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IDT readies for DisplayPort shift in digital displays 2007-12-05
IDT has set up a new digital display division focused on chips for the DisplayPort standard, validating the major shift from analog VGA and LVDS.  
TSMC 55nm process tips knowledge-based processors 2007-11-30
TSMC and NetLogic Microsystems have collaborated on using 55nm process technology for fabricating low-power knowledge-based processors.  
California Micro Devices opens design center in India 2007-11-30
California Micro Devices has established a design center in Chennai, India, part of its continuing collaboration with its ASIC design partner GDA Technologies, which has established presence in the country  
Rambus shows alternative way to terabyte memory 2007-11-28
Rambus has developed technologies that could enable links to memory chips delivering up to a terabyte per second and could provide a lower-cost alternative to 3D chip stacking.  
MEMS poised to penetrate CE market 2007-11-23
After penetrating mass market by enabling air bags to trigger fast enough to catch passengers before they hit the steering wheel, MEMS now has a new target: consumer electronics.  
Next SoC era calls for new business models 2007-11-16
Welcome to the next phase of the SoC era, in which system, software and semiconductor companies are struggling to find new technology and business models.  
Improve systems' real-time performance 2007-11-16
To drive a new era of system performance that bridges both legacy requirements and emerging technologies, designers of industrial applications need a high degree of real-time performance and implementation flexibility from their embedded-processor choices.  
Tool rids wireless sensor nets of battery 2007-11-16
No wires and no batteries; now there's a combination. It's the promise of a company at this year's ISA Expo with a battery-free solution for ultralow-power wireless sensor and control networks based on the IEEE 802.15.4 standard.  
What's next in microcontrollers? 2007-11-16
MCUs have come a long way in terms of their applications, processing capability, architectures and fusion with other semiconductor products. So what are some of its future challenges and what is next in MCUs? This article explores the challenges and opportunities ahead.  
Manage design resources for industrial apps 2007-11-16
To better manage design resources and attain economies of scale, OEMs need solutions that enable customization of platforms with common building blocks, so that unique models may require only minor variations in components and/or firmware  
'Green' silicon ink prints cheaper RFID tags 2007-11-15
Kovio claimed that RFID tags using its 'green' silicon ink will drop Kovio's price from 15 cents today to 5 cents by 2008, when Kovio begins volume production of its inkjet-printed RFID tags.  
SV Probe opens probe card factory in Vietnam 2007-11-14
Ellipsiz subsidiary SV Probe has opened a new 4,000m² probe card factory at the Vietnam-Singapore Industrial Park in Binh Duong Province, Vietnam.  
Google bares mobile strategy: open platform 2007-11-07
Google's long-awaited gPhone has been rechristened "Android," but a briefing on the device focused on the 34-member Open Handset Alliance Google has formed to drive open interfaces for wireless applications, rather than on a handset design  
Wi-Fi card for digicams eases photo sharing 2007-11-05
Eye-Fi Card fits into an SD slot and automatically sends pictures from the digicam to a local PC or Mac or to an online site based on preset user preferences.  
45nm designs demand efficient floorplans 2007-11-01
With the migration to 45nm cores, optimized I/O planning and placement will become even more critical. These challenges beg the question: Who should take charge of a chip's I/O plan along with the considerations for the package and the rest of the system?  


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