Interface Design: [Interface Design/News & Trends][Page 9] News, Tech Articles, App Notes

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[ Jul 19, 2008 ]

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This tech room features articles on how to interface electronic components such as microprocessors, DSPs, FPGAs and memory modules to come up with a reliable consumer electronics application.

Market Watch

iPhone 3G still packs some surprises
Aside from some very surprising component choices in key parts of the upgraded communications section, as well as some software improvements and some basic design tweaks, the old adage 'if it ain't broke, don't fix it' has clearly shaped the design of Apple Inc.'s iPhone 3G.

News & Trends (Sorted By Date)
•	Analog switches target feature-rich cellphones (2003-12-16)
•	HARTING enters strategic alliance with LPKF (2003-12-15)
•	Plug-and-play embedded modules rest on FPGAs (2003-12-11)
•	NEC launches TIS optical cable network (2003-12-04)
•	QuickLogic purchases IP cores from Quest Innovations (2003-12-03)

•	Formal tool verifies Amba bus protocol (2003-12-01)
•	Nanowires formed using extrusion technique (2003-11-19)
•	Embedded multimodal systems tell a good story (2003-11-17)
•	Tomen backs Fujitsu supercomputer project (2003-11-13)
•	StarGen adopts Rambus technology for its switches (2003-11-12)

•	K&S, Nidec Tosok form joint development alliance (2003-11-12)
•	Yageo to increase investment in mainland China (2003-11-12)
•	Stratos completes purchase of Sterling Holding (2003-11-10)
•	Hybrid tunnel diodes could leapfrog Moore's Law (2003-10-31)
•	Indian makers have available capacity for exports (2003-10-29)

•	Oplink to acquire RedClover Networks (2003-10-24)
•	Mobility Electronics signs license pact with OQO (2003-10-23)
•	Novellus Systems co-establishes research center in China (2003-10-20)
•	Fujitsu Siemens adopts LSI solutions (2003-10-10)
•	ARM, NSC jointly launch interface spec (2003-10-09)

•	SaRonix becomes Pericom company (2003-10-07)
•	Cypress signs MSC as distributor in Europe (2003-10-02)
•	Synopsys, Artisan partner on PCI express solutions (2003-09-17)
•	Chipmakers look for new ways to take PC's temperature (2003-09-17)
•	Northrop Grumman opens plant for array antennas (2003-09-09)

•	Pacific Digital adopts Agere interconnect technology (2003-09-09)
•	Locus Comms, Avaya target multi-size IPCCs (2003-09-03)
•	ERNI releases new field bus connector catalog (2003-09-03)
•	EFM paves way for broadband move in Asia-Pacific (2003-08-29)
•	Westell modems to feature TI ADSL router-on-a-chip (2003-08-27)

•	Tyco, Samtec ink source supplier agreement (2003-08-27)
•	Standard metric for silicon IP quality emerges (2003-08-25)
•	Ubiquity, Convedia collaborate on SIP apps (2003-08-21)
•	VSI Alliance adds new members (2003-08-12)
•	PalmChip bus patent threatens most SoCs (2003-08-06)

•	Furukawa, Sumitomo to consolidate wireless ops (2003-08-05)
•	Specification targets clock distribution (2003-08-01)
•	Getting max packet processing throughput per app flow (2003-08-01)
•	ALi adopts Rambus PCI Express technology (2003-07-30)
•	Kathrein Werke, Powerwave form strategic alliance (2003-07-29)

•	Jungo, Vmetro collaborate on verification tool (2003-07-29)
•	Group develops enhanced IEEE 1394-GbE links (2003-07-22)
•	Cable modem service subscribers hit 27M (2003-07-18)
•	Tebian Electric, Luneng to form cable venture (2003-07-17)
•	The realities of optical network design (2003-07-16)

•	A case for using hybrid optical switching in long-haul networks (2003-07-16)
•	Improving optical switching with independent control planes (2003-07-16)
•	On-chip sensing stabilizes micromirror (2003-07-16)
•	Photonics: A gamble that will pay (2003-07-16)
•	Toshiba to build engineering firm in Kawasaki (2003-07-14)

676 Records, Total 14 Page, The 9 Page
Article review
5 • 6 • 7 • 8 • 9 • 10 • 11 • 12 • 13

Highly Recommended Articles

•	iPhone 3G still packs some surprises (2008-07-15)
•	Numonyx, Elpida forge memory foundry deal (2008-07-11)
•	SunPower to build 35MW solar power plants in U.S. (2008-07-14)
•	Wireless sector battles the doldrums (2008-07-11)
•	60GHz spec conflicts remain unsettled (2008-07-10)

Talkback

eeForum:
Demystifying Vietnam
What does Vietnam offer that a rising number of top-tier semiconductor companies are setting up and expanding operations there?

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India Newsletter

1.Board design becomes a nimble giant

2.ECAD-MCAD needs unified solution

3.Smart optical nets power enterprise

4.Fibre-optic networking

Top Ranked Articles

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•	iPhone 3G still packs some surprises
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•	TVS device guards high-speed data interfaces
•	DesignWare IP tool supports SATA 3.0
•	TI positions analog front-end for portable ultrasound
•	Timing devices extend UMPC battery life, signal range
•	NI aims dual GbE interface at PXI Express
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