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GNSS module tracks multiple constellations at once 2014-02-20
The multi-constellation module from Telit Wireless s Solutions has a low power processing core, delivering current optimised multi-constellation tracking.  
Altera optimises microwave backhaul at 5Gbit/s throughput 2014-02-20
The microwave backhaul modem IP from Escape is optimised for use on Altera Cyclone V, Arria V, and Arria V to meet the increasing bandwidth demands of 4G networks  
Red laser diode at 100mW outdoes He-Ne gas laser 2014-02-19
The Oclaro laser diode from The Optoelectronics Company delivers a 633nm beam and consumes power as low as 0.4W, designed as an alternative to He-Ne gas lasers.  
SDK adds Bluetooth Smart support for Arduino platform 2014-02-19
The Bluetooth Smart software development kit from Nordic for Arduino-based projects can be accessed as a GitHub repository.  
Carbon, FePt enhance device storage performance 2014-02-19
An A*STAR research examines the properties of iron–platinum (FePt) nanocrystals for use in ultra high-density magnetic recording media  
u-blox antenna module prompts quick GPS/QZSS solution 2014-02-19
The GPS/QZSS antenna module from u-blox integrates dual SAW filters, and targets security device applications.  
DSP audio tunnelling extends Android device battery life 2014-02-19
The DSP audio tunnelling in Android 4.4 is available with Nexus 5 phones in the DSP block, cutting audio processing power by up to 14X.  
Capacitive touch switches resist wear 2014-02-18
Noritake's touch switch features a flat glass surface with a metallic finish, and low impedance.  
Ultrasonic water metering chip consumes less power 2014-02-18
The chip includes 4-wire temperature connection that processes heat meter functions.  
Linear supercapacitor minimises charging time 2014-02-18
Programmed using a single resistor, the charger's input current is controlled over a range of 0.5A to 3A  
Althen sensors measure contactless torque 2014-02-18
The contactless technology is based on piezoelectric ceramic comb structures mounted on the transmitter's shaft, and transmits signals via a radio signal coupling.  
GAn-on-SiC based HEMT pushes power at 150W 2014-02-17
Using wafer fabrication processes, the HEMTs provide gain, efficiency, bandwidth and ruggedness over several bandwidth ranges.  
Altium adds support for Rosenberger connectors 2014-02-17
Altium expands support for its range of PCB component libraries, which now covers Rosenberger connectors  
Smart TV SoC supports 4K content 2014-02-17
Realtek teamed up with UMC and Synopsys to design a smart TV SoC in the 40nm process that addresses the issue of large pixels found in super-sized displays  
LTE protocol stack reduces third party requirements 2014-02-13
ALPS-Lite is NextG-Com's answer to alleviate the high cost and high footprint requirements of the standard LTE device, according to CEO Denis Bidinost  
EVG outs high-volume-mfg photoresist processing system 2014-02-13
The EVG150XT is optimized for ultra-high throughput and productivity and is aimed at logic and memory high-volume manufacturing.  
150W PSU offered in stackable PCI/104-Express form factor 2014-02-12
ADL Embedded Solutions' ADLPS104ISO-150 is designed to meet the needs of high-powered Intel Core industrial and embedded motherboards by providing robust ATX voltages  
Imperas adds support for Imagination's MIPS cores 2014-02-11
QuantumLeap leverages Imperas' synchronization algorithm to provide the fastest virtual platform software execution speed on standard, multi-core PC host machines, claimed the firm.  
300W electronic load touts 0-15A, 0-500V input rating 2014-02-11
The EL9712B from Intepro Systems 300W electronic load that the company said is intended for R&D, inspection, service and test requirements in industry, research laboratories, training centres and education.  
Sensirion offers micro-scale liquid flow sensors 2014-02-11
The liquid flow series LPP10 and LPG10 are based on planar microfluidic substrates and are available with a glass (LPG10) or a plastic (LPP10) packaging  
Samsung underscores Isocell image sensor benefits 2014-02-10
The Isocell technology puts a reflective light barrier between adjacent cells, which serves to increase light sensitivity while reducing crosstalk between neighbor pixels.  
Dev't board features 100V eGaN FETs with 35A max output 2014-02-10
The EPC9013 boasts a parallel configuration and can be operated as a buck, boost or bidirectional, as well as a half bridge for motor drives and isolated converter applications  
Advantest announces DDR4 memory tester 2014-02-10
The T5503HS reaches test data rates up to 4.5Gb/s, which should be enough to handle the maximum operating frequencies of modern DDR SDRAM memory chips, specified for 4,266Gb/s  
Software defined radio (SDR) platforms support up to 6GHz 2014-02-07
The platforms from Ettus Research combine two RF transceivers covering DC-6GHz with up to 120MHz bandwidth through modular daughter cards and a large user-programmable Kintex-7 FPGA.  
Cree debuts self-programming wireless lighting-controls 2014-02-06
Touted by the firm as the industry's first self-programming wireless lighting-control system, it claims to cut energy use by more than 70 percent for half the cost of traditional lighting controls  
Fujitsu, Furukawa unleash multi-fiber optical connector 2014-02-05
The connector can accommodate different lengths of optical fiber with a spring mechanism that removes the need for a polishing process, nearly halving the cost required to connect optical fibers  
Adhesive film boasts extreme temperature capabilities 2014-02-05
Rogers' COOLSPAN thermally and electrically conductive, thermosetting, silver filled adhesive film is used to bond circuit boards to heavy metal backplanes, heat sink coins and RF module housings.  
Intercept, Moss Bay EDA reveal low-cost EMC sol'n 2014-02-04
The software solution pairs the EMSAT post-layout EMC and SI design rule checkers with a customized Pantheon EMSAT Viewer that displays each violation on the board in real-time.  
20Gb/s interconnect devices target data centre apps 2014-02-04
IDT's RapidIO switches and bridges offer 100ns latency, energy efficiency and multi-processor scalability, promising advanced performance in data center and supercomputing analytics applications  
Toshiba touts photorelays in industry's smallest package 2014-02-04
Compared to equivalent Toshiba products in a USOP package, the TLP3403 and TLP3412 photorelays reduce the assembly area by half and volume by 60 percent.  

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