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Reference for module pinouts respond to user inputs 2014-04-11
Opal Kelly's interactive reference tool, 'Pins', is presented in a table form, which users can customise for easier navigation and project definition.  
Qualcomm completes 64bit lineup with Snapdragon 810, 808 2014-04-10
Both Snapdragon processors integrate Qualcomm Technologies' Cat 6 LTE Advanced multimode modem. The chips are designed in 20nm technology node, optimised for low power consumption in premium mobile computing devices.  
Freescale expands Kinetis with $0.79 MCUs 2014-04-10
The Kinetis MCU expansion is complemented with a development support including an SDK and Arduino-based development platform to help accelerate design and improve productivity.  
LTE small cell processors boast AKM's latest RF transceiver 2014-04-10
AKM's RF transceiver products claim to enable LTE small cell makers to offer mobile operators with industry-leading performance within the low power budgets they require.  
TI unveils low-power MCUs in compact package 2014-04-09
Developers can design smaller products with TI's FRAM-based MSP430FR5738 and Flash-based MSP430F51x2 MCUs in wafer-level chip scale packages (WLCSP) as small as 2.0 x 2.2 x 0.3mm.  
Resistors cover a versatile range for test systems 2014-04-07
Pickering Interfaces has released an addition to its family of PCI and PXI programmable resistors, allowing engineers to choose the most appropriate platform for their systems  
Wearable RH/T sensors track ambient conditions 2014-04-07
While temperature sensors placed directly on the skin may influence the reading accuracy, Sensirion introduces a sensor fusion tech that estimates the temperature gain to allow for compensation.  
Econais integrates Wi-Fi into a compact form factor 2014-04-04
Measuring 14x16x2.8mm, the module integrates MCU, Wi-Fi, cloud connectivity, flash and antenna that is fully certified to FCC, EC, IC, and TELEC  
Gpixel endows CMOS image sensor with 150Mpx res 2014-04-03
The sensor was developed using TowerJazz's TS18IS manufacturing technology, enabling scaling to 167.6mmx30.1mm die size.  
5G Wi-Fi SoC locates indoor position 2014-04-02
The Wi-Fi chip from Broadcom is equipped with AccuLocate technology that employs fine timing measurement (FTM), enabling precise indoor positioning regardless of environmental factors  
Programmable chip safeguards embedded systems 2014-04-02
Infineon's hardware-based OPTIGA chip provides encrypted communications capability, as well as a full range of security functions including authentication and access control management  
SRAM boasts transaction rate of 2132 million per second 2014-04-02
Cypress' QDR-IV SRAM delivers the random transaction rate required for performing several functions stored in the memory, enabling higher bandwidth and higher quality video streams.  
Microchip delivers 8bit PIC MCU family 2014-04-01
The 11-member PIC16F170X/171X family of MCUs integrate two Op Amps to drive analogue control loops, sensor amplification and basic signal conditioning  
Marvell bares LED controller for smart wireless light bulbs 2014-04-01
Marvell's 88EM8189 chip offers I2C compatible digital interface integration, low standby power and compatibility to phase cut dimmers.  
RFID sensor tag operates at wide temperature ranges 2014-03-31
The battery-free RFID sensor tag from Farsens is equipped with a thermistor that features an extended temperature range from -30℃ to 300℃ with an accuracy of ±3℃  
Platform secures wireless M2M for industrial wireless comms 2014-03-31
FreeWave Technologies' WavePoint platform supports any network infrastructure, enabling remote video access, multiple Ethernet and allows serial devices to run simultaneously.  
PXI multiplexer features hot, cold switching up to 10A 2014-03-31
The power multiplexer from Pickering Interfaces uses high quality high power electromechanical relays and user signals are carried on 20 way GMCT connectors.  
dotLEDs feature the smallest profile fit for wearables 2014-03-28
The dotLEDs from Plessey come in the standard 1005 size, with a 0.2mg weight and 0.2mm profile, and are manufactured with the company's proprietary GaN-on-Si technology.  
Cree breaks through LED efficacy barrier at 303LPW 2014-03-28
The landmark achievement bests Cree's previous 276LPW, and is said to enable cost-effective lighting solutions.  
WCDMA baseband addresses low-end smartphone market 2014-03-28
The WCDMA baseband SoC from RDA is based on a 1GHz ARM Cortex A5 processor, and integrates several components including RF transceiver, WCDMA modem and EDGE modem  
Film capacitors from AVX geared for DC filtering 2014-03-28
Available in large case sizes up to 35L, the FFLC Series capacitors exhibit higher specific energy than equivalent solutions (up to 240J/l) and feature AVX's controlled self-healing technology.  
Lean NPI solution automates PCB design and manufacturing 2014-03-27
The Mentor Graphics Valor NPI software product helps NPI engineers prepare and validate product models according to the manufacturer's rule-set in the engineer's native design tool.  
TI expands math libraries for low-power MCUs 2014-03-27
While maintaining low power consumption, MSPMATHLIB and IQmathLib provide developers with as much as 100 times performance improvements.  
T-bone enables board for 3D printing 2014-03-26
The T-bone, which utilises an Cortex A8 microcontroller, allows expanded usage of the host's, BeagleBone, resources by offloading the complex motion control processing functions  
7mm SED auto-deletes data on system breach 2014-03-26
The SED from Toshiba Electronics Europe has secured a validation to the U.S. Federal Information Processing Standard, enabling tamper-evident labelling for data security management  
MIPS chips venture into smartwatches 2014-03-26
Imagination Technologies seizes an opportunity that has been opened alongside the growing popularity of smartwatches, of which none are yet MIPS-based  
ST, SoftAtHome bring cinema experience to STBs 2014-03-24
The combination of technologies from STMicroelectronics and SoftAtHome enables operators to benefit from a high efficiency video coding for HD eligibility extension  
Gen II transmitter provides dual 1310nm deployment option 2014-03-21
EMCORE's 2804 Generation II 1310 nm transmitter is designed for small and independent CATV operators.  
Capacitors feature up to 125oC capacitance stability 2014-03-21
The high voltage capacitors from KEMET also boast flex performance via the flexible termination technology, reducing the transfer of board stress to the capacitors  
MEI develops advanced metal lift-off system 2014-03-21
The FluidJet metal lift-off system comes with no metal re-deposition on either the front side or the back side of the wafer, reducing device damage  


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