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| 2006-10-05 | IBM processors, IP cores address heat issues IBM unveiled low-power versions of its RISC-based microprocessor line and P processor cores designed to reduce the problematic heat issues in data centers and embedded systems. |
| 2006-08-31 | Power module delivers efficient heat management With its new DC/DC power module, SR POWER said R&D engineers need not worry about system temperature or make modifications of the mechanical structure because of thermal issues |
| 2002-01-23 | Heat challenge overcome American Power Conversion's NetShelter VX enclosures address the issues of increasing power densities, cable management and poor rack ventilation in computer room environments |
| 2013-01-11 | Easing thermal management design, production Thermal management, whether the end user is the military, aerospace industry or Silicon Valley, should entail extremely close association and planning at all stages. |
| 2007-07-02 | Power connectors maximize cooling in hot ICs To optimize a system design and solve thermal problems, an engineer has to look at elements other than connector design—such as the amount of copper on the board—that can help draw heat away from the connector interface |
| 2000-12-01 | Deep signal and design integrity assured in SoCs This technology news article describes the issues related to SoC designs and the corresponding solution to each |
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1Tech Watch
Research reveals self-assembling super-nano plastic fibers
The researchers studied a material made from copper and selenium that exhibits liquid-like behaviors due to...
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