What is CMOS technology?
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| 2012-02-01 | Level translator supports Secure Digital 3.0 ST's voltage-level translator incorporates 15kV air-gap electrostatic discharge protection geared for portable consumer electronics. |
| 2012-01-30 | TSMC fires back at analysts Marced did acknowledge that each process node roll out has problems but said TSMC engineers rise to the challenges. |
| 2012-01-30 | Team-up unveils Si-photonics biosensor ICs Imec and Genalyte have developed a disposable silicon photonics biosensor chip that allows for high levels of multiplexed biosensing. |
| 2012-01-27 | Small hyperspectral imaging sol'n unveiled Imec's camera solution boasts 100 spectral bands between 560nm and 1000nm, and filters with 85 percent transmission efficiency. |
| 2012-01-26 | Startup tries many-core revolution Kalray's chip is expected to deliver about 200GOPS at 400MHz clock frequency and a maximum performance of about 500GOPS at power consumption of about 5W. |
| 2012-01-20 | Partnership to thwart counterfeit chips The partnership between CNSE and APDN will support research, development and deployment of authentication protocols and procedures in established process flows. |
| 2012-01-12 | Intel announces Lenovo, Motorola deals Intel has officially rolled out the details of its Medfield 32nm platform for smartphones. The company has also announced partnerships with Lenovo and Motorola. |
| 2011-12-14 | SRAM boasts operation as low as 0.425V Fujitsu Semiconductor and SuVolta have cut the power consumption of SRAM blocks by cutting CMOS transistor threshold voltage variation by half. |
| 2011-12-06 | Production begins for 128GB/s hybrid memory cube IBM's 3D chip-making process, the 32nm TSV technology, will create Micron's Hybrid Memory Cube. |
| 2011-12-01 | Alliance to hike photonics IC performance The Institute of Microelectronics, Globalfoundries and Alcatel-Lucent join forces to advance silicon chips designed to support high speed, high bandwidth optical communications. |
| 2011-12-01 | Euro project to up THz sensor capability The TeraTOP project aims to develop a device that can reduce the cost and improve the capability of terahertz (THz) imaging in security applications. |
| 2011-10-19 | Samsung ramps A6 production for Apple Apple still continues to rely on Samsung's foundry operations for the production of its A6 processor. |
| 2011-10-12 | Japan chip industry needs to 'refocus' In order to turn around the decline of Japan's semiconductor industry, an advisor suggests a manufacturing shift to MCUs, NAND flash and CMOS sensors. |
| 2011-09-30 | 1.6GHz LNAs geared for GPS devices The CMOS-process based LNAs from Torex have operating voltage range of 1.71-3.63V. |
| 2011-09-26 | Graphene succeeds CMOS tech Graphene succeeds CMOS tech |
| 2011-09-26 | Specialized foundry processing yields high-performance analog IC Learn about the impact of foundry process on achievable specifications. |
| 2011-09-26 | 20nm process features HKMG tech Samsung is set to unveil its 20nm planar process that uses standard bulk CMOS. |
| 2011-09-21 | Graphene enables 2GHz doubler IC IBM has developed a CMOS-compatible manufacturing process technology that integrates graphene transistors on silicon wafers. |
| 2011-09-02 | Triple voltage CMOS process targets mixed-signal apps Triple voltage CMOS process targets mixed-signal apps |
| 2011-09-02 | 180nm CMOS process targets analog, power ICs 180nm CMOS process targets analog, power ICs |
| 2011-08-29 | CMOS-based RF transmit module touts longer talk time CMOS-based RF transmit module touts longer talk time |
| 2011-08-08 | Tower moves SBL13 process to Israel Specialty foundry Tower has decided to move its SBL13 process to Israel, giving way to development of their SiGe technology and sourcing capability for customers. |
| 2011-08-08 | Sensor built on 1.1µm OmniBSI-2 pixel architecture OmniVision's 8-megapixel OV8850 is a CameraChip sensor built on a 1.1µm OmniBSI-2 pixel architecture. |
| 2011-08-04 | Korean fab teams up with Chinese startup Dongbu HiTek has announced that it has begun producing BYD Microelectronics' high dynamic range (HDR) CMOS image sensor (CIS) chips. |
| 2011-07-14 | FPGA family boasts 16K logic cells SiliconBlue Technologies has introduced the iCE40 "Los Angeles" mobileFPGA family that is fabricated on TSMC's 40nm low-power standard CMOS process. |
| 2011-07-12 | Pin FMEA for HEF4000 family Read this Failure Modes and Effects Analysis (FMEA) for the device pins of the NXP Semiconductors' HEF4000 family under typical failure situations. |
| 2011-07-11 | Pin FMEA for AUP family Here's a Failure Modes and Effects Analysis (FMEA) for the device pins of the NXP Semiconductors' AUP family under typical failure situations. |
| 2011-07-01 | Adesto set to ship Altis-made CBRAMs Backed by Altis, Adesto will ship CBRAM-based devices in 2011, specifically a 1Mb serial EEPROM drop-in replacement in 130nm CMOS, and develop standalone CBRAMs and embedded memory cores for licensing. |
| 2011-06-30 | NVM solution targets 180nm process tech Aimed at wireless, RFID, and analog and mixed-signal SoC designs, the DesignWare AEON NVM IP is implemented in standard CMOS process technology with no additional mask or process steps required. |
| 2011-06-28 | 28nm CMOS supports WLAN, Bluetooth 28nm CMOS supports WLAN, Bluetooth |
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