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What is Built-In Self Test (BIST)?
BIST is the capability of a product to perform a functional test of itself. Some support from external equipment may be required. BIST usually involves special logic circuitry in the product to generate input stimuli and analyze test responses.
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2012-02-13 Gate driver features 7.6A peak turn-off current
The LM5114 drives GaN FETs and MOSFETs in low-side applications and operates from a single power supply range of 4-12.6V.
2012-02-13 SoC vendors to gain from small cell market
Multiple chip architectures are in pursuit of the small cell market with shipments forecasted to reach $14 billion by 2015.
2012-02-13 LCD monitors face feeble market, inventory jitters
WitsView predicted that shipments of LCD monitors will fall by 3-5 percent QoQ and three percent YoY in 1Q12 due to the Economic debt crisis and weak economy, among others.
2012-02-10 42Mb/s DC-HSPA+ expands, more being deployed
DSA stated that 483 operators have committed to deploy HSPA systems in 181 countries while more than 41 percent of HSPA operators have commercially launched HSPA+.
2012-02-10 GaN-on-Si tech cuts HB-LED cost by 80%
Plessey acquired CamGaN in order to use its proprietary 6in GaN-on-silicon technology that claims to cut scrap rate and batch time.
2012-02-10 Samsung, Cadence partner in nanometer SoC design
Samsung, Cadence partner in nanometer SoC design
2012-02-10 White LEDs offer up to 148lm/W at 85°C
Cree's XLamp XT-E white LED comes in a 3.45 x 3.45mm footprint and claims push LED adoption and lower cost.
2012-02-10 Optical connectors geared for medical systems
The MediSpec hybrid circular MT cable and receptacle system comes in a lightweight metal housing and offers EMI shielding.
2012-02-09 FujiPanaRene: Clinging to the wreckage
Can this radical move make economies of scale for both Japan and Abu Dhabi, or is it a move that is not radical enough; two people afloat clinging to each other in the hope they can each save the other from drowning.
2012-02-09 Japan Inc. swims in troubled seas
Japan Inc. swims in troubled seas
2012-02-09 Mindspeed, Picochip finalize acquisition
Mindspeed's acquisition of Picochip will establish its position as one of the leaders in small cell wireless technology for next-gen mobile broadband communications.
2012-02-13 Implement multitouch sensing in automotive apps
Implement multitouch sensing in automotive apps
2012-02-09 LED drivers with PWM dimming for LCD backlight
The HV9989 is powered by a built-in 40V linear regulator and has three 1MHz transconductance amplifiers.
2012-02-09 Power controller optimized for AC/DC, DC/DC design
TI's UCD3138 combines a 32bit microprocessor, high-speed precision data converters and multiple programmable hardware control loops in a 6 x 6mm package.
2012-02-09 Recovery for solar inverter market seen this year
Despite a stall in market growth last year, solar inverters are forecasted to increase by five percent to 24.5GW.
2011-02-08 Rambus acquires non-volatile memory developer
The acquisition would make for a good fit with Rambus because Rambus is a technology licensor itself and it is not expected that the company will compete in the memory chip business directly.
2012-02-08 Cylindrical lithium battery prices remain stable
Manufacturers have adjusted their production and have stocked up components in January and this has stabilized the prices of cylindrical lithium battery cells.
2012-02-07 Micron CEO dies in a plane crash
Micron CEO dies in a plane crash
2012-02-07 AMD: Ready for a comeback
At AMD's financial analyst meeting, CEO Rory Read emphasized that the company is ready to fight in the ever-changing computer arena.
2012-02-06 TSMC to roll 3D IC assembly service next year
The company has one year to get all physical design kits and EDA support in place to allow customers to design with COWOS, the technology standing for chip on wafer on substrate.
2012-02-03 Sony CEO steps down
Sony's CEO Howard Stringer will hand over the reins to Kazuo Hirai, a games and music veteran in the company.
2012-02-09 Efficient power electronics is key to widespread HEV adoption
Learn about the factors that contribute to the achievement of maximum power density in automotive power electronics.
2012-02-03 RSE measurement sol'n touts 80dB dynamic range
The R&S OSP-B155 plug-in module with 155dBm/Hz sensitivity claims to simplify measurement of radiated spurious emissions on LTE devices.
2012-02-03 Wireless ousts PCs as top OEM spending area
Global spending by the world's top OEMs on microchips for wireless products reached $58.6 billion last year, up 14.5 percent from $51.2 billion in 2010.
2012-02-03 Mobile tech to boost smart device market thru 2015
Portable consumer electronics such as smartphones, tablets and notebooks will grow with CAGR of 25.7 percent in the next three years.
2012-02-08 Lengthen operational lifetime of hybrid/EV battery packs (Part 2)
In this installment, we'll look at the control algorithm and the results of lab tests.
2012-02-09 Agilent Medalist i1000D with JET board handler
Learn about Agilent Medalist i1000D with JET board handler touted to enable in-circuit test in a fully automated environment.
2012-02-08 Debugging MIL-STD 1553 serial buses with InfiniiVision 3000 X-Series
Read about the MIL-STD 1553 triggering and decoding, as well as eye-diagram mask test capabilities in Agilent's InfiniiVision 3000 X-Series oscilloscopes.
2012-02-02 Nokia Siemens slashes Germany, Finland workforce
Nokia Siemens Networks is currently in talks with labor unions in its Germany and Finland sites about slashing more than 4,000 jobs.
2012-02-02 Sharp cuts LCD panel output
Sharp Corp. is planning to cut into half its LCD panel output at its Sakai facility in Osaka, Japan, according to a report by the Nikkei business daily.
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NXP Semiconductors CTO René Penning De Vries discusses with EE Times Asia how high performance mixed signal technology can shape the future.

Peek at Hot Gadgets for 2012
Smart energy "Try explaining to your eight-year-old son that instead of an Xbox, you got him a Wi-Fi enabled smart energy thermostat to help minimize his energy consumption and carbon footprint..."
 

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