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Bits and bytes
News & Trends (Sorted By Date)
- Analog isn't dead, says industry vet (2005-04-18)
- Agilent simplifies test-system design with latest program (2005-03-31)
- CAD tools shrink small world of MEMS design (2005-03-16)
- Retasking automotive sensors (2005-03-16)
- Don't pay much for mixed-signal tools (2005-03-16)
- Semiconductor aerogels advance sensors (2005-03-16)
- TI, Sling to create consumer electronics device (2005-02-28)
- Consumer electronics driving storage growth (2005-02-28)
- Philips to tweak reference designs for Indian market (2005-02-25)
- Sharp, PACE soft silicon deliver multimedia decoding software (2005-02-25)
- TI, Wintech offer videophone development platform (2005-02-25)
- Samsung commences production of MCP for mobile apps (2005-02-24)
- Wolfson shrugs off China blues to score strong growth (2005-02-24)
- Sasken to team with Philips on Nexperia platform (2005-02-24)
- Alcatel, Microsoft to collaborate on IP television (2005-02-24)
- AUO raises utilization rate to 95 percent (2005-02-23)
- DigRF compliant radio extends cellphone talk time by 20 percent (2005-02-23)
- Panasonic touts tottering plasma display technology (2005-02-22)
- Freescale, Samsung demonstrate UWB-enabled cellphone (2005-02-22)
- NEC adopts Agilent's W-CDMA power amplifier into 3G handset (2005-02-21)
- Renesas RF system simplifies Samsung mobile handset (2005-02-18)
- Agilent optimizes wireless video services with test capabilities (2005-02-17)
- Comms, consumer electronics lead tech trends (2005-02-16)
- Conexant tips MPEG coder for STBs (2005-02-16)
- Auto industry finds partners for backseat video (2005-02-16)
- ADI revs signal converters (2005-02-16)
- Nokia signs licensing agreement with Macromedia (2005-02-15)
- Infineon, Samsung team on Linux smartphone design (2005-02-15)
- Solutions for Mobile Phones- National Semiconductor (2005-02-14)
- Cypress, Conexant to deliver USB Bus-powered solution (2005-02-14)
- SigmaTel, Matsunichi forge strategic partnership (2005-02-11)
- Experts chime in on future of camera phones (2005-02-11)
- BOE OT commences LCM production at 5G line (2005-02-10)
- Agilent gains Wavics, builds mobile center in Korea (2005-02-10)
- South Korean makers focus on LCD backlight designs (2005-02-10)
- Epson develops LCD controller with Qualcomm MDDI (2005-02-08)
- Antenova integrates antenna, RF components into single module (2005-02-08)
- Philips commences Nexperia based EDGE handsets (2005-02-08)
- TI digital technology supports MMC wireless audio module (2005-02-08)
- Flextronics acquires Agilent camera module business (2005-02-08)
- Russian firm seeks stake in Indian wireless firm (2005-02-08)
- ST won't have 'single-chip' cellphone integration until 2007 (2005-02-07)
- Nanoscale latch could replace transistor, claims HP (2005-02-04)
- Falanx targets handheld graphics (2005-02-04)
- TI, RadioScape to provide tech for Digital Radio Mondiale (2005-02-03)
- Boe Hydis announces double mobile LCD brightness (2005-02-02)
- 3G integration not a linear progression (2005-02-01)
- 2.5G, 3G converge in a 'world handset' (2005-02-01)
- The System Advantages of Low-Power Microcontrollers in Line-Powered (2005-01-31)
- Microsemi ICs support IEEE802.11n Wi-Fi systems (2005-01-31)
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