News & Trends (Sorted By Date)
- LogicVision establishes engineering support division (2002-07-19)
- Amkor, MCT, Nextest demonstrate economical test technology (2002-07-18)
- Academic stimulates IC design in China (2002-07-17)
- ChipMOS develops high-speed wafer test technology (2002-07-16)
- TwinMOS, ACE forge alliance agreement (2002-07-16)
- RFMD, STATS adopt Teradyne test systems (2002-07-15)
- Matsushita licenses Nokia platform for multimedia handsets (2002-07-15)
- National Instruments: Offering virtual instrumentation-based solutions (2002-07-08)
- Unitive adopts Semitool's packaging platform (2002-07-05)
- MPI facility to adopt MicroTec's CL200 Fusion Bonder (2002-07-04)
- Advantest launches sales, marketing office in North America (2002-07-04)
- NEXX Systems joins SECAP (2002-07-04)
- IBM SiGe technology to be integrated into LeCroy oscilloscopes (2002-07-03)
- Infineon, Delta enter technology transfer agreement (2002-07-02)
- Nichia, Osram Opto enter patent cross license agreement (2002-06-28)
- BridgePoint, Credence to establish test technology center (2002-06-27)
- Catalyst Semiconductor rolls out lead-free packages (2002-06-25)
- Agere selects LTX test systems for RF facilities (2002-06-24)
- ATO Tech Bluetooth headset employs CSR technology (2002-06-24)
- ITI expands photomask operations (2002-06-21)
- Tomorrow's technology points to present-day solutions (2002-06-21)
- ChipMOS to build IC testing, assembly plant in Shanghai (2002-06-20)
- Credence, PSU establish program for electrical, computer engineering (2002-06-19)
- Aehr Test Systems signs up ZMC as China distributor (2002-06-18)
- ChipPAC develops CSP for handheld consumer applications (2002-06-18)
- IMS demos SoC solutions at DAC (2002-06-14)
- Teradyne partners with Test Insight for ATE development (2002-06-12)
- KLA-Tencor rolls system for gate dielectric processes (2002-06-10)
- Cognitronics, COMGATES complete interoperability testing (2002-06-10)
- ChipPAC designs five-stacked chips in 1.4mm package (2002-06-07)
- Lumenon forges fab deal with MTBSolutions (2002-06-05)
- Shanghai Hua Hong purchases Teradyne Integra J750 tester (2002-06-04)
- RF ICs, embedded memories to get airing at DAC (2002-06-03)
- ASAT establishes European headquarters in Munich (2002-06-03)
- Mentor Graphics Calibre to be integrated into TI's SoC designs (2002-06-03)
- MKS Instruments establishes techn center in San Jose (2002-05-31)
- Toshiba, Tessera sign expanded agreement for CSP (2002-05-31)
- August Technology acquires test equipment maker (2002-05-29)
- STATS develops thermally-enhanced PBGA (2002-05-28)
- Advantest adopts Synopsys TetraMAX ATPG technology (2002-05-24)
- Arrow signs agreement with L.S. Research (2002-05-23)
- Teradyne, Sony collaborate on cellular mobile test solution (2002-05-23)
- Communication test equipment makers unify business operations (2002-05-21)
- SMIC picks Electroglas probers to ramp up production (2002-05-17)
- Avant! partners with STMicro in IC, package design (2002-05-16)
- Amkor qualifies four 1mm-thin S-CSP products (2002-05-15)
- SoC test reels out of control (2002-05-14)
- Cadence allies with Credence to link design, test (2002-05-14)
- SDH device shipments to exceed 13 percent growth in 2002 (2002-05-13)
- LogicVision selects AMOS as a major distributor in Israel (2002-05-02)
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