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Will smartphones follow PC's footsteps? 2015-07-01
Sadly, the days of massive improvements in features in a new phone are over. The reality is that phone features are about capped out. Moreover, everything Apple can do, Android does too  
CEA-Leti realigns research focus: FD-SOI takes centre stage 2015-06-30
Leti, equipped with 200nm and 300nm wafer fabs, pioneered in its labs one of the key technologies in manufacturing SOI wafers, transferred it to Soitec, and worked with ST in chips based on FD-SOI  
What chips are inside Apple Watch? 2015-06-30
The good news for the winners of the design slots—STMicroelectronics, NXP, AMS, Dialog Semiconductor—is that Yole reckons the wearable electronic equipment will grow steadily  
Conductive ink on textiles yields stretchable electronics 2015-06-30
University of Tokyo researchers said the discovery will enable electronic apparel such as sportswear incorporating sensing devices for measuring biological indicators such as heart rate and muscle contraction  
9 out of 10 households to have Wi-Fi by 2019 2015-06-29
The proliferation of connected devices runs parallel to heavy ISP infrastructure investments designed to provide higher bandwidth speed and the budget to market it to subscribers and prospects  
ISSI endorses Uphill over Cypress 2015-06-29
The ISSI Board of Directors has recommended to its stockholders to vote for the adoption of the Uphill Agreement after Cypress failed to beat Uphill's offer of $23 per share  
Altair rolls low-power 4G chip aimed at wearables, IoT 2015-06-29
The FourGee-1150/6401 is a low-cost LTE Category-0 chipset featuring downlink speeds of up to 1Mb/s and claims to halve the connectivity cost of the standard LTE technologies being used today  
ARM, Synopsys team up with UMC for 14nm FinFET process 2015-06-29
UMC demonstrated favourable 128MB SRAM yields on its 14nm FinFET process and will skip the 20nm technology node to catch up with competitors such as Samsung and TSMC.  
OSATS: Wafer-level packaging limitations hard to dismiss 2015-06-29
The recent SEMI Packaging Tech Seminar focused on the need, in terms of under yield and packaging cost pressures, to move from fan-out wafer-level-packaging to fan-out panel-level-packaging  
SMIC, Huawei, Qualcomm, Imec sign 14nm joint venture 2015-06-26
SMIC hopes the deal will enable it to have its home-grown 14nm process in production in an SMIC fab by 2020, which is said to still have problems even with its 28nm process.  
Nanowires afford LEDs better light, energy-savings 2015-06-26
Denmark's Niels Bohr Institute researchers studied nanowires using X-ray microscopy and were able to pinpoint exactly how the nanowire should be designed to give the best properties.  
Virtual reality market to approach $16B in 2020 2015-06-26
The virtual reality technology plays a crucial role in many applications such as gaming, entertainment, aerospace and defence, industrial, medical, retail and marketing, education and others.  
Cloud-RAN using small cells tops distributed antenna system 2015-06-26
With C-RAN, the baseband processing is centralised, allowing multiple access points to act as a single continuous cell rather than as an array of competing cells  
What are the advantages of using USB Type-C 2015-06-26
Using the USB Type-C allows manufacturers to deliver power, data and display over a single connector, cable and port. It is good for over 100W, high-speed data and a 4K display  
Freescale-NXP sees potential in secure IoT MCUs 2015-06-26
The NXP CEO hopes to combine its security expertise and success in automotive infotainment with Freescale's broad MCU portfolio to create a range of chips for connected devices  
16GT/s PCIe may not be ready until early 2017 2015-06-25
Developers in the PCI SIG hope to complete a 0.7 version of the spec by the end of the year, at which stage they expect no major changes to the technology  
Atmel marks spot in IoT space 2015-06-25
Atmel's place in the IoT universe is in wireless routers/smartphones and customised gateways. Atmel is not present in the enterprise IoT space where databases and servers play critical roles.  
3 key lessons in IoT security 2015-06-24
With the number of IoT devices expanding, it's increasingly important that we understand how we are being protected by the IoT vendors. Transparency is not only a necessity but also a requirement  
Scalable production of low-temperature 2D MoS2 films 2015-06-24
Researchers at the University of Southampton's Zepler Institute characterised large-area 2D films of molybdenum disulphide at room temperature using a process that is scalable to any size wafer  
AMD rebuffs planned breakup 2015-06-24
The Reuters news service reported that AMD was mulling whether to split up the company, citing unnamed sources, saying AMD had engaged a consulting firm to help it review such options.  
TV brands to increase dependence on Chinese OEMs 2015-06-24
IHS revealed that TVs made by outsourcing specialists are predicted to approach an industry record of 43 per cent of LCD TVs shipped globally this year  
IR camera shipments predicted to log 22% CAGR through 2020 2015-06-23
Yole forecasted that annual shipments of thermal cameras are will reach more than 1.5 million units in 2020, compared to more than 450,000 units in 2014  
What's inside 1Xnm planar NAND? 2015-06-23
Double patterning has become mandatory for making the 16nm node NAND flash and the memory makers use a self-aligned double patterning for the active, control gate, floating gate and bitline patterning.  
InVisage opens sensor manufacturing site in Taiwan 2015-06-23
InVisage said its QuantumFilm technology would be introduced later this year and that it is joining forces with TSMC for wafer manufacturing and with VisEra Technologies for colour filter deposition.  
IBM highlights III-V FinFETs on silicon substrate 2015-06-23
A method similar to Imec's, IBM's process begins vertically then coaxes the InGaAs to turn horizontal and inward, eliminating lattice mismatch defects it was making in the vertical column growth pattern.  
KAIST team creates first flexible phase-change RAM 2015-06-23
The research team developed a low-power non-volatile PRAM for flexible and wearable memories enabled by self-assembled BCP silica nanostructures and self-structured conductive filament nanoheater.  
Keysight Technologies to buy Anite for $606M 2015-06-22
Besides numerous new product announcements and product upgrades, this acquisition was sudden, but not unexpected. Keysight and Anite have been in partnership for a while and house exquisite synergy.  
SSD standard preps for much-awaited update 2015-06-22
As flash becomes more pervasive in data centres, vendors are diversifying their SSD offerings, in part to address different workloads, which JEDEC described in full detail  
Google uncloaks SDN for data centre networks 2015-06-22
Showing support for the emerging approach, systems giants from Brocade to ZTE participated in software-defined networks demos for carriers, data centres and enterprises  
Google plots better urban living to its agenda 2015-06-19
Google has launched Sidewalk Labs that will help lay the foundation for real-time oversight of civic activities and resources through sensors, software and ubiquitous connectivity  


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