News & Trends (Sorted By Date)
- Advantest to end distribution agreement with Tektronix (2002-04-30)
- Sanmina-SCI to buy certain EMS assembly operations from Siemens (2002-04-30)
- Virtual Silicon selects IMS test systems for embedded memories (2002-04-29)
- TCE adopts Numerical's Virtual Stepper for photomask inspection (2002-04-26)
- Amkor to take over Fujitsu assembly plant in Japan (2002-04-25)
- ChipMOS Bermuda buys TCP equipment from Walsin (2002-04-22)
- Newport to divest its metrology business (2002-04-18)
- Credence partners with China's IC design center (2002-04-18)
- Sanmina-SCI to provide manufacturing services to Altamar (2002-04-16)
- Microscope probes atomic wave functions (2002-04-12)
- 1394TA chief notes increased adoption of 1394 technology (2002-04-10)
- Tyco forges licensing pact with FCI (2002-04-09)
- Teradyne to present electronics solutions at Shanghai tradeshow (2002-04-05)
- ChipPAC, GSMC to deliver end-to-end products in China (2002-04-01)
- Global oscilloscope market hits $965M in 2001 (2002-03-28)
- Laboratory trains senior R&D specialists in telecom design (2002-03-26)
- That lost $60 billion (2002-03-26)
- ACCESS, Agilent to roll next-gen wireless test solution (2002-03-21)
- Multilink, IPAG collaborate on optoelectronic solutions (2002-03-21)
- Tektronix adds antenna test capability to its portfolio (2002-03-20)
- Kyocera develops lead-free solution (2002-03-20)
- Universal Communication signs technology deal with Anadigics (2002-03-19)
- FSA survey points to turnaround in wafer demand (2002-03-19)
- Fujitsu develops eight-stacked MCP (2002-03-18)
- Synopsys, ST deal to enable reduced SOC-test costs (2002-03-12)
- Tru-Si, OSE-USA codevelop high-yield stacked die chips (2002-03-11)
- CAS, Fenghua Hi-Tech establish microelectronic equipment venture (2002-03-11)
- Intertechnique migrates to Teradyne's functional test platform (2002-03-08)
- Zenocom to use CSR BlueCore for Bluetooth modules (2002-03-07)
- TIPI to continue expansion project in RP (2002-03-06)
- Fairchild Suzhou plant breaks ground (2002-03-06)
- DuPont buys 16.6 percent stake in Merrimac (2002-03-05)
- Nokia presses open platform strategy (2002-03-04)
- SKIMT to begin IMT2000 service next year (2002-03-01)
- ASE to develop 40µm super fine pitch bonding technology (2002-02-28)
- Wireless Futures partners with CSR for development of Bluetooth modules (2002-02-27)
- Amkor to purchase ball bonders from K&S (2002-02-27)
- USB-IF picks NI TestStand for USB 2.0 compliance testing (2002-02-26)
- Flextronics Design signs EMS deal with Ericsson (2002-02-22)
- OSE integrated with IBM WebSphere micro environment (2002-02-21)
- Operators said to slow 3G app rollout (2002-02-21)
- Dow Corning establishes thin-film technology platform (2002-02-18)
- Tektronix signs agreement with IBM (2002-02-11)
- IC test center breaks ground in Guangzhou, says MII (2002-02-08)
- Brooks Automation inks multi-year OEM agreement with Teradyne (2002-02-07)
- ChipPAC signs alliance deal with China wafer foundry (2002-02-07)
- Fu Sheng to set up lead frame production lines at China plant (2002-02-06)
- Mobiwave closes distribution agreement with Insight (2002-02-05)
- EMS firm Jabil to provide turnkey services to Tellium (2002-01-30)
- Sanmina-SCI to buy three European manufacturing plants from Alcatel (2002-01-29)
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