| GenISys layout tool speeds MEMS design
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2006-12-05 |
| GenISys has started sampling a flexible simulation platform for mask aligner lithography that lets them virtually model, redesign and optimize device layouts and processes in hours rather than weeks. |
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| ST, Ball-IT make MEMS-based wireless controller ball
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2006-11-29 |
| STMicroelectronics and Ball-IT have announced a MEMS-based wireless motion-control device that can operate as a freehand personal computer mouse, compass, measuring tape, pedometer and a 3D-object controller |
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| Infineon rolls out tiny silicon MEMS mic
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2006-11-20 |
| Infineon Technologies AG has unveiled a "miniature" silicon microphone for consumer and computer communications devices. |
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| Ecliptek ships samples of MEMS oscillators
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2006-11-07 |
| Ecliptek has started releasing samples of its EMO family of MEMS oscillators, which can be shipped in as little as two days |
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| MEMS resonator operates at 5.1MHz
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2006-11-01 |
| The SiT0100 MEMS resonator from SiTime measures 0.8(H)-by-0.6(W)-by-0.15(T)mm, and is compatible with standard semiconductor packaging for SIP and MCM |
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| Tire pressure sensor includes all TPMS active functions in one package
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2006-10-24 |
| The new SP35 tire pressure sensor from Infineon is touted to be the first device to incorporate all the major active functions of a wheel-mounted tire pressure monitoring system module into a single package. |
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| Freescale accelerometers feature selectable sensitivity
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2006-10-17 |
| Freescale's dual-axis accelerometers offer a customer selectable sensitivity within a 2.5g to 10g range, which allows the devices to be used for multiple functions. |
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| Hitachi Metals makes 'smallest' acceleration sensor
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2006-09-28 |
| Measuring 2.9-by-2.9-by-0.92mm, Hitachi's new acceleration sensor is said to be the world's smallest. |
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| Accelerometer features 3-by-3-by-1mm footprint
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2006-09-13 |
| HDK America Inc. unveiled what it touts as the smallest piezoresistive three-axis accelerometer with a 3-by-3-by-1mm footprint. |
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| Ecliptek unrolls ultra-mini programmable oscillators
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2006-09-04 |
| Ecliptek has added ultra-miniature programmable oscillators to its EPO family of frequency control products. |
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| Automatic die bonder offers increased precision, accuracy
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2006-08-07 |
| Designed for fully automatic, high accuracy precision microelectronics assembly, Palomar's new die bonder performs adhesive dispense, component placement, die attach and flip chip operations over a 720inch2 work area. |
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| New wafer bonding system targets advanced MEMS
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2006-07-26 |
| Touted to be an industry-first, SUSS MicroTec's field upgradable load locked wafer bonding system was developed for advanced MEMS devices |
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| BlueRay prober tests 70,000 dies per hour
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2006-07-19 |
| SUSS MicroTec AG has introduced the latest innovation of the BlueRay probe system, a high-throughput wafer prober capable of testing up to 70,000 dies per hour. |
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| Vistec unrolls new electron beam lithography tool
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2006-07-18 |
| Vistec announced it has already accepted orders for the new VB300 electron beam lithography tool targeting nano-lithography e-beam direct write and next-gen mask appslications. |
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| EMI filters offer two noise attenuation levels
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2006-07-13 |
| Lambda has developed two series of easy-to-use industrial EMI filters that provide two levels of electrical noise attenuation in the same-size package. |
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| MEMS gyro delivers digital range scaling
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2006-06-09 |
| The new ADIS16250 from Analog Devices is touted to be the industry's first programmable MEMS gyroscope and is the first to provide digital range scaling and embedded programmability for industrial apps |
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| 0.35μm CMOS process allows voltages from 3.3V to 120V
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2006-05-16 |
| austriamicrosystems' Full Service Foundry business unit announced its 0.35μm high-voltage CMOS technology H35 with an additional set of 120V NMOS and PMOS devices. |
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| Platform used for measuring wafers, PCBs
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2006-04-27 |
| Cascade Microtech introduced the M150 measurement platform, which is used for semiconductor wafers, ICs, PCBs, MEMS and bioscience devices |
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| MEMS tester works at wafer level
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2006-04-10 |
| Tokyo Electron has delivered the Temeon, a new wafer-level microelectromechanical system tester to a MEMS device manufacturer located in Japan |
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| NAND flash MCP designed for multimedia cellphones
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2006-03-02 |
| STMicroelectronics announced a new multi-chip package memory portfolio that aims to meet the needs of multimedia applications in 3G and CDMA cellphones. |
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| Startup offering 'energy harvesting' magnet sensor
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2005-11-04 |
| Startup EnOcean introduced a solar-powered RF magnet-contact sensor that can eliminate dependence upon batteries for wireless security systems. |
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| ST's three new accelerometers
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2005-10-19 |
| STMicroelectronics expanded its portfolio of three-axis accelerometers which, according to the company, embed world-class performance in ever smaller packages. |
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| ST's latest acceleration sensors
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2005-10-04 |
| STMicroelectronics extended its range of dual-axis acceleration sensors with the introduction of two new devices housed in the tiny, lead-free LGA (Land Grid Array) package measuring 5-by-5-by-1.5mm. |
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| Knowles Acoustics rolls out digital SiSonic SMD microphones
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2005-09-30 |
| Knowles Acoustics announced its new digital series of SiSonic surface mount microphones that is based on the company's MEMS microphone technology |
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| Metrology tool offers atomic layer measurement accuracy
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2005-09-13 |
| A manual, benchtop non-destructive R&D metrology tool that offers atomic layer measurement accuracy to 7 angstroms of oxide has been launched by Metryx. |
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| Sensor touts industry-first g-selectable capability
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2005-05-13 |
| Freescale claims to have developed the industry's first three-axis, low-gravity (low-g), microelectromechanical systems (MEMS) sensor with a g-select feature |
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| Shorten your design time
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2005-05-09 |
| Goal Semiconductor unveiled a plug-and-play development and evaluation system for its quad, high-voltage, 9bit, serially configurable voltage/current digital-to-analog converter (DAC) with outputs of up to 200V. |
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| Amplifier drives MEMS devices
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2005-05-06 |
| The advent of MEMS has given rise to specialized instrumentation for these devices. In response to the proliferation of MEMS, instrumentation house Tegam is now offering a four-channel MEMS engine driver amplifier priced at about $6,500 |
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| Die bonder with attractive price, performance ratio
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2005-03-31 |
| The new Easyline 8088 die bonder for sensor assembly from Alphasem is touted to be the first to offer die bond technology proven in high volume production at a very attractive price. |
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| Quad DAC drives over 200V output
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2004-12-28 |
| Goal Semiconductor's highly integrated D/A converter means compact system designs for high-voltage control apps. |
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