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Machine builders beef up servo motors with direct-drive torque 2013-04-11
Manufacturers of conventional servo motors are adding direct-drive torque motor modules to their product range so as not to lose customers to other suppliers  
IHS: 2013 global PV installations to top 35GW 2013-04-11
IHS reaffirmed its earlier prediction that global PV installations surpassed 30GW in 2012, with final analysis showing that installations, in fact, grew 14 per cent to reach 31.4GW last year.  
Task robot development flourishing in Asia 2013-04-11
Consumer robotics market will reach $6.5 billion by 2017 while more complex personal robots trudge ahead, according to ABI Research.  
SEMI: Foundry, memory to steer ASEAN IC growth 2013-04-11
Two sectors that rake in majority of large-scale investments in Southeast Asia are foundries and memory firms, according to trade association SEMI  
ARM, Cadence to advance IP, design automation 2013-04-10
The firms will implement the industry's first Cortex-A57 64bit processor on TSMC's 16nm FinFET process.  
Gigaphoton's opens Singapore branch, plans direct engagement 2013-04-10
With its newly opened branch, the company aims to aggressively promote new business opportunities to find potential customers in Singapore by cooperating with lithography system manufacturers.  
TI-powered Moonshot in the works, says HP 2013-04-10
Texas Instruments joined several ARM and x86 vendors that eventually will find a place aboard HP's Project Moonshot systems, which currently ships only with Intel Atom SoCs.  
MEMS drives gas sensors market for industrial apps in APAC 2013-04-10
According to Frost & Sullivan, the growth will continue as the increasing use of integrated smart sensor systems will require equipment changes and upgrades  
Plessey begins production of GaN-on-silicon LEDs 2013-04-10
Plessey Semiconductor has begun sampling LEDs made on GaN) on silicon wafers with a light output of just 2 lumens intended for indicator lamps and back-lighting applications  
Tech giants to develop open source code for SDNs 2013-04-10
A consortium of large communications and software giants to provide open source code for software defined networks  
Social media bolsters ASEAN growth of Wi-Fi ready cameras 2013-04-10
Digital still cameras with Wi-Fi capabilities gaining ground in Southeast Asia, making up nearly one in five sold, according to GfK Asia.  
Smartphone boom may limit growth for EMS, ODM 2013-04-09
The reason behind this forecast is that mobile communications brands increasingly opt to manufacture smartphones on their own, dragging growth opportunities for outsourced manufacturers.  
SanDisk will only switch to EUV for ReRAM 2013-04-09
The storage memory supplier does not expect to use extreme ultraviolet lithography for its current NAND process.  
IBM partners with Malaysian firm on cloud sol'ns 2013-04-09
As an IBM business partner, ECS will provide the necessary technical support for small to mid-sized enterprises that are moving into cloud services for their computing needs.  
Weightless SIG releases IoT over white space specification 2013-04-09
Ultra low cost terminal hardware and license free frequency spectrum promises ground breaking cost savings comparable with PAN technologies such as Bluetooth.  
Peratech, CPI team up for reel to reel QTC print 2013-04-08
Peratech is working on new ink formulations with CPI to enable QTC sensors and switches to be printed using industry standard processes for printed electronics.  
Electro-static discharge design best practices released 2013-04-08
Silicon Integration Initiative said the document provides comprehensive guidelines for incorporating ESD protection into IC design flows.  
Analyst: Vendor proprietary ASICs lead metrocell baseband SoCs 2013-04-08
Vendor proprietary ASIC solutions attract top market share because vendors such as Huawei, Ericsson, and Samsung all are using ASICs in their designs, particularly in their picocell and microcell products.  
Silicon Labs gets ZigBee IP golden unit certification 2013-04-08
The Ember ZigBee solutions meet the ZigBee Alliance specification for end-to-end IPv6-based wireless mesh networking.  
Seasonal slump still haunts NAND flash markets 2013-04-08
Chip contract prices for 64Gb and 128Gb MLC and TLC remained flat, whereas those for the 32Gb MLC and TLC products increased by approximately 6-7 per cent.  
Cisco to acquire femtocell maker Ubiquisys 2013-04-05
The acquisition of Ubiquisys reinforces Cisco's commitment to service providers and strengthens its mobility expertise to deliver more intelligent mobile Internet networks  
China-based fabless firm chases non-Apple market 2013-04-05
One of China's oldest fabless chip suppliers, Actions Semiconductors, is often seen as a shrinking player in the diminishing MP3 player market. But under new management, it has proven its resilience  
TSMC to kickstart 20nm line ahead of schedule 2013-04-05
TSMC is reportedly poised to start installing equipment for 20nm production at its fab in Tainan, Taiwan, on April 20 enabling it to begin volume production at the end of the second quarter  
Analyst: Three out of top 10 chip vendors profited in 2012 2013-04-05
Qualcomm, Broadcom and Samsung are the only three of the top 10 chip sellers that were able to grow sales in 2012, according to Gartner  
High demand for Samsung phones tighten eMCP/CI-MCP supplies 2013-04-05
The large demand for the Korean giant's smartphones is expected to create a negative impact on various Chinese manufacturers' shipments as eMCP supplies become more constrained.  
Lime enlists Interlligent to meet T&M equipment needs 2013-04-05
Lime Microsystems has closed a deal with Interlligent RF & MW Solutions to use their latest test and measurement technology in developing its field programmable RF transceiver ICs.  
40nm process geometries take a quarter of global wafer capacity 2013-04-05
IC Insights' report reveals that a huge share of the worldwide wafer capacity still remains dedicated to mature processes with "large" features sizes  
Accellera launches EDA, IP interoperability standardisation 2013-04-04
The company formed a multi-language working group to create a standard and functional reference for interoperability of multi-language verification environments and components  
Screen protector for mobile devices yields 3D content 2013-04-04
A nano-engineered plastic film created by A*STAR IMRE and Temasek Polytechnic turns ordinary screens of mobile devices into 3D displays  
Hybrid Memory Cube Consortium to focus on faster DRAM 2013-04-04
Micron, Samsung, Hynix are among over 100 companies releasing a specification for a 3D DRAM and logic module known as the Hybrid Memory Cube.  


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