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Powering the future 2004-01-01
Innovations underway in power management hold great promise for a world driven by an insatiable need for electricity.  
TI's SETMOS said to extend CMOS life 2003-12-11
Texas Instruments Inc., together with researchers at the Swiss Federal Institute of Technology of Lausanne and the U.S Air Force Research Laboratory, have described a potential way to use single electron transistors (SETs) to perform logic functions.  
Redefining design for yield, manufacturability 2003-09-16
By adopting a more design-driven approach to production, many of the yield and manufacturing issues daunting the semiconductor industry can be addressed before they even occur.  
IR power management modules back Mars missions 2003-07-22
International Rectifier announced that it has contributed its power management technology in the recent Mars space missions.  
Infineon, APT enter purchase agreement 2003-05-27
Infineon Technologies has agreed on the purchase of its COOLMOS power MOSFET die by Advanced Power Technology  
ON Semi opens second front-end fab in Slovakia 2003-04-22
ON Semiconductor has opened its second front-end wafer fab in Piestany, Slovak Republic, which will produce low-voltage MOS power devices.  
Fairchild eyes GEM deal for proliferation of MOSFET packs 2003-03-26
Fairchild Semiconductor Corp. is negotiating with GEM Services Inc. to make the latter a third-party licensor of the technology and tooling for Fairchild's new "bottomless" MOSFET BGA and flip-leaded molded packages  
Fairchild expands China presence, targets power electronics 2003-03-11
Fairchild Semiconductor has announced that the first phase of its 800,000ft assembly, test, and warehouse facility in Suzhou, China is underway, and is expected to be completed by Q2 2003.  
AAC selects CEAC as component distributor in China 2003-02-28
Advanced Analog Circuits Corp. has appointed China Electronic Appliance Corp. to market and distribute its electronic components and ICs in the China market.  
Leakage current called obstacle to chip complexity 2003-02-12
The semiconductor industry must reduce leakage current in chip designs by two orders of magnitude over the next 10 years, or face an interruption in projected chip complexity, said professor Takayasu Sakurai.  
IXYS forms division focused on RF devices 2003-02-05
IXYS Corp. has reorganized its wholly owned subsidiary, Directed Energy Inc., resulting in two divisions, thus creating a newly formed division called IXYS RF.  
Flash gets a quantum makeover at IEDM 2002-12-17
Research at the University of Tokyo and at Advanced Micro Devices Inc. dangles the possibility of using quantum-well technology to breathe new life into Flash memory.  
Chipmakers bang away at metal gates 2002-11-28
Technologists are girding for yet another major change in CMOS gate stack integration: the replacement of polysilicon gate electrodes with two metals for PMOS and NMOS transistors.  
Intersil platforms to power Gigabyte motherboards 2002-08-13
Gigabyte Technology Co. Ltd has selected Intersil Corp.'s Endura power solutions for its Titan GA-8IGX and GA-8IEXP motherboards.  
Intersil to power Legend QDI's latest motherboards 2002-06-20
China-based Legend QDI has selected Intersil Corp.'s Endura, to power the Intel Pentium 4 processor on their latest motherboards which are based on the i845G and i845GL chipsets.  


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