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| 2012-02-01 | CEO outlines Globalfoundries' future plans Globalfoundries did not disclose its 2011 revenues, but after its challenges with yields on AMD chips and a restrictive wafer supply agreement, there is speculation in financial circles that the firm may well have missed its 20 percent growth projection. |
| 2011-11-22 | Issues of EUV lithography Issues of EUV lithography |
| 2011-10-24 | Glass improves lab-on-chip manufacturing MIT researchers have developed an engraving technique that claims to be more precise than nanoimprint lithography. |
| 2011-10-13 | Imec, ASML deal offers advanced litho tech The five-year collaboration will allow ASML to install its 193nm immersion lithography tool at Imec, speeding up its work on EUV lithography. |
| 2011-09-22 | Mask correction feature speeds up IC processing The Tachyon MB-SRAF offers an expanded imaging window that the company says improves 2x-nm designs. |
| 2011-09-16 | Japan's EUV litho JV welcomes foreign chip firms To hasten the adoption of EUV lithography worldwide, EIDEC has begun collaborating with foreign chip companies. |
| 2011-09-09 | TSMC to start EUV lithography TSMC to start EUV lithography |
| 2011-07-14 | Imec, SUSS MicroTec to develop EUV mask tech Imec and SUSS MicroTec are expanding their research partnership to develop an in-fab approach to EUV lithography focusing on mask integrity. |
| 2011-07-07 | E-beam lithography speeds up chip production E-beam lithography speeds up chip production |
| 2011-06-27 | KLA joins Sematech's litho defect reduction program Upon joining the Sematech program, KLA will collaborate with the consortium's engineers on such areas as defect source identification and elimination, and EUV manufacturability and extendibility. |
| 2011-05-17 | Ultratech Taiwan R&D center focuses on HB-LED tech Ultratech announced the opening of its Asia Technology Center (ATC) in Taiwan that will provide leading-edge process development and in-depth demonstrations for the HB-LED manufacturing industry. |
| 2011-03-14 | U.S. Circuits obtains Maskless Lithography DI system U.S. Circuits obtains Maskless Lithography DI system |
| 2011-03-07 | Nano-imprint litho makes headway in IC world Nano-imprint lithography tool vendors have achieved good defect density levels for the technology's imprint-specific defectivity, claiming that many tool platforms have shipped in the past year. |
| 2011-03-04 | JSR, IBM launch self-assembly litho structure Targeted at the sub-20nm half-pitch node, the new DSA technology enables phase separation, resulting in good profiles and more flexible use in both logic and memory applications. |
| 2011-03-04 | EUV still hounded by power source issues Leading chipmakers stress that EUV tools need 200W of power to process 100 to 150 wafers an hour. The currently used EUV tool from ASML is however running at just about 10W. |
| 2011-03-03 | EUV late for 10nm party, says Intel Although it is late for the 10nm design rule definition stage at Intel, |
| 2011-02-07 | First EUV tool ships amid power, tech concerns ASML may have shipped the world's first EUV lithography tool, but experts insist EUV is not yet ready. |
| 2011-01-20 | Toppan-IBM photomask agreement to cover 193nm immersion lithography Toppan-IBM photomask agreement to cover 193nm immersion lithography |
| 2011-01-14 | Nissan Chemical, Sematech join forces for EUV research The company joined Sematech's Resist Materials and Development Center at University at Albany's College of Nanoscale Science and Engineering to cut line edge roughness and pattern collapse in images below 22nm. |
| 2010-12-21 | IBM, AZ Electronic Materials work on next-gen litho IBM Research-Almaden will team up with AZ Electronic materials to develop materials based on block copolymers targeted at DSA processes. DSA technology is a potential bottoms-up lithography process meant to meet 16nm and 11nm half-pitch design requirements. |
| 2010-12-08 | Ultratech opens manufacturing facility in Singapore Ultratech Inc. officially opened a manufacturing facility in Singapore. The plant is set to be capable of making over 100 lithography steppers yearly for the advanced packaging and the HB-LED markets. |
| 2010-11-22 | Ultratech to inaugurate Singapore headquarters Lithography and laser-processing systems Ultratech Inc. is set to open a new international headquarters in Singapore on December 6, 2010 to better serve its customer base in Asia. |
| 2010-11-15 | IBM VP says EUV not ready Gary Patton, VP, semiconductor R&D, IBM Corp., also emphasized the importance of computational lithography, noted the lack of development of high-k and 450mm chips, and discussed technologies to extend CMOS. |
| 2010-11-01 | Intel litho buy seen at $1.5B Nikon and ASML Holding are expected to share the lithography business for Intel's 22nm node, according to Barclays Capital. |
| 2010-10-26 | E-beam litho system supports mask, direct-write apps The electron-beam lithography system from Vistec Electron Beam GmbH will support both mask writing and direct-write applications. |
| 2010-10-12 | Synopsis moves into optical design Synopsys Inc. has acquired Optical Research Associates in a move into new markets including displays, solid state lighting, semiconductor lithography equipment and cameras. |
| 2010-09-29 | Are Japan litho companies on the way out? Japanese lithography equipment makers look set to fall further behind market leader ASML Holding NV, according to analysts with investment broker Nomura. |
| 2010-09-22 | Forecast: all leading-edge designs will require e-beam D2S Inc. CEO Aki Fujimora discusses the role of electron beam lithography in the future of semiconductor manufacturing. |
| 2010-08-23 | Harari: Reflections before retirement In an interview with EE Times, Eli Harari, founder, chairman and chief executive of SanDisk Corp., provides insight about lithography, NAND and the post-NAND era. |
| 2010-07-27 | Photomask merchants: behind but fighting Photomask merchant players DNP, Photronics and Toppan may be trailing the giants technology wise, but they are still in the game. |
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