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Elektrobit changes name to Bittium 2015-07-03
The sale of Elektrobit's automotive business to supplier Continental was closed on July 1, 2015, which paid about $665.06 million for the subsidiary headquartered in Erlangen (Germany  
French company weaves RFID chips, antennas into yarn 2015-07-03
Primo1D, a spinoff of the CEA-Leti, developed a microelectronic package that allows an RFID chip to be directly connected to a set of two conductive wires (that function as antennas) and woven into a yarn  
Ericsson sacks R&D, supply employees 2015-07-02
The official motivation was the decline of 2G and leapfrog over 3G from operators switching to 4G. The main reason is flat sales and significant loss of business to Huawei  
Li-ion battery market to log 3.8% CAGR from 2014-2019 2015-07-02
Research and Markets identified the increased use of Internet, as well advances in technology as the major driving forces for the growth of the market in the Americas, and the APAC and EMEA regions  
GlobalFoundries acquires IBM's chip manufacturing business 2015-07-02
GlobalFoundries will be IBM's exclusive semiconductor processor technology provider for the next 10 years. The deal could expand GlobalFoundries' current capacity by more than 10 per cent  
Growing ATE market to approach $4.48B in 2020 2015-07-01
Grand View Research forecasted that increased demand for consumer electronics will fuel the market, as well as the rising design complexity due to adoption of SoC  
GlobalFoundries announces 22nm FD-SOI process 2015-07-01
The promise of GlobalFoundries' 22nm FD-SOI solution, according to an executive, is to offer its customers roughly a 14nm FinFET performance at about 28nm cost  
Low-power sensors offer real-time air quality monitoring 2015-07-01
Imec and Holst Centre developed a small NO2 sensor with low power consumption in the mW range and has a low detection limit for nitrogen dioxide (NO2)(< 10ppb) and a fast response time  
Will smartphones follow PC's footsteps? 2015-07-01
Sadly, the days of massive improvements in features in a new phone are over. The reality is that phone features are about capped out. Moreover, everything Apple can do, Android does too  
CEA-Leti realigns research focus: FD-SOI takes centre stage 2015-06-30
Leti, equipped with 200nm and 300nm wafer fabs, pioneered in its labs one of the key technologies in manufacturing SOI wafers, transferred it to Soitec, and worked with ST in chips based on FD-SOI  
Conductive ink on textiles yields stretchable electronics 2015-06-30
University of Tokyo researchers said the discovery will enable electronic apparel such as sportswear incorporating sensing devices for measuring biological indicators such as heart rate and muscle contraction  
What chips are inside Apple Watch? 2015-06-30
The good news for the winners of the design slots—STMicroelectronics, NXP, AMS, Dialog Semiconductor—is that Yole reckons the wearable electronic equipment will grow steadily  
9 out of 10 households to have Wi-Fi by 2019 2015-06-29
The proliferation of connected devices runs parallel to heavy ISP infrastructure investments designed to provide higher bandwidth speed and the budget to market it to subscribers and prospects  
ISSI endorses Uphill over Cypress 2015-06-29
The ISSI Board of Directors has recommended to its stockholders to vote for the adoption of the Uphill Agreement after Cypress failed to beat Uphill's offer of $23 per share  
ARM, Synopsys team up with UMC for 14nm FinFET process 2015-06-29
UMC demonstrated favourable 128MB SRAM yields on its 14nm FinFET process and will skip the 20nm technology node to catch up with competitors such as Samsung and TSMC  
Altair rolls low-power 4G chip aimed at wearables, IoT 2015-06-29
The FourGee-1150/6401 is a low-cost LTE Category-0 chipset featuring downlink speeds of up to 1Mb/s and claims to halve the connectivity cost of the standard LTE technologies being used today  
OSATS: Wafer-level packaging limitations hard to dismiss 2015-06-29
The recent SEMI Packaging Tech Seminar focused on the need, in terms of under yield and packaging cost pressures, to move from fan-out wafer-level-packaging to fan-out panel-level-packaging  
Nanowires afford LEDs better light, energy-savings 2015-06-26
Denmark's Niels Bohr Institute researchers studied nanowires using X-ray microscopy and were able to pinpoint exactly how the nanowire should be designed to give the best properties  
What are the advantages of using USB Type-C 2015-06-26
Using the USB Type-C allows manufacturers to deliver power, data and display over a single connector, cable and port. It is good for over 100W, high-speed data and a 4K display  
SMIC, Huawei, Qualcomm, Imec sign 14nm joint venture 2015-06-26
SMIC hopes the deal will enable it to have its home-grown 14nm process in production in an SMIC fab by 2020, which is said to still have problems even with its 28nm process  
Freescale-NXP sees potential in secure IoT MCUs 2015-06-26
The NXP CEO hopes to combine its security expertise and success in automotive infotainment with Freescale's broad MCU portfolio to create a range of chips for connected devices  
Cloud-RAN using small cells tops distributed antenna system 2015-06-26
With C-RAN, the baseband processing is centralised, allowing multiple access points to act as a single continuous cell rather than as an array of competing cells  
Virtual reality market to approach $16B in 2020 2015-06-26
The virtual reality technology plays a crucial role in many applications such as gaming, entertainment, aerospace and defence, industrial, medical, retail and marketing, education and others  
Atmel marks spot in IoT space 2015-06-25
Atmel's place in the IoT universe is in wireless routers/smartphones and customised gateways. Atmel is not present in the enterprise IoT space where databases and servers play critical roles  
16GT/s PCIe may not be ready until early 2017 2015-06-25
Developers in the PCI SIG hope to complete a 0.7 version of the spec by the end of the year, at which stage they expect no major changes to the technology  
AMD rebuffs planned breakup 2015-06-24
The Reuters news service reported that AMD was mulling whether to split up the company, citing unnamed sources, saying AMD had engaged a consulting firm to help it review such options  
3 key lessons in IoT security 2015-06-24
With the number of IoT devices expanding, it's increasingly important that we understand how we are being protected by the IoT vendors. Transparency is not only a necessity but also a requirement  
Scalable production of low-temperature 2D MoS2 films 2015-06-24
Researchers at the University of Southampton's Zepler Institute characterised large-area 2D films of molybdenum disulphide at room temperature using a process that is scalable to any size wafer  
TV brands to increase dependence on Chinese OEMs 2015-06-24
IHS revealed that TVs made by outsourcing specialists are predicted to approach an industry record of 43 per cent of LCD TVs shipped globally this year  
KAIST team creates first flexible phase-change RAM 2015-06-23
The research team developed a low-power non-volatile PRAM for flexible and wearable memories enabled by self-assembled BCP silica nanostructures and self-structured conductive filament nanoheater  


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