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| 2008-05-05 | Winbond shareholders approve logic IC biz spinoff Winbond Electronics shareholders' have approved Apr. 30 the carve-out of its logic IC business group, dubbed Nuvoton |
| 2007-10-05 | Winbond mulls creation of logic IC subsidiary Winbond Electronics Corp. announced it will form a task force to evaluate the establishment of a new wholly-owned subsidiary that will focus on logic IC business |
| 2006-12-05 | Winbond invests in Korean fabless memory firm Winbond Electronics announced that it invested $15.7 million in Emerging Memory & Logic Solution Inc. via its overseas subsidiary and received one seat on EMLSI's Board of Directors |
| 2006-04-21 | UMC fabs Sonos memory IC United Microelectronics Corp. has made a new type of memory on a foundry basis for Solid State System Co |
| 2006-10-13 | Toshiba, Rambus expand memory interface agreement Toshiba Corp. and Rambus Inc. have expanded their memory-interface licensing agreement |
| 2007-03-13 | Taiwan posts 23% IC growth, ramps wafer production The overall production yield of Taiwan's IC industry in 2006 hit $41.6 billion, up 23.2 percent, reports the Ministry of Economic Affairs R.O.C |
| 2002-03-26 | STMicro Flash memory chip has 192-bit protection register null |
| 2003-03-04 | SST Flash memory boasts fast erase time Silicon Storage Technology Inc. has introduced the SST39VF320 32Mb Flash memory chip that offers a maximum erase time of 50ms, instead of the minutes needed by most competing products |
| 2007-01-04 | SIA president warns of tight memory IC supply Semiconductor Industry Association president George Scalise warned that there are signs that memory chips are coming into tight supply due to strong demand for chips |
| 2007-05-30 | Samsung allots $1B for memory IC production upgrade Samsung Electronics announced May 28 that it would invest $1.01 billion to upgrade its memory chip production lines, according to a Reuters report |
| 2009-11-16 | RFID chip integrates 2Kbit memory The large on-chip memory of 2Kbit density alongside RFID circuitry allows e-tickets to become more intelligent and flexible |
| 2007-01-17 | Renesas, Powerchip form JV on memory product design Renesas Technology and Powerchip Semiconductor have agreed to establish a joint venture that will specialize in the design of advanced memory devices |
| 2003-07-25 | NVIDIA adopts Artisan memory products for IC design NVIDIA Corp., a provider of graphics processors and media and communications devices, has selected Artisan Components Inc.'s design platform and memory products for its 130- and 90-nanometer designs |
| 2007-01-15 | Novocell nonvolatile memory IP in 0.18µm CMOS Novocell Semiconductor announced its NovoBlox OTP memory IP, implemented in a patented, gate oxide antifuse technology |
| 2011-05-27 | Nomura: Smartphones, servers fuel IC market growth Nomura believes that demand for smartphones and servers and stable memory IC prices will fuel IC market growth by 4.4 percent, a raised forecast from its projection of 3.1 percent. |
| 2010-01-25 | Mosaid, Samsung ink memory license, purchase deal Mosaid has signed a new semiconductor patent license agreement with Samsung and will also purchase a significant portfolio of the memory chipmaker's patents |
| 2008-06-16 | Memory problems prompt SIA to cut forecast The Semiconductor Industry Association (SIA) said semiconductor sales are forecast to slow down in this year principally due to problems in the memory IC sector. |
| 2008-04-08 | Memory consolidation still up in the air Everyone seems to agree the memory IC market needs another round of consolidation, but so far, none of the leading suppliers are showing any signs of exiting the sector despite spiraling losses and increasingly negative cash flows. |
| 2009-11-30 | Memory boost drives Samsung growth in '09 iSuppli's preliminary 2009 IC supplier rankings found that Samsung Electronics is the only top 10 chip supplier expected to show an increase in chip sales this year compared to 2008 |
| 2002-02-27 | Irvine Sensors rolls out memory chips with TSOP footprint The company's Microelectronics Products Division has announced the shipment of its "Skinny Stacks" stacked memory products that match the footprint of next-generation TSOP ICs |
| 2003-07-30 | Infineon co-establishes IC test firm in China Infineon and China-Singapore Suzhou Industrial Park Venture have agreed to set up a joint venture company for the assembly and testing of memory ICs |
| 2006-11-08 | IDT ships advanced memory buffer to Elpida IDT announced it is the main advanced memory buffer supplier for Elpida Memory's family of fully-buffered DIMM products |
| 2007-03-06 | IC market on a sluggish start The IC industry has started off poorly in 2007, as demand for analog, DRAMs, FPGAs, NAND flash and other products have been weak thus far, according to a report from Gartner |
| 2006-10-13 | Hynix, ST open joint memory fab in China STMicroelectronics and Hynix Semiconductor inaugurated their $2 billion joint-venture memory fab in Wuxi, mainland China |
| 2006-09-26 | Conferences show advances in flash memory security Future-generation flash memory devices will benefit from drive architectures that improve performance and data security while improving systems integration |
| 2009-09-24 | Communication protocols on the LRI64 Long Range RFID Memory IC This application note aims to analyze the different solutions and to describe the advantages of the LRI64 protocols. |
| 2012-08-15 | Cloud computing to drive global memory IC market GBI Research revealed that despite suffering from significant oversupply problems, the global memory IC market will be driven on by data centers and the advent of cloud computing. |
| 2007-01-03 | Back-end memory testing could tighten in '07, says analyst The back-end memory testing industry may become tighter in the second half of 2007, as memory packaging and testing companies struggle to keep pace with a changing and rapidly growing market |
| 2007-01-25 | 2GB DDR2 memory module features 800MHz operating speed Hynix has developed a 2Gbyte DDR2 memory module with operating speeds of 800MHz, which makes it the fastest of its kind in the industry, the company said |
| 2000-06-07 | 24C01A Compatibility Issue and Its Mobility for Memory Upgrade This application note refers to the Microchip part as the 24C01A and the Xicor part as the X24C01. It is intended to assist in designing a memory subsystem that is compatible with either device |
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