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2012-02-10 Multisensor module boasts 9DoF
Multisensor module boasts 9DoF
2012-02-03 RSE measurement sol'n touts 80dB dynamic range
The R&S OSP-B155 plug-in module with 155dBm/Hz sensitivity claims to simplify measurement of radiated spurious emissions on LTE devices.
2012-01-31 MagnaChip acquires Dawin Electronics
MagnaChip said the acquisition of Dawin and its IGBT and FRD module technology is in line with the company's goal of expanding into high-growth, high-margin markets.
2012-01-25 Signal IC boasts ±0.10% FSO accuracy
The ZSSC3016 combines high accuracy amplification, 16bit precision analog-to-digital conversion, and an 18bit DSP for linearization and calibration functions.
2012-01-19 Front-end modules geared for smart energy apps
The RFFM6201 is a 2.4GHz band single-chip Zigbee FEM featuring an integrated power amplifier, low noise amplifier and diversity switch.
2012-01-19 Computer-on-module for embedded fanless apps
Computer-on-module for embedded fanless apps
2012-01-16 EDA posts 18% YoY sales growth
Industry revenue increased 18.1 percent for 3Q11 to $1543.9 million, compared to $1307 million in 3Q10.
2012-01-10 COM Express dev't board targets rugged apps
The COM Express Reference Carrier-i Type 10 for COM Express mini COMs is validated for use from -40°C to 85°C.
2012-01-09 Development board for COM Express module
Development board for COM Express module
2012-01-04 MEMS module targets touch-free apps
MEMS module targets touch-free apps
2011-12-26 Assembly software optimized production data
The Aegis iLaunch and iView Manufacturing Operation Software modules ease electronics manufacturing services operation.
2011-12-20 MEMS modules cut device size by 20%
ST's multisensor device that touts six degrees of freedom claims to deliver advanced motion-sensing capabilities and can run from 2.4-3.6V.
2011-12-20 Bland market awaits power IC market next year
The global market for power semiconductors is expected to grow only five percent next year, IMS Research predicted.
2011-12-08 Controller IC price key to touch module market
Controller IC price key to touch module market
2011-12-07 LED module delivers 80lm/W
LED module delivers 80lm/W
2011-12-05 Wireless module delivers up to 24dBM
Wireless module delivers up to 24dBM
2011-12-01 COM Express uses 17W of power
The Kontron microETXexpress-PV operates from -40°C to 85°C and targets harsh environments found in transportation and military applications.
2011-11-30 Cellular module boasts small package
Cellular module boasts small package
2011-11-30 Sensor signal ICs target resistive bridge conditioning
Sensor system designers can select among four pin-compatible products to obtain the best fit in terms of sensor type, system safety and module cost requirements.
2011-11-23 LIN slave ICs ease automotive networking
MLX80105 is a fully integrated LIN slave that claims to significantly reduce BOM cost.
2011-11-22 Power ICs, MEMS to gain from ultrabook surge
The forecasted rise in ultrabook shipments will decrease market opportunity for DRAM modules, according to IHS.
2011-11-21 Malaysia gears up to be largest solar panel maker
The country is an ideal destination for investors as it offers a 15-year tax holiday for solar company profits, low interest rates and good infrastructures.
2011-11-21 32bit TPM touts embedded 90nm non-volatile memory
ST's TPM SoC boasts stronger security and trust for activities including e-commerce and cloud computing services.
2011-11-17 Piezo-resistive bridge sensors enable cost-optimized apps
Sensor system designers can select among four pin-compatible products to obtain the best fit in terms of sensor type, system safety and module cost requirements.
2011-11-16 WiFi module targets smart, cloud-based devices
WiFi module targets smart, cloud-based devices
2011-11-14 Interface optocouplers operate at 10MBd
Avago's high-speed optocouplers offer robust electrical signal isolation for intelligent power module interface applications.
2011-11-11 Fault insertion channel can switch up to 2.5kVA
The 40-199 provides 10 fault insertion channels that can be connected to either (or both) fault bus connections.
2011-11-03 Sensor tech to simplify capacitive displays
Reduction in sensor substrate layers will enable simpler, thinner and lighter touch panels.
2011-11-02 GPSDO targets cost-sensitive LTE apps
Jackson Labs' LC_1x1 is a low-cost Rubidium frequency reference replacement module with very high holdover stability.
2011-11-09 Application development with MIFARE SAM
Here's an application note that provides information on the support items for application development using MIFARE SAM AV2.
Interview

NXP CTO reveals HPMS strategy

NXP Semiconductors CTO René Penning De Vries discusses with EE Times Asia how high performance mixed signal technology can shape the future.

Peek at Hot Gadgets for 2012
Smart energy "Try explaining to your eight-year-old son that instead of an Xbox, you got him a Wi-Fi enabled smart energy thermostat to help minimize his energy consumption and carbon footprint..."
 

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