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Microsoft hopes to rev poky telematics market 2002-07-17
Microsoft Corp. will release on Monday a list of five automakers that will use Windows CE OS in 12 upcoming car models.  
Verification startup wants everyone to go 'formal' 2002-07-10
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National Instruments: Offering virtual instrumentation-based solutions 2002-07-08
In its bid to differentiate itself from other measurement solution providers, National Instruments pioneered the development of virtual instrumentation solutions for the measurement and automation sectors.  
Samsung selects Zarlink demodulator for its digital TV receivers 2002-06-28
Samsung Electro-Mechanics has selected the advanced demodulator chip of Zarlink Semiconductor for its latest terrestrial network interface module that will power STBs and TV receivers for the terrestrial digital TV receiver consumer market  
Papers reveal Synopsys, Cadence research projects 2002-06-28
Innovation is alive and well as Synopsys Inc. is moving ahead in formal verification, test and synthesis, and Cadence Design Systems Inc. is breaking new ground in timing analysis, asynchronous design and model reduction  
Actel joins HyperTransport Technology Consortium 2002-06-27
Actel Corp.'s has joined the HyperTransport Technology Consortium as part of its BridgeFPGA initiative to deliver optimized communications interface solutions for bridging applications  
Accelent Intel-based platform to integrate SMSC Ethernet device 2002-06-26
Accelent Systems Inc. has selected SMSC's LAN91C111 10/100 non-PCI Ethernet device to be incorporated in its Integrated Development Platform based on the Intel PXA250 applications processor with Xscale technology.  
Kodak pushes OLEDs forward via licensing pact, design kit 2002-06-20
Continuing to make inroads with technology it pioneered in the 1980s, Eastman Kodak Co. has licensed its passive-matrix OLED technology to Optrex Corp. for use in displays, following the recent release of a design kit for active-matrix OLED display manufacturers  
Materials transitions stalk CMOS scaling 2002-06-19
With the transition to copper and low-k interconnects showing just how difficult changes in materials can be, technologists gathered at the Symposium on VLSI Technology to consider a brace of materials challenges—ranging from new gate oxides to SOI and strained-silicon channels.  
Genmark adds wafer-mapping sensor to handling system 2002-06-18
Genmark Automation Inc. has added a built-in wafer-mapping sensor to increase system throughput and provide flawless wafer transfer for 200mm/300mm wafer-handling equipment.  
W-Link adopts Zeevo TC2000 Bluetooth solution 2002-06-17
W-Link has selected Zeevo Inc.'s TC2000 single-chip device to be integrated in its range of products.  
Beyond LAN: 10GbE for high bandwidth metro systems 2002-06-16
With 10GbE, system designers are under pressure to incorporate this technology in their products. Multiple vendors aid them by providing building blocks for this technology.  
Low-end NPU takes on T1, T3 duties 2002-06-16
Motorola is aiming its low-end C-3e network processor and companion Q-3 traffic manager for aggregating T1/T3 services.  
Dongbu launches program for CMOS image sensor developers 2002-06-14
Dongbu Electronics Co. Ltd has launched its GeneCIS program for developers of CMOS image sensors that target high-volume applications.  
Fairchild boosts mainland China presence 2002-06-13
Power semiconductor supplier Fairchild Semiconductor Int. has announced the opening of its expanded sales office and applications laboratory in Shanghai.  


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