| Too many specifications confuse server design
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2003-04-16 |
| There seem to be more "industry-standard" technologies available than ever before for connecting together server sub-systems, but many of these technologies overlap. |
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| Making of an audio chip firm in the PC boom era
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2003-04-11 |
| Making of an audio chip firm in the PC boom era |
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| Recapping IIC-China '03
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2003-04-01 |
| In this year's IIC-China, the spotlight fell on a majority of Taiwan-based exhibitors including not only well-known consumer electronics players, but also smaller Taiwan IC design houses |
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| IC, package co-design proving elusive, techies say
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2003-03-28 |
| IC package design has become a huge bottleneck for getting chips out the door, but there are few automated tools that can help, according to panelists at the International Symposium on the Quality of Electronic Design |
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| Hitachi, LSI Logic to accelerate SAS standard delivery
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2003-03-27 |
| Hitachi Global Storage Technologies and LSI Logic Corp.'s Storage Standard Products division have agreed to coordinate their respective product development efforts to speed up the delivery of the Serial Attached SCSI technology. |
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| Silicon Laboratories expands Asian reach with new offices
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2003-03-26 |
| Silicon Laboratories Inc. has expanded its Asian operations with new offices in mainland China, Japan, South Korea, and Taiwan. |
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| Entegris commences latest WRC volume production
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2003-03-21 |
| Entegris Inc. has begun mass production of its new wafer and reticle carrier products at its Center of Excellence in Minnesota, U.S.A. |
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| Optical interface alliances drive new integration business
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2003-03-20 |
| Semiconductor and opto-component manufacturers culminating for the Optical Fibers in Communications Conference will seek through alliances and design wins the kind of subsystem integration long predicted for the optical transmission world |
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| Z-Com adopts IDT processor for latest WLAN device
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2003-03-19 |
| Z-Com Inc. has selected Integrated Device Technology Inc.'s RC32334 processor from the IDT Interprise PCI family, to power Z-Com's latest IEEE 802.11g WLAN access-point product. |
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| Moschip seeks merger with Verasity Technologies
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2003-03-19 |
| Moschip Semiconductor Technology Ltd. said it is seeking a merger with Verasity Technologies Inc. |
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| Compact wireless modules bring benefits
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2003-03-17 |
| Manufacturers are seeking to incorporate cellular technology into existing products, or to develop niche products for comparatively small markets. |
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| Summit tool beefs up SystemC
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2003-03-03 |
| Summit Design Inc. launched its Visual Elite 3.1 which included FastC to better reach out to HDL designers |
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| Silicon collaboration to develop next-gen RDRAM chipset
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2003-02-28 |
| Silicon Integrated Systems Corp. has collaborated with Samsung Electronics Co. Ltd, ASUSTeK Computer Inc., and Rambus Inc., on the development of a next-generation RDRAM-based chipset - the SiSR659. |
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| Interface issues loom for full-featured phones
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2003-02-19 |
| The 3GSM World Congress is grappling with how best to connect all of non-phone peripherals with an application co-processor in handsets. |
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| Bridging optical and Ethernet
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2003-02-17 |
| Through the use of flexible bridging technologies, the existing optical infrastructure can support today's data-heavy traffic patterns allows new features without overly taxing unavailable corporate investment. |
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