News & Trends (Sorted By Date)
- Tektronix fully acquires Sony/Tektronix joint venture (2002-10-04)
- Teradyne to use Galaxy tools in tester platforms (2002-10-02)
- Happy worker: a company's greatest asset (2002-09-30)
- Anritsu, Flextronics partners for ATE solutions (2002-09-30)
- RFMD opens tape, reel facility in Beijing (2002-09-25)
- Spirent, UbiNetics enter strategic 3G partnership (2002-09-23)
- Cellon acquires Philips Consumer's R&D operations (2002-09-20)
- Fairchild establishes packaging design center in Korea (2002-09-20)
- SigmaTel to test codecs with Teradyne system (2002-09-19)
- Compal adopts Motorola i.250 GSM/GPRS platform (2002-09-18)
- Stratex Networks announces company name change (2002-09-18)
- Wi-LAN, Fujitsu Micro to codevelop SoC for wireless apps (2002-09-18)
- Neutron beam reveals new spin on magnetism (2002-09-18)
- VIA to use LogicVision test systems (2002-09-17)
- Design test offers Asian fabless competitive edge (2002-09-16)
- China IC design house purchases Credence equipment (2002-09-11)
- August delivers two additional wafer inspection systems (2002-09-10)
- Amkor to render manufacturing services to Agilent (2002-09-09)
- Atmel preps SiGe/BiCMOS process for RF apps (2002-09-09)
- Teradyne delivers optical test equipment to BISC (2002-09-06)
- TTChip to use Mentor Graphics design tools (2002-09-03)
- Synad adopts LTX, STATS technologies for WLAN chipsets (2002-09-02)
- Amkor, PMC-Sierra begin 2G flip-chip production (2002-08-30)
- Synopsys to acquire IC design verification firm (2002-08-30)
- PMC-Sierra performs interoperability tests (2002-08-29)
- Varian Semi receives control system patent (2002-08-23)
- LogicVision, SiidTech explore use of silicon fingerprinting (2002-08-22)
- UMC deploys Numerical mask qualification products (2002-08-19)
- Amkor qualifies Strand substrates for leadframe packaging (2002-08-19)
- Agilent to provide inspection solutions to Ismeca (2002-08-19)
- Motorola to market Winphoria switching products (2002-08-16)
- Infineon develops new chip stacking technique (2002-08-15)
- Intel servers to power Covisint automotive solutions (2002-08-09)
- Adaptive electron scope makes sub-angstrom measures (2002-08-09)
- Praxair forms semiconductor business unit (2002-08-07)
- ASAT to provide packaging solutions to Honeywell (2002-08-01)
- Chipbond, Fupo to combine package technology businesses (2002-07-30)
- ASE develops fine pitch wire bonding technology (2002-07-30)
- CMC licenses ARM design technology (2002-07-29)
- YDI, AMD to jointly market semiconductor storage, analysis products (2002-07-26)
- Kingston develops CSP technology for memory modules (2002-07-26)
- Microchip adopts Teradyne cell solution (2002-07-24)
- Intel, Advantest back open test platform (2002-07-24)
- Applied Precision receives patent for probe card analysis (2002-07-23)
- Semiconductor equipment market to see gradual recovery (2002-07-23)
- Oak Technology adopts Agilent SoC test system (2002-07-22)
- LogicVision certifies Teradyne testers 'Embedded Test Ready' (2002-07-22)
- Advantest to form consortium promoting open test architecture (2002-07-22)
- Tegal joins the IC packaging alliance (2002-07-19)
- Amkor, IBM partner on flip-chip technology offerings (2002-07-19)
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