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Samsung, Toshiba launch all-out 3D NAND production efforts 2014-05-21
Both companies are gearing up for the production of 3D NAND devices, with Samsung in China and Toshiba in Japan, in preparation for the market that is believed to take off in the second half of 2015  
Supercapacitor promises better batteries, faster EVs 2014-05-21
The supercapacitor utilises a graphene foam architecture based on ruthenium oxide. The foam electrode was found to work safely in aqueous electrolyte, and deliver two times more energy and power  
Bell Labs reverts to 'game-changing research' model 2014-05-21
Along with its return to basic research, it has "FutureX" projects targeted at solving a practical communications or information technology challenge in sectors including communications and datacentres.  
Mentor expands with electromagnetic simulation tech 2014-05-21
Mentor Graphics has acquired Nimbic, Inc.—a move that will enhance Mentor's ability to address enterprise-wide challenges for chip-package-board design  
Army places Thailand under martial law 2014-05-20
The Thai army made the surprise declaration reportedly unbeknownst to the government in an attempt to restore order in the country  
Dearth of host devices leaves UHS-II cards hanging 2014-05-20
The UHS-II bus interface introduces a new pin layout in memory cards, where second-row pins are added to support up to 312MB/s HD recording speeds. While UHS-II cards can be used like any other SD card since they are backwards compatible, not many devices can take advantage of the additional pins  
Micro pattern introduces colour reflective display 2014-05-20
The micro patterns are created by arranging glass beads in the same nano-structure as the opal, yielding photonic crystals that could the core material for a reflective display visible under sunlight  
Rohde & Schwarz becomes M2M Alliance member 2014-05-19
Rohde & Schwarz, a wireless technology test and measurement company, joined the M2M Alliance, underlining its commitment to machine to machine communications and the Internet of Things  
UL standardises certification for portable luminaires 2014-05-19
The certification programme includes samples and tests that combine the requirements of both North American and International Electrotechnical Commission standards  
Arduino Zero clears market path for IoT devices, wearables 2014-05-19
The 32bit development board features Atmel's SAMD21 MCU with 256kb of flash and 32kb SRAM in a TQFP package  
Silicon photonics oil the works for high-speed switching 2014-05-19
Optical components are integrated with multi-chip modules using packaging advancements with micro bumps and module substrates. The next target is to scale the technology in a cost-efficient approach  
IBM Research develops bone-strong, recyclable polymers 2014-05-19
The researchers employed a 'computational chemistry' hybrid approach or a combination of high performance computing and synthetic polymer chemistry to predict how the molecules will respond  
Engineers lacking in flash storage firms 2014-05-19
IHS reports that SSD shipments climbed 82 per cent last year. That increase—coupled with the 50 per cent rise IHS forecasts for this year—is fuelling an insatiable demand for even more talent  
Qualcomm, IBM innovate with the IoT 2014-05-19
The companies both introduced separate programmes geared towards the Internet of Things—Qualcomm with a portfolio of chips, and IBM Watson with a psycho-linguistic user profile capability  
ST finds FD-SOI partner in Samsung 2014-05-16
Samsung will work with ST's 28nm FD-SOI design platform, making its foundry services accessible to the broader semiconductor industry. The companies hope their partnership will encourage designers to adopt the process  
Coverity completes Kalistick acquisition 2014-05-16
By expanding the Coverity Development Testing Platform with the Kalistick solution, Coverity will help build tighter collaboration between development and QA teams  
APAC electronics production gets boost with added discretes 2014-05-16
More than 1,000 discrete products to full reel portfolio for electronics production in Asia Pacific have been added by element14  
Jedec to re-accept Rambus after 20-year hiatus 2014-05-15
Jedec memory standards group is poised to accept Rambus again in the alliance after it resolved lawsuits involving as many as 15 chipmakers that were also members  
SHDSL extends purpose with industrial apps 2014-05-15
Industrial applications such as infotainment systems, surveillance cameras, Wi-Fi hotspots, and vending machines can use the combination of broadband and power over existing copper using SHDSL  
Are consumers spending too much on Google Glass? 2014-05-15
A teardown by IHS has revealed that Google Glass' total manufacturing cost is just 10% of its hefty selling price of $1,500. The bulk of the cost comes from non-material expenses such as non-recurring engineering and extensive software and platform development  
Power supply standards: Which way forward? 2014-05-15
Test-systems based on 380V DC have been running for many years now in applications across the globe. They have confirmed savings in both energy consumption and cost  
Start-up arises from VTT MEMS-based tech 2014-05-15
Fabry-Perot interferometers consist of two parallel Bragg reflectors whose spacing can be modulated to tune the transmission peak at selected frequencies of interest  
Electric Imp sets connectivity sights beyond Wi-Fi 2014-05-15
An IoT start-up founded by Apple, Google, and Facebook engineers is preparing for a leap beyond its current base in Wi-Fi and consumer products  
Smartphone cam generates quantum random number 2014-05-14
In the random number generator setup: a camera is fully illuminated by a LED. The pixel values are linked and passed through a randomness extractor, which outputs quantum random numbers  
Intel sets sights on a foundry goal for innovation 2014-05-14
The chip giant has been raising the profile of its foundry business over the last year, mainly in pursuit of growth and profit. It has also expanded its deal with Altera to produce multi-die devices  
Fairchild races to the low power segment of MEMS 2014-05-14
With a product line-up that will integrate Xsens' algorithms, Fairchild's all set for the MEMS market with a singular focus to establish itself where low power, accuracy, and support are important  
SanDisk, Toshiba inch closer to 3D NAND with 15nm 2014-05-14
The 15nm technology replaces the previous 19nm and provides a transitional step to 3D NAND. It scales chips along both axes and will be deployed across SanDisk products including enterprise SSDs  
Sensor chipsets mfg costs same across various vendors 2014-05-14
ST, Bosch Sensortec and InvenSense are taking very different routes yet spending roughly the same amount to produce nine-axis inertial measurement units, according to System Plus Consulting  
Serial interfaces beat a path to 56Gbit/s 2014-05-14
The Optical Internetworking Forum will work on four flavours of 56G, including a spec covering half a meter of board traces and a connector, a chip-to-module project, and two short-reach proposals  
Apple's Beats buy signals bolstered wearables push 2014-05-14
The potential acquisition, said to be worth $3.2 billion, is indicative of how Apple is likely to do a lot more with headsets and wearables, possibly around health, according to Analysys Mason  


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