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Shunt protectors cut LED lighting failure rates 2011-02-21
Bourns' LSP series of open LED shunt protectors address the failure rates of early LED designs.  
LDO in HSNT-4(0808) package consumes 0.9µA 2011-02-21
Seiko Instruments' ultra-small LDO voltage regulator ICs enable high component density designs, improved power dissipation and thermal shutdown protection  
Mobile platform touts triple-mode LTE, 3D 2011-02-18
Renesas Electronics and Renesas Mobile announce the availability of the high performance 3D mobile platform, the MP5225. The new platform integrates Renesas Mobile's LTE triple mode-modem platform, the SP2531, with the SH-Mobile APE5R application processor.  
MIMO active array antenna unveiled for mobile broadband coverage 2011-02-18
Powerwave Technologies has introduced a new multiple-input multiple-output (MIMO) active array antenna which is expected to increase mobile broadband coverage up to 100 percent and reduce power consumption by 40 percent, helping network providers slash total operational costs  
Screw-terminal Al capacitors last 5,000hrs 2011-02-17
Vishay Intertechnology Inc.'s 104 PHL-ST screw-terminal power aluminum capacitors feature high capacitance/voltage combinations, including 6,800µF at 450V and 33,000µF at 200V, both in the large 90 x 220mm case size  
HSIC-compatible PHY IP delivers power, area savings 2011-02-17
The HSIC standard fully supports 480Mbit/s data transfer of the USB protocol. It eliminates 3.3 and 5V signaling, delivering huge silicon area and power savings in comparison to standard cable USB 2.0  
Kontron packet processor blade offers future proofing 2011-02-17
Kontron AG's AT8242 40GbE ATCA packet processor blade touts two OCTEON II cnMIPS64 multicore processors from Cavium Networks to manage complex networking functions.  
RFMD FEMs deal with high band count, harmonics 2011-02-17
RF Micro Devices Inc. expands its line of front end modules for 3G and 4G switch and signal conditioning applications  
Low-noise op amps reduce supply current to 1µA 2011-02-16
Maxim's MAX9636-MAX9638 rail-to-rail, low-noise operational amplifiers target interfacing to high-impedance sources such as photodiode and piezoelectric sensors  
3G chip combines UMTS, China's TD-SCDMA 2011-02-16
Marvell's world phone platform based on its PXA978 communications processor with HSPA modem features 3G UMTS and China's TD-SCDMA.  
New PCB inspection tech comes to market 2011-02-16
Christopher Associates introduces the Machvision Hole Doctor - II, an inline, conveyorized PCB inspection technology.  
2.5GHz/core Snapdragon claims integrates GPU, LTE 2011-02-16
Qualcomm's next mobile processor architecture for the Snapdragon family will be available in single-, dual- and quad-core versions and include an Adreno GPU and integrated multimode LTE modem  
Silicon die integrates Wi-Fi, Bluetooth 2011-02-16
Atheros's XSPAN AR9462 combo solution integrates 2-stream, dual-band 802.11n and Bluetooth 4.0 technologies onto a single die.  
TI Tx/Rx processors tip DPD tech base stations 2011-02-15
Texas Instruments's GC533x family of transmit/receive processors features two turn-key processors that provide a flexible digital transmit and receive solution for wide-bandwidth and multiantenna wireless base stations at a fraction of the cost of high-gate-count FPGAs  
Integrated CMF, ESD protection IC saves 50% PCB space 2011-02-15
STMicro's ECMF02 and ECMF04 ICs that use the company's IPAD technology to combine the common-mode filtering and ESD protection designed to protect high-speed data lines.  
Power amp aimed for small-cell base stations 2011-02-15
Anadigics Inc. introduces the AWB7227 power amplifier (PA) that promises high linearity and efficiency for use in small-cell base stations  
PFC LED driver IC designed for space-constrained apps 2011-02-15
iWatt debuts its first power-factor-corrected (PFC) LED driver IC with primary-side-regulated, leading- and trailing-edge-dimmable, AC/DC Digital PWM Controller  
SymTA/S 2.4 scheduling analysis tool targets car design 2011-02-15
Symtavision is set to release the new version of its SymTA/S 2.4 scheduling analysis and optimization tool suite at Embedded World 2011.  
MIMO Wi-Fi SoC offers beamforming, Bluetooth 4.0 2011-02-15
Marvell's Avastar 88W8797 SoC is an 802.11n 2x2 dual-band Wi-Fi solution touting Wi-Fi Tx beamforming technology, Bluetooth 4.0 low energy capabilities and FM Tx/Rx for smart phones and tablets  
Data interface software solutions updated for Windows 2011-02-14
DDC offers support on all popular versions of Windows including 32/64bit Windows Vista and 32/64bit Windows 7 to its line of AceXtreme MIL-STD-1553 and ARINC 429 hardware and software packages.  
Broadcom chip brings Android, graphics to cheaper smart phones 2011-02-14
Broadcom's BCM21654 HSPA processor is a 3G baseband processor that integrates an ARM Cortex A9 processor with high-end 3D graphics support and advanced processing for mass-market Android handsets  
Power MOSFETs gain 2% efficiency 2011-02-14
International Rectifier's IRF6811 and IRF6894 power MOSFETs reduce RDS (on) and gate charge compared to previous-generation devices, and offer ultra-low gate resistance  
Hybrid amplifiers target CATV infrastructure systems 2011-02-14
Anadigics' SOT115J hybrid CATV amplifier package consists of a Class A, balanced, highly linear GaAs amplifier, providing high gain, low noise figure, and low distortion.  
PCI/104-Express SBC embeds for rugged apps 2011-02-14
Advanced Digital Logic's ADLD25PC single board computer is designed for applications in harsh environments including transportation, military and aerospace  
FPGAs aimed at 100G wireline applications 2011-02-14
Altera Corp. has completed interoperability tests between its Stratix IV GT FPGA and MoSys' Bandwidth Engine device in a serial memory application, providing designers of 100G wireline applications with a high-bandwidth memory solution.  
LTE triple-mode modem platform supports all major OS 2011-02-14
Renesas Mobile debuts the SP2531, an LTE triple-mode modem platform that offers extensive support for major mobile OS including Android, MeeGo and Symbian as well as Linux and Windows Mobile on PCs  
DPI processor offers 40Gbit/s wirespeed performance 2011-02-14
Cavium Networks' single chip NITROX DPI II processor family works with the company's TurboDPI software to enable inline and coprocessor solutions for enterprise, wired and wireless networks  
Module automates impedance matching 2011-02-14
AWR Corp. unveils an automated impedance matching module, iMatch that is a submodule of iFilter and works with the company's Microwave Office design platform  
ClearPad provides thinner, multitouch experience to mobile users 2011-02-14
ClearPad Series 4 combines the ClearPad multitouch technology and the display driver into a single-chip solution for advanced display noise management and excellent capacitive sensing performance  
LeCroy oscilloscope tips 4GHz bandwidth 2011-02-14
LeCroy Corp.'s WaveRunner 6 Zi oscilloscopes provide offset and timebase delay adjustment to allow signal and amplifier performance assessment and zooming on vertical and horizontal signal characteristics.  

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