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  • Wi-Fi chipset shipment heads for an 18 billion gain (2014-05-06) [ RF/Microwave ]
    Shipment for Wi-Fi chipsets is predicted to grow many times over, reaching 18 billion by 2009 from a mere 2.6 billion, spurred by an evolution that matches the pace of the lively technology landscape.

  • GaN-on-Si gathers pace as more players enter the market (2014-04-25) [ EDA/IP ]
    The IP landscape in the area of GaN-on-Si is said to be at a stage where mass production could be initiated. Patents held by TDK, Fujitsu, Toyoda Gosei and the University of Nagoya reflect material improvements that address dislocation density and warpage on a GaN-on-Si-based wafer.

  • Memory spurs global chip revenue growth (2014-04-24) [ Manufacturing/Packaging ]
    Memory chips recorded a robust performance, with DRAM and NAND flash revenues jumping by 32.5 and 24.2 per cent respectively. Prominent memory supplier performers include Micron who rose six places towards the fourth place, and SK Hynix who ascended from seventh to fifth.

  • Cadence emerges as fourth largest IP core supplier (2014-04-24) [ EDA/IP ]
    Strong IP and acquisition strategies placed Cadence as the fourth among the top semiconductor IP core suppliers in Gartner's 2013 ranking, with 5.1 per cent revenue share. ARM led with 43.2 per cent, followed by Synopsys and Imagination Technologies respectively.

  • MRAM plots a 50 per cent CAGR increase (2014-04-23) [ Memory/Storage ]
    In addition to its non-volatile appeal, the growth is seen to be driven by power savings from storing data using magnetic element, yielding $246.3 million by 2019.

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