|2012-02-23||Intel showcases Ivy Bridge
Ivy Bridge packs 1.4 billion transistors into 160mm2 in its largest version. According to Intel, they plan to release at least four major variants of the chip.
|2013-02-21||Ultrabook, ultrathin to gain threefold market share increase
This year, Ultrabooks and other ultrathin PCs will triple their penetration of the notebook market as their pricing comes down and consumers warm to the flashy convertible form factor, said IHS.
|2011-12-22||Stage is set for AMD-Intel 2012 product wars
A bigger shift in the AMD-Intel battle will come in 2012, when the two companies release their next-generation offerings, said analyst Nathan Brookwood.
|2011-05-09||Intel transistor uses 3D structure
Intel has released a 3D transistor design called Tri-Gate into high-volume manufacturing at the 22nm node in an Intel chip codenamed 'Ivy Bridge.'
|2012-06-08||Intel finFETs show variability, need SOI for scaling
GSS has concluded that Intel may need to turn to SOI wafers to scale its FinFETs below 22nm, which may have implications for foundries that are yet to introduce FinFET technology into their chip manufacturing processes.
|2012-05-08||COM Express modules use improved Intel 7-series chipset
The first products of these module families are equipped with the quad-core IntelCore i7-3615QE processor with 45W thermal dissipation power (TDP) and the Intel Core i7-3612QE processor (35W TDP).
|2012-05-23||Analysis reveal Intel finFETs' triangular structure
The triangular section is markedly different to the idealized rectangular section that Intel had shown previously in 2011.
|2011-09-16||Intel details its first 22nm processor
The company gave its first public disclosure of Ivy Bridge, which features improvements in on-board graphics and advances in power management and security.
The researchers studied a material made from copper and selenium that exhibits liquid-like behaviors due to...