offering 'energy harvesting' magnet sensor
|
2005-11-04 |
| Startup EnOcean introduced a solar-powered RF magnet-contact sensor that can eliminate dependence upon batteries for wireless security systems. |
|
| ST's three new accelerometers
|
2005-10-19 |
| STMicroelectronics expanded its portfolio of three-axis accelerometers which, according to the company, embed world-class performance in ever smaller packages. |
|
| ST's latest acceleration sensors
|
2005-10-04 |
| STMicroelectronics extended its range of dual-axis acceleration sensors with the introduction of two new devices housed in the tiny, lead-free LGA (Land Grid Array) package measuring 5-by-5-by-1.5mm. |
|
| Knowles Acoustics rolls out digital SiSonic SMD microphones
|
2005-09-30 |
| Knowles Acoustics announced its new digital series of SiSonic surface mount microphones that is based on the company's MEMS microphone technology |
|
| Metrology tool offers atomic layer measurement accuracy
|
2005-09-13 |
| A manual, benchtop non-destructive R&D metrology tool that offers atomic layer measurement accuracy to 7 angstroms of oxide has been launched by Metryx. |
|
| Sensor touts industry-first g-selectable capability
|
2005-05-13 |
| Freescale claims to have developed the industry's first three-axis, low-gravity (low-g), microelectromechanical systems (MEMS) sensor with a g-select feature |
|
| Shorten your design time
|
2005-05-09 |
| Goal Semiconductor unveiled a plug-and-play development and evaluation system for its quad, high-voltage, 9bit, serially configurable voltage/current digital-to-analog converter (DAC) with outputs of up to 200V. |
|
| Amplifier drives MEMS devices
|
2005-05-06 |
| The advent of MEMS has given rise to specialized instrumentation for these devices. In response to the proliferation of MEMS, instrumentation house Tegam is now offering a four-channel MEMS engine driver amplifier priced at about $6,500 |
|
| Die bonder with attractive price, performance ratio
|
2005-03-31 |
| The new Easyline 8088 die bonder for sensor assembly from Alphasem is touted to be the first to offer die bond technology proven in high volume production at a very attractive price. |
|
| Quad DAC drives over 200V output
|
2004-12-28 |
| Goal Semiconductor's highly integrated D/A converter means compact system designs for high-voltage control apps. |
|
| Bookham adds overload protection to 10Gbps receiver
|
2004-09-08 |
| Bookham used the ECOC as the launching pad for its integrated 10Gbps optical receiver with overload protection that meets ITU and IEEE standards GR-253-CORE and G.959.1. |
|
| Chip-scale atomic clock targeted at mobile apps
|
2004-09-03 |
| Researchers at the NIST are claiming a tiny atomic clock they have demonstrated could form the basis of significantly more precise timekeeping than achievable now. |
|
|
|
|
|
|Electronic Components|Computer Products|Trade Show Center
|Site Feedback|Site Map|Help|About Us|Contact Us|Terms of Use|Privacy Policy|Security Commitment