| Infineon rolls out tiny silicon MEMS mic
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2006-11-20 |
| Infineon Technologies AG has unveiled a "miniature" silicon microphone for consumer and computer communications devices. |
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| Ecliptek ships samples of MEMS oscillators
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2006-11-07 |
| Ecliptek has started releasing samples of its EMO family of MEMS oscillators, which can be shipped in as little as two days |
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| MEMS resonator operates at 5.1MHz
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2006-11-01 |
| The SiT0100 MEMS resonator from SiTime measures 0.8(H)-by-0.6(W)-by-0.15(T)mm, and is compatible with standard semiconductor packaging for SIP and MCM |
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| Tire pressure sensor includes all TPMS active functions in one package
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2006-10-24 |
| The new SP35 tire pressure sensor from Infineon is touted to be the first device to incorporate all the major active functions of a wheel-mounted tire pressure monitoring system module into a single package. |
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| Freescale accelerometers feature selectable sensitivity
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2006-10-17 |
| Freescale's dual-axis accelerometers offer a customer selectable sensitivity within a 2.5g to 10g range, which allows the devices to be used for multiple functions. |
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| Hitachi Metals makes 'smallest' acceleration sensor
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2006-09-28 |
| Measuring 2.9-by-2.9-by-0.92mm, Hitachi's new acceleration sensor is said to be the world's smallest. |
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| Accelerometer features 3-by-3-by-1mm footprint
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2006-09-13 |
| HDK America Inc. unveiled what it touts as the smallest piezoresistive three-axis accelerometer with a 3-by-3-by-1mm footprint. |
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| Ecliptek unrolls ultra-mini programmable oscillators
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2006-09-04 |
| Ecliptek has added ultra-miniature programmable oscillators to its EPO family of frequency control products. |
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| Automatic die bonder offers increased precision, accuracy
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2006-08-07 |
| Designed for fully automatic, high accuracy precision microelectronics assembly, Palomar's new die bonder performs adhesive dispense, component placement, die attach and flip chip operations over a 720inch2 work area. |
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| New wafer bonding system targets advanced MEMS
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2006-07-26 |
| Touted to be an industry-first, SUSS MicroTec's field upgradable load locked wafer bonding system was developed for advanced MEMS devices |
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| BlueRay prober tests 70,000 dies per hour
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2006-07-19 |
| SUSS MicroTec AG has introduced the latest innovation of the BlueRay probe system, a high-throughput wafer prober capable of testing up to 70,000 dies per hour. |
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| Vistec unrolls new electron beam lithography tool
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2006-07-18 |
| Vistec announced it has already accepted orders for the new VB300 electron beam lithography tool targeting nano-lithography e-beam direct write and next-gen mask appslications. |
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| EMI filters offer two noise attenuation levels
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2006-07-13 |
| Lambda has developed two series of easy-to-use industrial EMI filters that provide two levels of electrical noise attenuation in the same-size package. |
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| MEMS gyro delivers digital range scaling
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2006-06-09 |
| The new ADIS16250 from Analog Devices is touted to be the industry's first programmable MEMS gyroscope and is the first to provide digital range scaling and embedded programmability for industrial apps |
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| 0.35μm CMOS process allows voltages from 3.3V to 120V
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2006-05-16 |
| austriamicrosystems' Full Service Foundry business unit announced its 0.35μm high-voltage CMOS technology H35 with an additional set of 120V NMOS and PMOS devices. |
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