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EE Times Asia - total search 31819 articles sort by date sort by relevance
EZchip acquires Tilera to diversify network chip portfolio 2014-07-03
The $130 million acquisition deal will bring together complementary technologies, resulting in a range of NPUs and CPUs that rival those of current market frontrunners Broadcom and Cavium  
Qualcomm unfettered as top cellular base band player 2014-07-02
Qualcomm continues to lead the cellular base band player market during the first quarter of this year, knocking Intel out of the top three, according to a report by Strategy Analytics  
Voice, face secure data in personal electronic devices 2014-07-02
TrulySecure is available to OEM product developers in the form of an SDK that unites Sensory's speaker verification technology with its newly developed, proprietary, face recognition engine  
Chemists focus on Li-sulphur cells as alternative to Li-ion 2014-07-02
Researchers at the NIM Cluster at LMU and at the University of Waterloo in Ontario, Canada, have synthesised a novel material that could show the way forward to modern lithium-sulphur batteries  
Gigaphoton unveils world's first helium-free purge process 2014-07-02
As a move toward advancing its "Green Innovations" environmental technologies where it intends to reduce the consumption of helium, the company does just that for ArF immersion lasers  
Chemists unveil magnetically-responsive liquid crystals 2014-07-01
University of California, Riverside researchers developed liquid crystals with optical properties that can be instantly and reversibly controlled by an external magnetic field  
Philips merges Lumileds, automotive lighting units 2014-07-01
Royal Philips plans to combine its LED component and automotive lighting businesses and will seek capital from third party investors to spur innovation.  
2D graphene nanosheets developed using Scotch-tape method 2014-07-01
A team of researchers looked into the physics, kinetics and energetics behind the regarded "Scotch-tape" technique using molybdenum disulphide (MoS2) atomic layers as a model material  
MEMS startup focuses on Chinese ODMs for growth 2014-07-01
Ben Lee, CEO of mCube, said it secured $37 million of Series C venture capital to enter phase three of its progress, and will target Chinese ODMs, not a design win from either Apple or Samsung  
GreenPeak, USI collaborate on smart home ZigBee module 2014-07-01
The companies developed the USI ZigBee module that integrates hardware with ZigBee to transform thermostats, motion sensors, lighting and smart plugs into interactive Smart Home ZigBee devices  
All systems go for Project Ara 2014-07-01
Project Ara is now up and running after Google made a successful debut at I/O, in spite of a frozen home screen during the demonstration of the modular smartphone  
ARM, Actions ink license deal for 64bit tablets 2014-07-01
After signing a license deal for the 64bit ARM Cortex A50 processors, Actions will be able to deliver an ARM-based 64bit chip for tablet devices  
Chip industry to face hurdles brought by 20nm tech 2014-07-01
Executives from two capital equipment firms said chip vendors face the challenges brought by higher costs and complexities due to tighter margins, new processes and materials at 20nm and beyond  
Business climate grows hostile between China, U.S. 2014-06-30
The global electronics supply chain is at risk as cyber espionage conflict between the East and the West escalates, with China considering the replacement of IBM servers running its banking industry with Chinese-made technology  
Google to roll out 3D-sensing tablet by next year 2014-06-30
The 7in Android tablet runs on an Nvidia Tegra K1 processor with 120GB SSD and 4GB of RAM, a 4MP/2um camera, a high-speed light-sensitive sensor and a custom motion tracking camera  
Intel highlights novel, future technologies 2014-06-30
During this year's Intel Future Showcase, the company looked at how the combined capabilities of hardware for mobile devices and the Internet of Things will boost innovation  
IoT triggers outburst of new ideas 2014-06-30
The Internet of Things is the next "big thing" in electronics. This is an explosion of new ideas that will add sensing and controls to literally billions of everyday situations  
Tofu component helps cut cost of solar panels 2014-06-27
Magnesium chloride, an ingredient used to make bean curd or tofu, is low cost, easily obtainable, and can simply be substituted for cadmium chloride in creating solar panels  
IBM fab sale: Retracing its x86 steps 2014-06-27
IBM's focus on servers for businesses prevented it from seeing and responding to what one former employee calls "the biggest server buying spree in a decade  
Android-powered wearable devices compared 2014-06-27
Samsung and LG unveiled their first devices using Android Wear, the platform for wearable devices developed by Google. The two devices have some differences that are worth noting  
Qualcomm leapfrogs Intel in cellular baseband market in Q1 2014-06-26
Strategy Analytics reported that Qualcomm maintained its baseband market dominance with 66 per cent revenue share, followed by MediaTek with 15 per cent and Spreadtrum with five per cent.  
IBM makes case for retaining chip fab 2014-06-26
In this second of a three-part series, IBM argues against the position of several analysts and IBMers that the firm should exit the chip-making business, saying that it has done the right-sizing to keep its chip fab including adopting a standard software across all its systems and selling its x86-based server business to Lenovo  
Sensor hub implements KitKat sensor.h at 200µA 2014-06-26
The SENtral-K platform from PNI embeds the complete range of Android 4.4 sensors on its low-power coprocessor, allowing the support of always-on context-aware applications in mobile devices  
Avago buys PLX Technology for $309M 2014-06-26
An executive from Avago said the company's long-term strategy, which focuses on mixed-signal and high-speed opto-electronics, will be complimented by PCI switches and bridges used by PLX  
Sputtering method reduces GaN LED prod'n cost 2014-06-26
University of Tokyo researchers developed a technology for creating GaN LEDs on glass substrate that could not only reduce manufacturing costs but also help to develop OLED light panels  
Google I/O 2014: Facing tough competition 2014-06-26
Amazon, Apple, and Samsung updated their respective developer communities with product and platform plans—all aimed at shooing Google from their products.  
IBM reaches pivotal moment in chip fabrication 2014-06-25
Several analysts and IBM employees opine that the firm should go fabless—shed its chip-making business and sell its fabrication plant to GlobalFoundries—saying that the chip giant has under-invested in its two fabs for years now  
Intel bolsters massive parallel processor 2014-06-24
Intel's Xeon Phi processor gets an upgrade, boasting 3TFLOPS capacity in a single package. Dubbed as Knights Landing, the massive parallel processor is set to debut by the second half of 2015  
FPGAs afford server boosts in datacentres 2014-06-24
Bing is rolling out Stratix-based fabric on servers to accelerate processing of customer searches, an approach that Microsoft revealed to improve ranking server throughput by 95 per cent  
3D integration tech thins down 300mm wafer to 4µm 2014-06-23
The length of the wiring between upper- and lower-layer chips in the thinned wafers is reduced to below 1/10 compared to conventional TSVs, with wiring resistance, capacitance, and volume being reduced drastically  


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