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2009-01-22 New-gen ULC handset platform unveiled
New-gen ULC handset platform unveiled
2008-11-21 Infineon optimizes mobile phone chips
Infineon Technologies has introduced its latest chips for ultralow cost (ULC) mobile phones that optimizes system performance five times and reduces the BOM by almost 10 percent.
2008-09-01 Mobile Internet Edges into ULC market
Mobile Internet Edges into ULC market
2008-07-16 Conquer ULC handset design challenges
Conquer ULC handset design challenges
2008-03-03 Ultralow-cost phones ring in chip opportunities
The growth of the ULC handset market is changing the dynamics of the handset business. Traditionally, a handset manufacturer would rely exclusively on one vendor to supply chips for all its phones but ULC phones are changing this model.
2008-02-12 NXP chip brings triband, Bluetooth to ULC handsets
NXP chip brings triband, Bluetooth to ULC handsets
2007-10-11 NXP picks CEVA DSP core for ULCH solutions
NXP has selected the CEVA-Teak DSP core for its highly integrated ultralow-cost single-chip solutions targeting low-cost and entry-level handset designs for emerging markets.
2007-03-06 65nm GSM solution targets ULC handset market
65nm GSM solution targets ULC handset market
2006-06-02 Haier selects Philips design for low-cost cellphone market in China
Philips announced that Haier, a handset manufacturer in China, has selected the Philips Ultra Low Cost Reference Phone for its HG-Z1000 cellphone.
Interview

NXP CTO reveals HPMS strategy

NXP Semiconductors CTO René Penning De Vries discusses with EE Times Asia how high performance mixed signal technology can shape the future.

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