| China Digital TV, Intel to bring advanced DTV to China
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2008-03-12 |
| A collaboration has been forged between China Digital TV Holding and Intel for the mutual development of advanced DTV products for the China market. |
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| Magnetic device lets one 'feel' 3D computer objects
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2008-03-10 |
| Researchers at Carnegie Mellon University have developed a device that could allow people to feel textures and shapes of 3D designs created on computers—without awkward mechanical gear. |
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| More groups push standards for virtual prototyping
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2008-03-10 |
| New players are expected to push forward efforts to create standards for virtual prototyping as the next wave in system and software development, to allow tools and simulation models from various suppliers work together. |
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| Maximize multiband handset performance
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2008-03-03 |
| Cellphones have moved rapidly from dual-band to tri-band to even quad-band. Also, cellphones need to handle various signals for peripheral radios such as Bluetooth, Wi-Fi and GPS. Ultimately, it is the RF switch that must be capable of switching up to nine paths of high-power RF signals with low insertion loss, high isolation and exceptional linearity to realize the necessary multiband performance. |
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| Fundamentals and design principles of RF, antenna (Part 2
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2008-02-28 |
| The second installment of the 3-part series discusses common antennas including half-wave dipole, quarter wave monopole, transversal mode helical, and small loop antennas. |
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| Take a holistic approach to power management for mobile devices
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2008-02-18 |
| Power management no longer remains a hardware-only problem; rather it has become a system problem that is being addressed by all engineers involved in the system design process. Power management decisions are being taken at both hardware and software level. Increasing focus towards system aspects of cellular phones compels designers to take a holistic and dynamic approach to power management to effectively decrease power consumption without degrading performance |
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| Use UWB in ultralow-power Zigbee sensor nodes
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2008-02-18 |
| The IEEE 802.15.4 standardization committee who defined the MAC and PHY adopted by Zigbee has proposed an alternative PHY relying on UWB technology. |
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| Overcome critical SoC architectural challenges
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2008-02-18 |
| A collaborative effort among IC designers using CoWare's ESL tools and Sonics' SMX smart-interconnect IP designed for this class of SoCs enabled the rapid optimization and verification of the design aspects necessary to meet the critical architectural challenges |
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| Attain audio, video performance goals
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2008-02-18 |
| As the migration to high definition picks up speed, video system designers are faced with new challenges related to bandwidth requirements, image quality, transcoding and digital media codec flexibility. |
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| Capacitive sensing makes a splash
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2008-02-18 |
| Exploring the use of capacitive sensing in a water cooler illustrates not only how capacitive sensing can make devices more reliable, but also how the controller managing capacitive sensing can take on additional functions to add further value to customers and reduce maintenance costs. |
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| Processor designers debate future of multicore
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2008-02-08 |
| Microprocessor engineers agree multicore designs will be the wave of the future, but they differ widely on how to implement them and surmount the many challenges they pose. |
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| IBM seeks standard to link chip models with tools
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2008-02-04 |
| An IBM executive has called for standards to link chip models with simulation tools in an effort to lower design costs and shorten time-to-market |
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| Select the right network connection for your MCU-based M2M app
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2008-02-01 |
| The proliferation of M2M communications anticipates a rise in Ethernet-capable MCU market. The question is, which is the best way for you to add this connectivity? |
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| Toshiba, Cadence collaborate on 65nm design
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2008-01-31 |
| Cadence Design announced that Toshiba has deployed Cadence Virtuoso simulation technology to provide its analog and mixed-signal chip designers an easy-to-use and accurate reliability analysis flow |
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| 45nm: What Intel didn't tell you
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2008-01-25 |
| Some high points of Intel's 45nm HKMG technology are: high-k first, metal-gate-last integration; hafnium oxide (HfO2) gate dielectric (1nm EOT); and dual band-edge work function metal gates (TiN for PMOS; TiAlN for NMOS). The gate-last integration is one point that needs a bit of clarification in the Intel process flow. |
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