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Audio CODECs tout improved voice control, audio capability 2014-09-22
The DA7322 and DA7323 from Dialog are geared for voice-centric applications found in the latest generation of tablets, wearables, webcam accessories and in-vehicle entertainment  
XP Power boasts highest power density 60W AC-DC supply 2014-09-22
The ECE60 series is available in either PCB mount, chassis mounted with screw terminals, or in a DIN rail mount configuration  
Low-profile antenna suits covert applications 2014-09-22
U.S. Patent Number 8810474, titled "Antenna with High K Backing Material," features an API-designed topology designed to boost antenna performance.  
100nF silicon capacitors aimed at ultra-broadband systems 2014-09-22
The UBSC capacitor series from IPDiA is intended for DC blocking, feedback, coupling and bypassing applications in all broadband optoelectronics and high speed data systems  
Passive sol'n allows NFC interaction with electronic devices 2014-09-19
The NXP NTAG I2C solution combines a contactless NFC interface with a contact I2C interface and on-board non-volatile memory to enable advanced device pairing and personalisation of electronic devices  
MediaTek bares first 2T2R 802.11n Wi-Fi AP SoC 2014-09-18
The new SoC from MediaTek enables high data transmission rates for voice and video applications in smart homes while consuming the least amount of power  
Synopsys D-PHY slashes PCB area, power consumption by half 2014-09-18
The solution boasts being the first D-PHY that is compliant to the MIPI Alliance D-PHY v1.2 specification, enabling operation speeds up to 2.5Gbit/s per lane.  
Bionic ear promises to deliver remarkable sound experience 2014-09-18
The bionic hearing module from AT&S, Soundchip and STMicroelectronics integrates various advanced electronics to enhance the on-the-go audio experience, including head-tracking and other sensing.  
Mobile DDR SDRAMs prolong battery lifetime in portables 2014-09-18
The solutions from Alliance Memory feature auto temperature compensated self-refresh (ATCSR) to cut power consumption in portable consumer electronics, medical equipment and networking devices.  
SerDes platform speeds deployment of 100G network chips 2014-09-18
The SerDes evaluation platform from Open-Silicon integrates a 28Gb/s SerDes quad macro, using PHY IP from Semtech, and meets the compliance needs of the CEI-28G-VSR, CEI-25-LR and CEI-28G-SR specifications  
SiP sol'n offers precision sensing in portable medical devices 2014-09-18
ON Semiconductor introduced Struix, a semi-customisable SiP solution for precision sensing and monitoring in various mobile medical electronics such as glucose monitors and heart rate monitors.  
Clock multiplier, jitter attenuator ICs target comms apps 2014-09-17
The ZL30252 and ZL30253 from Microsemi give communication equipment customers a timing solution that meets industry-leading jitter performance imposed by the latest 100Gb/s PHY devices.  
WiFi chipset enables multi-device control 2014-09-17
The PCIe-integrated CL2340 from Celeno Communications covers the 2.4GHz and 5GHz bands, and both 802.11n and 802.11ac, including 2x2, 3x3 chips as well as 4x4 dual band 11ac chips.  
100GbE gearbox PHYs aimed at enterprise, data centres 2014-09-17
The 28nm Broadcom BCM82792 PHY claims to be the first device to offer dual 100Gb/s ports on a single gearbox chip and doubles the density of existing solutions while reducing power usage by up to 30 per cent  
Switch chip delivers more throughput at 3.2Tbit/s 2014-09-17
A new breed of switches ulitises novel architecture in order to deliver more than twice of the current high-end switch's throughput as well as provide more programmability for the growing datacentres  
Toshiba rolls out 20Mpx CMOS image sensor for smartphones 2014-09-16
The T4KA7 employs high-speed circuit technology that delivers a frame rate of 22fps at full-resolution image capture  
Power management IC features 4MHz switching frequencies 2014-09-16
The chip from AMS also integrates DC-DC buck and boost converters, step-down controller and LDOs—power management building blocks required to power Li-ion battery-operated handheld devices.  
Sequans, USI team up to offer LTE modules for M2M, IoT apps 2014-09-16
The LTE module is powered by Sequans' latest LTE chipset, Colibri, which is optimised for the design of devices for the Internet of Things  
7.4um pixel image sensor targets industrial imaging apps 2014-09-15
The 8.6MP, APS-H optical format KAI-08670 image sensor from ON Semi is geared for industrial inspection, intelligent traffic and surveillance markets.  
Vision sensor kit offers high-speed part inspection, QA 2014-09-15
The Inspector I20 kit from RS Components is able to check parts in any orientation or position and reliably determine in real-time if objects pass or fail  
Sigma Designs unveils 4K HEVC STB chip 2014-09-15
The SMP8758 is designed for OEMs, STB manufacturers and service providers who want to efficiently deliver advanced UltraHD (4K) video services with a feature-rich yet cost-effective platform.  
RF antenna switch for smartphones offers LTE-A support 2014-09-12
With TI's TaRF6 process, MOSFETs customised for RF switch applications have been developed and used in the SP12T RF antenna switch IC, leading to a performance of 0.42dB in insertion loss  
LTE, carrier aggregation to benefit smartphones, tablets 2014-09-11
Qualcomm Technologies released a line-up of products and technologies aimed to drive high-performance computing and connectivity to entry-level and mainstream smartphones and tablets  
Synopsys modelling tool automates photonic IC designs 2014-09-11
The OptSim Circuit provides options for design setup, data visualisation, plotting and project resource management, accelerating the design of advanced optical telecommunication systems  
Hybrid satellite/terrestrial SoC broadcast devices for STBs 2014-09-11
Broadcom's family of devices also combines HEVC with the advanced modulation efficiencies of DVB-S2, DVB-T2, ISDB-T and ATSC, and high-performance IP connectivity with MoCA 2.0  
Network analyser supports uni/bidirectional measurements 2014-09-11
The R&S ZND allows users in RF component production to maintain high throughput while carrying out S parameter measurements on antennas and filters.  
Touchscreen MCU with face detection: No more dropped calls 2014-09-10
The Cypress TMA445A face detection feature prevents unintended touches from accidentally hanging up a call.  
Inertial-sensor chipset reduces power consumption 2014-09-10
The LSM6DS3 chipset will improve the development of battery-powered smart sensor systems to be embedded in mobile and wearable devices and innovative objects for the IoT  
Photorelays offered in industry's smallest package 2014-09-10
Toshiba revealed that the TLP3417, TLP3420, TLP3440 and TLP3475 are aimed at system solutions that include semiconductor testers, measurement equipment, probe cards and medical equipment.  
Frequency and timing reference module aimed at small cells 2014-09-10
The LTE-Lite from Jackson Labs provides GNSS time and frequency synchronisation for cost-sensitive network equipment such as LTE 4G applications and small cell products from micro cells to femto cells.  


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