Test/Packaging: [Test & Packaging/Application Notes][Page 1] News, Tech Articles, App Notes

Market Watch

Wipro test facility rises in Bangalore
Wipro Technologies has launched Tarang, a product qualification and compliance certification facility, in Bangalore, India. The facility will enhance product quality; reduce time to market besides providing cost benefits. The investment in this facility is expected to be around $8.5 million.

Application Notes (Sorted By Date)

Clamping of high power RF transistors and RFICs in over-molded plastic packages (2009-07-01)
Flip-Chip 300µm recommendations for audio power amplifier (2009-06-16)
Power quad flat pack no-leads (PQFN) board mounting application note (2009-06-15)
Impact of X-ray inspection on Spansion flash memory (2009-04-23)
Dose minimization during X-ray inspection of surface-mounted flash ICs (2009-03-26)

Microchip CTMU for capacitive touch applications (2009-02-10)
Accurate measurement of LT5514 third order intermodulation products (2008-12-25)
Assembly and PCB layout guidelines for QFN packages (2008-10-22)
8 hints for better spectrum analysis (2008-10-16)
Best of 8 hints 1995-2008 for making better oscilloscope measurements (2008-10-08)

Assembly and PCB layout guidelines for chip-scale packages (2008-10-06)
Guidelines on leadforming, trimming lead length, and heatsink mounting (2008-06-30)
WLCSP assembly guidelines (2008-06-16)
Analyzing jitter using a spectrum approach (2008-06-13)
Quartz crystal oscillator implementation with PolarPro and Eclipse II (2008-05-23)

Automatic system for IC characterization: The DC approach (2008-05-16)
LITTLE FOOT TSSOP-8: The next step in surface-mount power MOSFETs (2008-05-08)
Attachment methods for the electro-mechanical SFN package (2008-03-13)
Thermal considerations for a UCSP package (2008-03-12)
DPOs deliver more signal information for faster design (2007-07-18)

Leadless leadframe package (2007-07-13)
Understanding flip-chip and chip-scale package technologies and their applications (2007-07-10)
Renesas 7542 group watchdog timer (2007-07-05)
Understanding high-speed ADC testing and evaluation (2007-05-31)
A design and manufacturing guide for Lead Frame Chip Scale Package (2007-05-31)

Power Quad Flat No-Lead (PQFN) package (2007-04-18)
Measuring a grounded impedance profile using the AD5933 (2007-04-17)
Temperature measurement theory and practical techniques (2007-04-17)
TCAP solution for converged networks (2007-04-16)
Four- and six-layer, high-speed PCB design for the Spartan-3E FT256 BGA package (2007-03-12)

Techniques for measuring RF gain using the MAX2016 (2006-06-02)
ISL84684ii CSP to DIP converter board with mounted IC (2006-06-02)
Assembling high-Pb DS2761 flip-chips in a Pb-Free assembly flow (2006-06-02)
Board mounting notes for SO8-flat lead (2005-06-22)
Board mounting notes for NIS6111 leadless package (QFN) (2005-06-22)

Board mounting notes for quad flat-pack no-lead package (QFN) (2005-06-21)
MicroPak soldering information (2005-06-09)
Assembling high-lead (Pb) DS2502 flip-chips in a Pb-free assembly flow (2005-06-08)
EMI immunity testing for automotive components (2005-02-01)
Characterizing the S-parameters of 75 circuits using 50 lab equipment (2004-11-24)

Replacing a powerCap module with a reflowable BGA module (2004-06-21)
Microfil wafer level underfilled chip scale package (2004-06-17)
Leadless leadframe package (LLP) (2004-06-17)
SCAN90CP02 design for test features (2004-06-17)
NanoStar & NanoFree 300µm solder bump wafer chip-scale package application (2004-06-16)

ADN2819 Evaluation Board (2003-12-22)
Surface Mount Assembly and Handling of ANADIGICS LPCC Packages (2003-10-03)
Using the AD9709, AD9763, AD9765, AD9767 Dual DAC Evaluation Board (2003-10-03)
ADN2830 Electrical Evaluation Kit (2003-10-03)
ADN2847 AC-Coupled Optical Evaluation Kit (2003-10-03)

153 Records, Total 4 Page, The 1 Page

Article review

1 • 2 • 3 • 4

Highly Recommended Design Articles

•	Battery chargers get charged from solar (2009-09-22)
•	Dealing with capacitance sensor algorithms in multitouch sensing (2009-09-14)
•	The real story about closed-, open-loop Class D amps (2009-09-04)
•	The challenges of car connectivity (2009-09-23)
•	Touchscreen basics: Technology, design (2009-07-14)

eMedia Asia	EE Times - India\|Embedded Design India\|Power Design - India\|\|\|
Global Sources	\|\|\|Electronic Components\|Computer Products\|Trade Show Center
TechInsights	EE Times\|ESM Online\|EE Times JAPAN