News & Trends (Sorted By Date)
- Flextronics starts Mexico tech center operations (2002-12-12)
- Silicon Lab modem supports Matsushita phone (2002-12-11)
- Coherent acquires laser test equipment company (2002-12-11)
- Northrop adopts Credence debugging system (2002-12-09)
- SEZ expands market to China (2002-12-09)
- King Yuan adopts LTX platform for RF testing (2002-12-06)
- ASE rolls out packaging technology for RFICs (2002-12-06)
- ATMI signs Aicello as Japan service provider (2002-12-05)
- Credence to acquire Optonics (2002-11-29)
- Telecom test project stirs interest at Ixia (2002-11-29)
- ISE deploys Credence SoC platform (2002-11-28)
- Taiwan IC industry up by 40 percent in Q3 (2002-11-28)
- Innovative optical imaging method seen to lower IC test costs (2002-11-27)
- Credence gives up DCI subsidiary (2002-11-27)
- Ralink selects Credence test system for WLAN apps (2002-11-26)
- Agere adopts Teradyne systems for SoC testing (2002-11-26)
- Electroglas expands distribution pact with Hakuto (2002-11-25)
- Compal GPRS handsets to feature Skyworks transceiver (2002-11-25)
- Optonics devices chosen to test Motorola devices (2002-11-25)
- ASE develops Cadence-based package design flow (2002-11-25)
- Oki brings environment-friendly packaging to its facilities (2002-11-22)
- SwRI develops vehicle simulation equipment (2002-11-22)
- Actel turns to ecologically friendly packaging (2002-11-21)
- Shipley purchases SUSS lithography equipment (2002-11-20)
- Agilent co-develops Boston University photonics lab (2002-11-18)
- Standards eye functional verification (2002-11-18)
- Korea's Willtech sets sight on world measurement market (2002-11-14)
- VIA tests chipsets featuring Agilent 93000 SoC system (2002-11-14)
- Samsung adopts Credence test system (2002-11-13)
- Hynix adopts Mirae test handler (2002-11-12)
- Cypress Micro SoC supports Elektromed metering systems (2002-11-11)
- Digital Lightwave purchases Tektronix optical test line (2002-11-07)
- Shipley, Numerical Tech partner in low k1 lithography (2002-11-06)
- Telco purchases Motorola test equipment business (2002-11-05)
- ISMT, DuPont enter cross-licensing agreement (2002-10-25)
- Tessera expands Hitachi licensing contract (2002-10-25)
- DPAC, Tessera sign co-development agreement (2002-10-24)
- LSI Logic extends reach of wirebond packaging (2002-10-24)
- Ethertronics, Magnolia Broadband co-design CDMA solution (2002-10-23)
- Anam memory wafers to be tested on Agilent system (2002-10-23)
- Amkor, Fujitsu forego factory outsourcing proposal (2002-10-22)
- ISE Labs, MuAnalysis to provide test platforms in Canada (2002-10-22)
- Teradyne to test VIKO wireless devices (2002-10-21)
- Qualcomm licenses latest ARM core (2002-10-18)
- Sasken inks deals with mobile platform suppliers (2002-10-14)
- SIPEX to move test operations overseas (2002-10-14)
- LAN/WAN test equipment sales poised for growth (2002-10-11)
- Microstar adopts Tektronix measurement tools (2002-10-08)
- Innotech to market MODECH device modeling services (2002-10-07)
- Philips-Fairchild alliance to create packaging standard (2002-10-07)
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