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Controllers enable 884 nodes on 11.6-inch touchscreens 2011-02-02
Cypress Semiconductor's CY8CTMA884 family of touchscreen solutions feature 60 sensing I/O channels supporting up to 884 nodes on screen for accuracy, linearity and support for small fingers  
TCXO targets femtocells, base stations 2011-02-02
The TS05 temperature compensated crystal oscillator (TCXO) from Precision Devices covers the frequency range of 10MHz to 52MHz in a 5mm by 3.2mm by 1.5mm package.  
New ceramic nozzle boasts one mispick at field test 2011-02-02
Count On Tools Inc. launches new Ceramic Nozzle Series for Universal Instruments Corp.'s (UIC) placement equipment  
AMD graphics cards drive dual DVI displays 2011-02-02
The AMD FirePro 2270 and ATI FirePro V5800 DVI graphics cards can drive two DVI displays and stretch one application across two screens for an expanded field of view and enhanced productivity  
GPS simulator enables advanced receiver testing 2011-02-02
Spectracom has announced its 16-channel GPS constellation simulator, the Pendulum GSG-55, which is a part of the company's solution set for receiving, distributing and validating GNSS systems  
Battery life extenders for mobile handsets 2011-02-01
ST-Ericsson debuts two devices designed to improve battery life of mobile handsets and other connected devices to extend talk time or Internet connection time of mobile devices.  
Clamp meters, oscilloscope target hazardous testing 2011-02-01
Fluke Corp. introduces clamp meters and an oscilloscope designed to make testing of hazardous equipment and high-voltage circuits safer by reducing exposure to electric shock.  
Updated AMD APP now available 2011-02-01
AMD has launched an updated AMD Accelerated Parallel Processing (APP) Software Development Kit (SDK) ver 2.3 with full support for the first AMD Fusion Accelerated Processing Units (APUs), OpenCL 1.1 and AMD Radeon HD 6900 Series graphics  
SIP point-of-load converters 20A to 120A 2011-02-01
Bel Power expanded its VRPx Series of single inline package (SIP) footprint point-of-load (POL) converters to include 30A, 90A, 100A, 110A and 120A modules  
Module supports antenna- baseband separation 2011-01-31
Designed for the CV-MCU2+ platform, the satellite fiber link module set is an alternative to coaxial cable for transmitting L-band signals between a satellite terminal and antenna  
Automotive qualified planar MOSFETs simplify gate drive 2011-01-31
IR's rugged planar MOSFETs for ICE, hybrid and electric vehicles simplify gate drive requirements while reducing board space and component count  
IR LEDs improve proximity sensor sensitivity 2011-01-31
ROHM Semiconductor's SIM-030/031ST and SIM-040/041ST surface mount IR LEDs offer 850/870nm peak output for 66 percent lower power use compared to the company's current devices  
Class-G headphone amp delivers 100dB SNR at 6.5mW 2011-01-31
Texas Instruments's TLV320DAC3202 Class-G headphone amplifier integrates DAC and power rails to deliver audio playback quality and extend battery life in moderately priced phones and other portable CE  
Synchronous stepdown DC/DC controller touts precise conversion 2011-01-31
Linear Technology Corp.'s LTC3880/-1 allows for digital programming and read back for real-time control and monitoring of critical point-of-load converter functions  
Altera unveils 28nm device portfolio 2011-01-28
Altera Corp. has unveiled its portfolio of 28nm devices: the Cyclone V and Arria V FPGA families, the recently expanded Stratix V FPGA and previously announced HardCopy V ASIC families.  
Nujira to unveil second-gen handset test chip 2011-01-27
Nujira is announcing its second-generation handset test chip at Mobile World Congress (MWC) in Barcelona next month and the completion of an Envelope Tracking Processor IC for cellular network infrastructure  
USB-OTG bus port array brings 28V range VBUS protection 2011-01-27
Vishay's USB-OTG bus port protection array provides low typical capacitance of 0.7 pF and low maximum leakage current down to 0.085 microamps in compact LLP75-7L leadless package.  
Bluetooth chip tips <12.5mA peak currents 2011-01-26
Nordic Semiconductor's µBlue nRF8001 low power Bluetooth solution comes in a 5mm x 5mm 32-pin QFN package for space-constrained coin cell battery operated applications  
SDK makes designing with an embedded chip easy 2011-01-26
Arrow Electronics' BeMicro software development kit enables software developers and hardware engineers to evaluate Altera's Nios II embedded processor to simplify their embedded designs.  
Module offers flexibility for ATE design 2011-01-26
The 24-bit high-resolution dynamic signal acquisition module PCI-9527 features two 24-bit simultaneous sampling analog input channels with a sampling rate up to 432 Ksps.  
Rectifiers up solar cell junction box current density 2011-01-25
Vishay Intertechnology rolls four 45V TMBS trench MOS barrier Schottky rectifiers packaged in SMPC and axial-leaded packages that are aimed at solar bypass apps.  
Khronos offers APIs for mobile TV, audio software 2011-01-25
Khronos Group has launched OpenMax AL 1.1—a broad C language API for mobile systems, an extension to that API aimed at digital TV, and OpenSL ES 1.1—an audio API enabling features such as 3D sound  
Clare unveils 100V diode bridge chips 2011-01-25
Clare Inc. released its first 100V diode bridge chips, the CPC7556 and CPC7557, manufactured with Clare's high-voltage SOI technology.  
Ultrasound driver chipset aims at medical imaging apps 2011-01-25
Supertex Inc. unveils MD1715 and TC8020, an ultrasound driver chipset that generates a five level waveform for high resolution imaging in medical ultrasound applications  
Data converters offer support for ET and DPD solutions 2011-01-24
NXP Semiconductors' JESD204A-compliant data converters now play with Nujira's ET and DPD solutions  
ADCs, DACs offer wireless interoperability 2011-01-24
NXP Semiconductors's CGV series of data converters are now interoperable with Nujira's OpenET envelope tracking and digital pre-distortion solutions for 3G and 4G wireless infrastructure apps  
Sn whisker mitigation process ups reliability 2011-01-24
AEM Inc. introduces a hirel-qualified tin/lead conversion process for mitigating the formation of tin whiskers in surface-mount passive components  
LED analysis, wafer inspection tools launched 2011-01-24
KLA-Tencor debuts Klarity LED, ICOS WI-2220  
Modules mix efficiency, simplicity for power design 2011-01-24
National Semiconductor's new high output voltage power modules cut the need for an external inductor and ease complex layout placement challenges typical of switching regulator designs  
b>Spreadtrum announces 40nm low-power baseband chip 2011-01-24
Spreadtrum Communications has migrated to the Cadence Silicon Realization flow and taped out its first 40nm low-power chip, according to a Cadence Design Systems Inc.'s press release  

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