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IBM tops patent list, Asian firms dominate 2013-01-14
A U.S. patent research firm reports that IBM once again received the most number of utility patents in 2012 while Asian companies like TSMC experienced double digit percentage growth  
Reprogrammable memory arrays on flexible substrate 2013-01-14
The MOMA consortium has recently announced the development of the largest reprogrammable non-volatile memory arrays which will be made on flexible substrates  
Broadcom points to Gb wireless as CES 2013 star 2013-01-14
Broadcom CTO Henry Samueli identified Ultra HDTV, gigabit wireless and "Wi-Fi in everything" as three key trends in this year's CES.  
Broadcom licenses ARMv7, ARMv8 architectures 2013-01-14
The ARMv8 architecture is the first ARM architecture that includes 64bit execution, enabling processors based on the architecture to combine 64bit and 32bit execution  
Analyst: China's polysilicon price on steady climb 2013-01-14
EnergyTrend revealed that polysilicon and mono-Si wafer prices are continuing on an uptrend as talks regarding China's double anti-policy in February grow more widespread.  
Motion control market to rebound in 2013 2013-01-14
IMS Research forecasted that the global motion control market will grow nearly five per cent despite the 1.9 per cent contraction last year  
Recessed chassis for EMCs provide added protection 2013-01-11
Pixus Technologies' new enclosure allows the subrack and boards to be completely protected inside the enclosure frame, preventing damage to the modules and reducing its susceptibility to EMI/RFI  
LTE network adoption to reach 1.6B in 2017 2013-01-11
Explosive growth in the last quarter helped to make 2012 a breakthrough year for LTE services as connections in the dominant markets of South Korea, the USA and Japan rocketed  
Opinion: Smart TV not living up to its potential 2013-01-11
EE Times' Junko Yoshida analyses how major manufacturers like LG, Samsung and Panasonic scramble to redefine smart TV.  
Digi-Key inks agreement with GeneSiC 2013-01-11
The distribution agreement enhances GeneSiC Semiconductor's ability to seed the market with its brand of Silicon Carbide High Voltage, High Temperature products  
Panasonic banks on 'eco-related' technology 2013-01-11
Panasonic President Kazuhiro Tsuga looks to green technology in a bid to return the consumer electronics company to profitability  
PV makers to suffer from consolidation rounds this year 2013-01-11
The total number of solar panel makers is set to fall to 150 in 2013, down from about 500 last year, leading to a 70 per cent market plunge this year, said IHS  
Hydrogen fuel cells hampered by high costs, says report 2013-01-11
The "hydrogen economy" remains a pipe dream with hydrogen fuel cells turning a modest $3 billion market of about 5.9 GW in 2030  
Sharp says bigger is the only way to go 2013-01-11
Sharp Electronics said the Japanese company's future would rest squarely on TV that are bigger and broader, with higher resolution  
ARM mulls RF IP for IoT 2013-01-11
CEO Warren East talks about what part ARM will play in making the "Internet of Things" a widespread success as well as the significant changes in the smart TV market  
AMD to churn out quad-x86 chips for tablet-notebooks 2013-01-10
Advanced Micro Devices has demonstrated applications and games running on a Kabini-based ultrathin notebook and on a Temash convertible tablet-notebook.  
Snapdragon powered by quad-core Krait sampled out 2013-01-10
The Snapdragon 600 and 800 are powered by quad-core Krait 300 and Krait 400 processors, respectively, enhanced implementations of its currently used ARM-compatible Krait processor  
Everspin exhibits ST-MRAM viability for SSD 2013-01-10
The reduced switching current and simplified circuitry of ST-MRAM enables it to support the write bandwidth required for DDR3 performance, according to Everspin Technologies  
Intel teams up with Plastic Logic for 'PaperTab 2013-01-10
Queens University has recently collaborated with Intel Labs and Plastic Logic to work on a flexible 10.7-inch tablet that features innovative controls.  
U.S. nuke lab pulls out switches due to Huawei roots 2013-01-10
Network switches manufactured by H3C Technologies found within the Los Alamos National Laboratory's system were replaced because of national security concerns  
Cisco, NXP joint venture advances connected car 2013-01-09
Cisco and NXP invested in Cohda Wireless to bring the Internet of Things to the automotive industry  
Ingenic arms tablet SoC with MIPS, imagination graphics 2013-01-09
Ingenic Semiconductor has debut a dual-core MIPS-based apps processor and plans to demonstrate it in a 10-inch Android tablet during the Consumer Electronics Show  
Nvidia showcases latest Tegra 4 processor 2013-01-09
Nvidia launched a quad-core Tegra 4 application processor based on the Cortex A15 as well as a hybrid mobile game player and streaming system  
Bosch enters consumer electronics MEMS space 2013-01-09
Bosch's BMA355 three-axis accelerometer is said to provide ultra-low-power performance while an integrated interrupt engine on the tiny device permits 12bit resolution in small devices  
Wi-Fi, WiGig Alliance to operate under one roof 2013-01-09
The Wi-Fi Alliance and WiGig Alliance have executed a memorandum of agreement outlining their plans to consolidate activity under one group  
Nvidia, Qualcomm take lead in apps processors 2013-01-09
According to reports from Strategy Analytics, Nvidia took the lead in the tablet market while Qualcomm lead in the smartphone space  
PV demand to shift from West to Asia this year 2013-01-08
TrendForce forecasts that while the ASP downhill trend is expected to continue into 2013, there will be a potential shift of PV demand from the West to the Far East  
Growth in Americas bolster chip sales 2013-01-08
The Semiconductor Industry Association reported that the strong growth in the Americas region have pushed the three month average of worldwide semiconductor sales to increase at above seasonal rates  
Nanoscale engineering to spawn 'universal memory' 2013-01-08
Nanometer-scale engineering of so-called phase-change materials could lead to non-volatile memories with fast read and write speed, high reliability and low power consumption  
Fabless firms continue winning streak over IDMs 2013-01-08
According to the forthcoming McClean Report 2013, revenues for fabless chip makers grew six percent in 2012 compared to a fall of four percent for so-called integrated device makers (IDMs  


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