Test/Packaging: [Test/Packaging/New Products][Page 6] News, Tech Articles, App Notes

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[ Jul 26, 2008 ]

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Test/Packaging	Home / Test/Packaging

The Test and Packaging tech room hosts articles on semiconductor test and packaging topics. Areas covered include IC/semiconductor device testing, test probes/leads, wafer testing and x-ray inspection systems.

Market Watch

Toshiba develops cost-competitive MEMS
Toshiba Corp. has announced two optimized packaging technologies for micro electro-mechanical systems semiconductor packages that achieve significant cost reductions.

New Products (Sorted By Date)
•	Chipscale terminators improve signal integrity in high-speed circuits (2005-06-30)
•	AWG serves microwave design (2005-06-28)
•	Fluke's new two-in-one test tool (2005-06-24)
•	Handheld spectrum analyzer gets cdma2000 1xEV-DO options (2005-06-23)
•	Diodes support up to 10A current in less than 100mm² packages (2005-06-16)

•	Test instruments support Bluetooth EDR transmitter test cases (2005-06-15)
•	Aehr Test rolls out new wafer tester (2005-06-14)
•	Ironwood logic analyzer adapter helps debug low-power SDRAM (2005-06-13)
•	50MHz IF signal analyzer is Windows-based (2005-04-20)
•	Crimp tool with touch-screen control (2005-04-20)

•	All-quartz crystal packaging offers smaller size (2005-04-19)
•	Communication tester targets UMTS Transport Layer (2005-04-18)
•	Conformance suite upgrades tester for MEF9 (2005-04-15)
•	Wireless PHY test software works in LabVIEW (2005-04-14)
•	Sampling technique underpins 100GHz-bandwidth scopes (2005-04-05)

•	Another FB-DIMM tester bows in (2005-04-04)
•	Electrical test rolls (2005-03-23)
•	Fully-Buffered DIMM testing enhances logic analyzers (2005-03-22)
•	Agilent expands 1xEV-DO support (2005-03-22)
•	Wafer tester monitors RF chip quality in realtime (2005-03-18)

•	Modular scalable test set comprises source-measure ATE (2005-03-16)
•	NI offers portable DAQ system (2005-03-14)
•	Scope offers 16bit logic input (2005-03-10)
•	Protocol analyzer slated for ASI (2005-03-08)
•	Scalable load testing targets multi-service RF network gear (2005-03-01)

•	Adapters.com expands Chip-Changer line (2005-02-25)
•	Harvard Thermal tool integrates with Cadence package designer (2005-02-16)
•	Microchip EEPROMs available in DFN package (2005-02-15)
•	Samsung announces 'first eight-die MCP technology' (2005-01-18)
•	Vishay unveils new package type for rectifier, TVS products (2004-12-17)

•	New packaging technology solves design challenges in EHPS, EPS (2004-10-27)
•	Honeywell offers FPGAs replacements in commercial, aerospace apps (2004-10-18)
•	Littelfuse makes 'greener' products (2004-09-15)
•	Supertex makes 233 products "green" (2004-08-31)
•	National introduces 35 enhanced plastic products (2004-06-23)

•	Fairchild launches several devices in DQFN form factor (2004-06-18)
•	Newport system offer "advanced alignment" (2004-06-02)
•	K-Micro offers lead-free options on ASIC packages (2004-05-07)
•	Production tester addresses high-speed serial chip tests (2004-05-04)
•	Cypress MicroSystems PSOCs come in MLF package (2004-05-03)

•	Zymet rolls out silica-filled encapsulant (2004-04-28)
•	STMicro introduces MLP8 2x3 package (2004-04-23)
•	SCS module enhances DI beds performance (2004-04-21)
•	PolarFab offers new robust BCD process (2004-04-21)
•	Zymet underfill encapsulants eyes CSP, BGA apps (2004-04-16)

•	Summit rolls out S9518E in UCSP package (2004-04-02)
•	Agere devices reduce RF transistor packaging costs (2004-03-31)
•	EDA startup AmmoCore claims first tapeout (2004-02-19)
•	Indium releases Pb-free soldering products (2004-02-06)
•	Indium epoxy fluxes have stable thermoset residue (2004-02-02)

375 Records, Total 8 Page, The 6 Page
Article review
1 • 2 • 3 • 4 • 5 • 6 • 7 • 8

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•	High-stability TCXOs aim at mobile GPS market (2008-07-18)
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Talkback

eeForum:
Demystifying Vietnam
What does Vietnam offer that a rising number of top-tier semiconductor companies are setting up and expanding operations there?

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