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2013-01-22 Phase-change material opens new path for data storage
A research team from A*STAR Data Storage Institute has found that materials made of iron and tellurium can change their property known as optical reflectivity depending on their crystalline state.
2005-11-28 Phase change material offers performance and easy use
Laird Technologies introduced a new high-performance phase change material that meets the thermal resistance and reliability requirements needed for advanced apps such as microprocessors, chipsets, graphic processing chips and custom ASICs.
2008-07-02 Phase change interference materials suit Intel's Penryn
Laird Technologies Inc. announced two new products in its T-pcm phase change line of thermal interface materials, T-pcm 670 and T-pcm 680
2006-03-22 New material eases thermal management
Honeywell Electronic Materials has announced the release of a new screen-printable phase-change material that aims to provide semiconductor chip manufacturers flexibility in thermal management.
2002-09-09 Dow Corning phase material improves heat dissipation
The PCM-250 thermal phase change material of Dow Corning Electronics melts at a typical temperature of 500C, dissipating heat from high power density microprocessors to improve their longevity and reliability.
2002-03-01 Chomerics phase-change material simplifies heatsink removal
The T766 phase-change features a thermal impedance of 0.04°C-inch²/W, providing a low thermal resistance interface path between hot components and heat inks, while allowing easy removal of sinks for rework operations
2011-03-17 Researchers use carbon nanotubes to scale PCM
Non-volatile memory bits can be made by applying phase-change material to previously created nanometer-scale gaps in carbon nanotube filamentary conductors, according to a paper.
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