Test/Packaging: [Test & Packaging/Application Notes][Page 3] News, Tech Articles, App Notes

Market Watch

Wipro test facility rises in Bangalore
Wipro Technologies has launched Tarang, a product qualification and compliance certification facility, in Bangalore, India. The facility will enhance product quality; reduce time to market besides providing cost benefits. The investment in this facility is expected to be around $8.5 million.

Application Notes (Sorted By Date)

ISR qualification process (2001-09-21)
Custom thermal test enclosure (2001-09-13)
Frost-free environment for the thermal testing of high performance MCMs with RF circuitry (2001-09-13)
ThermoMap: A breakthrough in IC thermal mapping with 15m, 0.1°C resolution (2001-09-13)
Aluminum channel profile analysis and conducting polymer surface characterization (2001-09-12)

Supplemental laboratory exercise for the ISTM: Calibration using the atomic lattice of graphite (2001-09-12)
DC mode magnetic force microscopy using a Burleigh AFM (2001-09-12)
AFM: A complimentary technique for SEM investigation (2001-09-12)
AFM study of thermally etched alumina ceramics (2001-09-12)
Nanomechanical measurements on polymers using contact mode AFM (2001-09-12)

Surface study of oxidized niobium(110) (2001-09-12)
Use of the AFM to study spin-polarized photo-emission sources (2001-09-12)
Using an oscilloscope to optimize AFM images (2001-09-12)
Surface characterization of semiconductor materials by AFM (2001-09-12)
Testing inductors at application frequencies (2001-08-27)

Testing Teccor semiconductor devices using curve tracers (2001-06-14)
Assembly and soldering recommendations (2001-06-14)
Mounting and handling of semiconductor devices (2001-06-12)
Lead-free soldering for the attachment of µBGA packages (2001-06-07)
Moisture effects on the soldering of plastic encapsulated devices (2001-05-29)

Accurate and efficient c-v measurements (2001-05-25)
ASIC I/O test considerations (2001-05-25)
Quality and reliability (2001-05-25)
New packages for pressure mounting (2001-05-25)
High-density design with MicroStar BGAs (2001-05-11)

Circuit models for plastic packaged microwave diodes (2001-04-19)
Test fixtures for high-speed logic (2001-04-06)
Testing and specifying FAST logic (2001-04-06)
Evaluating the SA605 SO and SSOP demoboard (2001-04-05)
On semiconductor logic date code and traceability marking (2000-12-12)

High voltage, high current, non-destructive FBSOA testing (2000-12-11)
Measurement of Zener voltage to thermal equilibrium with pulsed test current (2000-12-11)
Storage and handling of Drypacked surface mounted devices (SMD) (2000-12-11)
Nanosecond pulse handling techniques in IC interconnections (2000-12-08)
Mounting guidelines for the SUPER-247 (2000-12-01)

PowIRtab mounting guidelines (2000-12-01)
Mounting guidelines for the SUPER-220 (2000-12-01)
Oscilloscope probing of PC133/Rambus circuits (2000-11-27)
Designing boards with Atmel AT89C51, AT89C52, AT89C1051 and AT89C2051 for writing Flash at in-circuit test (2000-08-31)
Faster erase times for XC95216 and XC95108 devices on HP 3070 series testers (2000-06-29)

XC9500 in-system programming using an embedded microcontroller (2000-06-28)
Using serial vector format files to program XC9500 devices in-system on automatic test equipment and third party tools (2000-06-28)
A Study of Device Input Impedance in PSpice (2000-06-15)
Plastic Packaging and the Effects of Surface-Mount Soldering Techniques (2000-06-06)
Implementing Ohmmeter/Temperature Sensor (2000-05-10)

International Rectifier's Total Dose Radiation Hardness Assurance (RHA) Test Program (2000-05-08)
ESD Testing of MOS Gated Power Transistors (2000-05-08)
Mounting guidelines for the SUPER-220 (2000-05-04)
CSP die shrink solution for memory devices (2000-03-10)
Plastic Ball Grid Array (PBGA) (1999-12-15)

155 Records, Total 4 Page, The 3 Page

Article review

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