| Ecliptek unrolls ultra-mini programmable oscillators
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2006-09-04 |
| Ecliptek has added ultra-miniature programmable oscillators to its EPO family of frequency control products. |
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| Automatic die bonder offers increased precision, accuracy
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2006-08-07 |
| Designed for fully automatic, high accuracy precision microelectronics assembly, Palomar's new die bonder performs adhesive dispense, component placement, die attach and flip chip operations over a 720inch2 work area. |
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| New wafer bonding system targets advanced MEMS
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2006-07-26 |
| Touted to be an industry-first, SUSS MicroTec's field upgradable load locked wafer bonding system was developed for advanced MEMS devices |
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| BlueRay prober tests 70,000 dies per hour
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2006-07-19 |
| SUSS MicroTec AG has introduced the latest innovation of the BlueRay probe system, a high-throughput wafer prober capable of testing up to 70,000 dies per hour. |
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| Vistec unrolls new electron beam lithography tool
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2006-07-18 |
| Vistec announced it has already accepted orders for the new VB300 electron beam lithography tool targeting nano-lithography e-beam direct write and next-gen mask appslications. |
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| EMI filters offer two noise attenuation levels
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2006-07-13 |
| Lambda has developed two series of easy-to-use industrial EMI filters that provide two levels of electrical noise attenuation in the same-size package. |
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| MEMS gyro delivers digital range scaling
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2006-06-09 |
| The new ADIS16250 from Analog Devices is touted to be the industry's first programmable MEMS gyroscope and is the first to provide digital range scaling and embedded programmability for industrial apps |
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| 0.35μm CMOS process allows voltages from 3.3V to 120V
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2006-05-16 |
| austriamicrosystems' Full Service Foundry business unit announced its 0.35μm high-voltage CMOS technology H35 with an additional set of 120V NMOS and PMOS devices. |
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| Platform used for measuring wafers, PCBs
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2006-04-27 |
| Cascade Microtech introduced the M150 measurement platform, which is used for semiconductor wafers, ICs, PCBs, MEMS and bioscience devices |
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| MEMS tester works at wafer level
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2006-04-10 |
| Tokyo Electron has delivered the Temeon, a new wafer-level microelectromechanical system tester to a MEMS device manufacturer located in Japan |
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| NAND flash MCP designed for multimedia cellphones
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2006-03-02 |
| STMicroelectronics announced a new multi-chip package memory portfolio that aims to meet the needs of multimedia applications in 3G and CDMA cellphones. |
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| Startup offering 'energy harvesting' magnet sensor
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2005-11-04 |
| Startup EnOcean introduced a solar-powered RF magnet-contact sensor that can eliminate dependence upon batteries for wireless security systems. |
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| ST's three new accelerometers
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2005-10-19 |
| STMicroelectronics expanded its portfolio of three-axis accelerometers which, according to the company, embed world-class performance in ever smaller packages. |
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| ST's latest acceleration sensors
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2005-10-04 |
| STMicroelectronics extended its range of dual-axis acceleration sensors with the introduction of two new devices housed in the tiny, lead-free LGA (Land Grid Array) package measuring 5-by-5-by-1.5mm. |
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| Knowles Acoustics rolls out digital SiSonic SMD microphones
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2005-09-30 |
| Knowles Acoustics announced its new digital series of SiSonic surface mount microphones that is based on the company's MEMS microphone technology |
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