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2012-02-01 I/Q demodulator offers 700MHz to 3GHz frequency
I/Q demodulator offers 700MHz to 3GHz frequency
2012-01-30 LDO regulator works from 0.5-3V
The XC6603/XC6604 series has integrated N-ch driver transistor that allows the minimum I/O voltages of the devices to be much lower than traditional LDOs with integrated P-ch transistors.
2012-01-27 US manufacturing downfall, Asia's gain
According to the Times report, the reason why the jobs for manufacturing consumer devices are gone for good in the U.S. is because the country's manufacturing base has failed to evolve.
2012-02-03 Comparison of Maxim DS323x RTCs
Know the differences between several real-time clocks offered by Maxim Integrated Products.
2012-01-25 Fanless computer optimized for 3G/WiFi/BT/GPS
ADLINK's MXE-5300 is based on Intel's quad-core processor geared for intelligent transportation and factory automation applications.
2012-01-10 COM Express dev't board targets rugged apps
The COM Express Reference Carrier-i Type 10 for COM Express mini COMs is validated for use from -40°C to 85°C.
2012-01-09 Development board for COM Express module
The COM Express Reference Carrier-i Type 10 for COM Express mini COMs is validated for use from -40°C to 85°C.
2011-12-27 Industry screw-ups of 2011
This year will be remembered for its share of missteps in the electronics world. EE Times has compiled a list of 10 blunders from 2011 that we believe will be remembered for years to come.
2011-12-22 Sematech details 3D IC tech hurdles
Sematech has identified heterogeneous computing, memory, imaging, smart sensor systems, communication switches and power delivery/conditioning as some of the potential future killer applications
2011-12-14 3-chip stack combines DRAM, SoCs
As an effort to push 3D integration, engineers used TSVs to link a wide I/O DRAM and two identical multicore SoCs in a device that can support 12.8GB/s of memory bandwidth.
2011-11-24 Power transistors tout 20-80VCEO range
NXP's medium power transistors have collector current capability IC up to 2A and ICM up to 3A.
2011-11-16 SAR ADCs offer I/O voltages from 1.8-5V
SAR ADCs offer I/O voltages from 1.8-5V
2011-11-10 My head is in the clouds, but will my feet stay on the ground?
I suspect the cloud and cloud computing will become another useful option and tool, one which engineers and businesses will choose when appropriate and suitable.
2011-10-26 Bus buffers provide high noise margins, stuck bus recovery
Linear Technology has introduced the LTC4313 and LTC4315, hot swap I2C bus buffers that provide high noise margins, level shifting, and stuck bus recovery.
2011-11-01 FPD-Link III SerDes with bidirectional control channel for I2C
FPD-Link III SerDes with bidirectional control channel for I2C
2011-10-19 Employ I2C on Kinetis, Coldfire+
Employ I2C on Kinetis, Coldfire+
2011-10-11 Price challenges hinder TSV adoption
In order for chip stacks using high density through-silicon vias (TSVs) to be used in high volume devices, major price adjustments should be done.
2011-10-11 One lesson we learned from Steve Jobs
The biggest lesson I think the electronics industry took from Steve Jobs is the boldness of his vision—his willingness to truly reach for the brass ring.
2011-10-11 Farewell to Steve Jobs
I feel very sad at the moment. Steve was far too young to die. I wish him well on the next stage of his journey whatever that might be.
2011-09-14 Fundamentals of MC13892 charger operation
Know the basics of the charger operation of MC13892 (PMIC for i.MX series). This document provides a checklist for charger troubleshooting that can be used during the design stage.
2011-09-09 Survey shows Taiwan aids China's fabless firms
Fabless chip companies from China are turning to Taiwan to help them compete globally, according to a survey conducted by EE Times-China.
2011-09-07 Monitoring device incorporates 14bit ADC
Linear's integrated monitoring solution can simultaneously and seamlessly measure temperature, voltage and current.
2011-08-30 Keypad controllers boast low current drain
Analog Devices' ADP5585 and ADP5589 general-purpose input/output port expander and keypad matrix controllers are for devices that require expanded I/O lines or mechanical keypads up to QWERTY size.
2011-08-26 Giant chip vendors face patent lawsuit
Power Management Systems is suing Intel, Freescale and Marvel for allegedly violating its copyright contents, specifically the companies' Atom Z6xx, i.MX515 and PXA940 ICs.
2011-08-26 Corelis, NI offer integrated JTAG solution
Corelis and NI are offering a JTAG solution that provides a seamless path for deploying boundary-scan test and programming capabilities.
2011-09-01 Current drain measurements of i.MX53 SoC
Current drain measurements of i.MX53 SoC
2011-08-24 JEDEC announces DDR4 standard specs
The DDR4 memory chip standard will include three data width offerings, differential signaling, data masking and a new termination scheme, says JEDEC.
2011-08-23 Hot Chips showcased robots, next-gen servers, processors
Robots, processors and Ethernet chips were showcased on the last day of Hot Chips, showing how far technology has gone and what lies ahead in the future.
2011-08-18 ASIX acquires MosChip assets
ASIX's acquisition of MosChip's assets will enhance its embedded networking and connectivity products portfolio.
2011-08-09 Computer subsystems operate in 55°C
A new family of 3U CompactPCI multi-platform computer subsystems feature cost efficient I/O, performance and environmental applications in unique, demanding military programs.
Interview

NXP CTO reveals HPMS strategy

NXP Semiconductors CTO René Penning De Vries discusses with EE Times Asia how high performance mixed signal technology can shape the future.

Peek at Hot Gadgets for 2012
Smart energy "Try explaining to your eight-year-old son that instead of an Xbox, you got him a Wi-Fi enabled smart energy thermostat to help minimize his energy consumption and carbon footprint..."
 

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