News & Trends (Sorted By Date)
- Credence validation system purchased by U.S. government (2003-11-20)
- Amkor, ASAT ink patent cross-license agreement (2003-11-18)
- Compeq-ASC Group form chip company in Taiwan (2003-11-17)
- LTX receives multiple system orders from ASE (2003-11-13)
- King Yuan to deploy Credence networking test platform (2003-11-10)
- Amkor qualifies IC packages for consumer products (2003-11-04)
- Sony, Docomo to jointly develop smart-card phones (2003-10-29)
- Feinfocus appoints Inimar as distributor in Denmark (2003-10-28)
- Hitachi reorganizes manufacturing systems businesses (2003-10-27)
- DenMOS, ChipMOS sign assembly, testing pact (2003-10-24)
- Agilent, HUST establish test lab in China (2003-10-09)
- Life-long testing prescribed for chips (2003-10-03)
- Setram to acquire Agilent test, measurement products (2003-09-29)
- ASAT relocates U.S. headquarters (2003-09-29)
- FSI launches technology for front-end processing (2003-09-26)
- EGLS announces new automatic probing technology (2003-09-26)
- Teseda takes part of LVReady program (2003-09-24)
- Verification, test providers form outsourcing body (2003-09-24)
- K&S opens first manufacturing facility in China (2003-09-22)
- Amkor to increase test capacity in Taiwan (2003-09-19)
- Cascade Microtech establishes office in Singapore (2003-09-16)
- Toshiba deploys Keithley IC test system (2003-09-15)
- Chipmos to expand FBGA, TSOP monthly outputs (2003-09-05)
- Chip package venture established in Jiangyin (2003-09-05)
- TriQuint, Amkor partner on flip-chip process (2003-08-27)
- Agilent co-establishes China IC testing center (2003-08-26)
- Hong Kong technology park selects Credence solutions (2003-08-26)
- Huawei, magic4 launch MMS IOT service in China (2003-08-21)
- ASAT Holdings completes phase one of new China plant (2003-08-20)
- Mikros Systems obtains contract from U.S. Navy (2003-08-20)
- Leybold Optics expands product portfolio (2003-08-20)
- Teradyne granted 5-year contract by U.S. government (2003-08-15)
- ITC 2003 to focus on MEMS technology (2003-08-14)
- Renesas taps ChipMOS for assembly, testing services (2003-08-13)
- Sanmina-SCI receives ISO 9001:2000, TL 9000 nod (2003-08-12)
- Agilent launches ISO 17025-compliant services (2003-08-11)
- Amkor, UTAC forge test alliance eyeing China (2003-08-07)
- CATC boosts presence in the west coast (2003-08-06)
- Infineon to deploy Agilent test system (2003-08-06)
- Simtek goes lead-free in SRAM packaging (2003-08-05)
- Aeroflex acquires wireless test solutions provider (2003-08-04)
- Aehr Test obtains additional U.S. patents (2003-07-31)
- Infineon co-establishes IC test firm in China (2003-07-30)
- NEC sets Agilent tools as RFIC design standard (2003-07-30)
- IR, Sanyo, team up for power efficiency in motor control (2003-07-25)
- LHWT Micro tests WLAN chip on Agilent system (2003-07-24)
- Japan opens joint test line for 90nm designs (2003-07-23)
- ATE executives sees future in consolidation (2003-07-22)
- Design-for-test has multiple dimensions, experts say (2003-07-22)
- Amkor to deploy Credence wireless test systems (2003-07-18)
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