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[ Jul 19, 2008 ]

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Test/Packaging	Home / Test/Packaging

The Test and Packaging tech room hosts articles on semiconductor test and packaging topics. Areas covered include IC/semiconductor device testing, test probes/leads, wafer testing and x-ray inspection systems.

News & Trends (Sorted By Date)
•	Tessera signs up Fujitsu as chip packaging licensee (2005-03-25)
•	Semiconductor industry to grow 6.7 percent, says TSIA (2005-03-24)
•	Trikon expands market focus amid Aviza merger (2005-03-22)
•	STMicro to license package technology from Siliconix (2005-03-15)
•	NatSemi puts Singapore T&A facility up for sale (2005-03-14)

•	MMIC supplier takes stake in Taiwan packaging house (2005-03-11)
•	SigmaTel ramps up production in ASAT's Dongguan facility (2005-03-04)
•	Kyocera America assembly division gets DSCC certification (2005-02-24)
•	IMI acquires assets of U.S. EMS firm (2005-02-23)
•	Synopsys VCS Native Testbench verifies Aarohi storage chip (2005-02-17)

•	Agilent forms electronics test equipment venture (2005-01-31)
•	August, Nanometrics to merge (2005-01-25)
•	Readers weigh in on package woes (2005-01-24)
•	Casio licenses packaging technology to Renesas (2005-01-20)
•	Silterra adopts HPL IP to speed 0.13µm CMOS process (2005-01-19)

•	TSMC validates 90nm process using Mentor Graphics Calibre xRC (2005-01-14)
•	Hitachi Chemical obtains patent for IC mount assembly tape (2005-01-04)
•	Amkor, PSi ink patent license deal (2004-12-23)
•	Tektronix, IBM partner on new SiGe chips (2004-12-21)
•	Jiangyin Changdian begins WL-CSP, FC package production (2004-12-15)

•	China IC-packaging sector suffers from worker shortage (2004-12-14)
•	Agilent provides AKM with 93000 SOC for mixed-signal IC testing (2004-12-13)
•	Three firms join Chartered design alliance program (2004-12-08)
•	ADI expects weak quarter after sales fall sequentially (2004-11-26)
•	Tessera, Matsushita sign packaging agreement (2004-11-12)

•	Problems seen ahead for supply chain from Pb-free directive (2004-11-11)
•	Magma, Teseda provide IC implementation, test flow (2004-10-27)
•	FSA panel debates crosstalk doom (2004-10-11)
•	EDA growth turns anemic in second quarter (2004-10-07)
•	NEC reorganizes semiconductor assembly, testing operations (2004-10-07)

•	Molex acquires packaging supplier INCEP Technologies (2004-09-21)
•	Hitachi Chemical acquires resist materials patent (2004-09-08)
•	AMD selects InSite apps for production operations (2004-09-07)
•	LSI Logic offers lead-free chip products (2004-08-31)
•	Digitaltest, Kasion sign distribution pact (2004-08-30)

•	ChipMOS announces plans to acquire FICTA assets (2004-08-27)
•	Amkor completes acquisition of Unitive (2004-08-26)
•	Speedline forms sales, marketing alliance with Tamura (2004-08-24)
•	Shareholders approve STATS, ChipPAC merger (2004-08-09)
•	Sharp and Tessera expand packaging agreement (2004-08-05)

•	Two firms apply carbon nanotubes to chip packaging (2004-07-14)
•	Harman selects Teradyne transmission x-ray product (2004-06-17)
•	ChipPAC Malaysia achieves ISO/TS16949 certification (2004-06-17)
•	Mentor Graphics to acquire 0-In Design Automation (2004-06-11)
•	TSMC selects Atrenta as Reference Flow 5.0 partner (2004-06-10)

•	Coventor, Kyocera deliver package libraries for MEMS apps (2004-06-08)
•	Semiconductor firms unite in lead-free initiative (2004-06-08)
•	Unitive boosts chip performance with latest tech app (2004-05-26)
•	IBM jettisons IC-packaging units, sells plants to Amkor (2004-05-21)
•	Ethernet compliance-testing house moves to U.S. (2004-05-12)

711 Records, Total 15 Page, The 8 Page
Article review
4 • 5 • 6 • 7 • 8 • 9 • 10 • 11 • 12

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