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What is CAM (Computer-Aided Manufacturing)?
CAM is electronic automation applied to the manufacturing process. It involves the planning, scheduling, simulation and control of advanced manufacturing systems.
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2012-02-10 Samsung, Cadence partner in nanometer SoC design
The companies will collaborate on a design-for-manufacturing (DFM) infrastructure to tackle physical signoff and electrical variability optimization for 32, 28 and 20nm ICs.
2012-02-09 Nokia to lay off 4,000, moves assembly to Asia
The transition would allow Nokia to work more closely with suppliers and enable it to introduce innovations into the market more quickly and ultimately be more competitive.
2012-02-09 FujiPanaRene: Clinging to the wreckage
Can this radical move make economies of scale for both Japan and Abu Dhabi, or is it a move that is not radical enough; two people afloat clinging to each other in the hope they can each save the other from drowning.
2012-02-09 Japan Inc. swims in troubled seas
The merger of Panasonic, Fujitsu and Renasas may salvage the weaker players of the three (Fujitsu and Panasonic) to survive for several more years through government handouts. But the move threatens the potential winner (Renesas Mobile) with a reduction to irrelevancy in the already very competitive mobile SoC market.
2012-02-09 SIA reveals tech roadmap
The roadmap lays out what SIA sees as the path for semiconductor design and manufacturing through 2026, taking into account near and long-term challenges, as well as potential innovations.
2012-02-09 Renesas, Fujitsu, Panasonic to merge IC ops
The Japanese chip vendors are ironing out plans to integrate system chip manufacturing divisions as separate from their design divisions.
2012-02-02 Sharp cuts LCD panel output
Sharp Corp. is planning to cut into half its LCD panel output at its Sakai facility in Osaka, Japan, according to a report by the Nikkei business daily.
2012-02-01 CEO outlines Globalfoundries' future plans
Globalfoundries did not disclose its 2011 revenues, but after its challenges with yields on AMD chips and a restrictive wafer supply agreement, there is speculation in financial circles that the firm may well have missed its 20 percent growth projection.
2012-01-30 TSMC fires back at analysts
Marced did acknowledge that each process node roll out has problems but said TSMC engineers rise to the challenges.
2012-01-30 Could 450mm wafers play away from the leading edge?
When the processing of integrated circuits on 450mm diameter wafer comes, many assume that it will do so first for the most advanced digital manufacturing processes.
2012-01-30 Poor economy yanks electronics manufacturing
Poor economy yanks electronics manufacturing
2012-01-30 Team-up unveils Si-photonics biosensor ICs
Imec and Genalyte have developed a disposable silicon photonics biosensor chip that allows for high levels of multiplexed biosensing.
2012-01-27 US manufacturing downfall, Asia's gain
US manufacturing downfall, Asia's gain
2012-01-27 Philippine electronics industry upbeat for 2012
According to Ernesto Santiago, president of SEIPI, the industry is hopeful that 2012 will be a better year and that they will be able to post a 10 percent growth in exports from last year.
2012-01-26 Intel, Samsung ready to dominate IC supply space
Based on the capital expenditure forecasts revealed, Intel and Samsung together are expected to account for about half of total semiconductor capital expenditures this year, IC Insights said.
2012-01-26 Analyst: Tough times for TSMC's 28nm process
TSMC's 28nm manufacturing process technologies is in trouble as it is not yielding well, says Mike Bryant, technology analyst with Future Horizons Ltd.
2012-01-25 Hitachi stops TV manufacturing
Hitachi stops TV manufacturing
2012-01-19 CSA opens HK testing, certification lab
The facility is equipped with advanced technology and will provide significant localised testing capabilities for manufacturing clients.
2012-01-19 Samsung allots $42B for logic, OLED outlay
Despite the uncertain global economy, the South Korean company plans to boost manufacturing capacity for logic chips, MEMS sensors and OLED displays as well as memory and LCD production.
2012-01-18 Canon invests in new Thai factory
Canon plans to commence construction for the new facility in February 2012 with operations scheduled to begin in April 2013.
2012-01-16 STATS ChipPAC builds new factory
Once the new building is completed, STATS ChipPAC's combined manufacturing space in Singapore will increase from 55 277.30 to 73 579.21 square meters (595,000 to 792,000 square feet).
2012-01-11 Nikon resumes Thai fab operations
Nikon's manufacturing subsidiary in Thailand has resumed partial operations since early January.
2012-01-09 Drop in MOCVD spending drags LED equipment buy
Following a 36 percent increase in equipment spending last year, worldwide LED manufacturing equipment spending is seen to decline 18 percent this year.
2012-01-06 Samsung gets green light for memory fab in China
The planned 300mm wafer fab is scheduled to have a manufacturing capacity of 100,000 wafer starts per month, making it about half the size of Samsung's Line-16 megafab.
2012-01-06 Plexus, Kontron enter manufacturing deal
Plexus, Kontron enter manufacturing deal
2012-01-06 Fluke buys test tools, OEM products manufacturer
Fluke is buying Martel Electronics. The two companies have long been working together in developing and manufacturing test equipment.
2012-01-05 Global IC business: Challenges and strategies
In emerging markets Fujitsu Semiconductor's local design teams are developing the low-cost, turnkey solutions needed while providing high-quality, reliable products that are environmentally friendly.
2012-01-04 Manufacturing platform boasts 0.11µm BEoL process
Manufacturing platform boasts 0.11µm BEoL process
2012-01-05 Mobile tech: Good for batteries, good for Asia
The mobile consumer market will add $309 billion to the semiconductor market by 2015, and much of this growth will be spurred by innovations within the power management sector.
2012-01-03 FPGAs in the era of silicon convergence
Altera continues, at 28nm and beyond, to seek process, device, and circuit innovations with their foundry partner, ensuring continued technology leadership at the silicon and circuit level.
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