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Market Watch
News & Trends (Sorted By Date)
- Agilent provides AKM with 93000 SOC for mixed-signal IC testing (2004-12-13)
- Three firms join Chartered design alliance program (2004-12-08)
- ADI expects weak quarter after sales fall sequentially (2004-11-26)
- Tessera, Matsushita sign packaging agreement (2004-11-12)
- Problems seen ahead for supply chain from Pb-free directive (2004-11-11)
- Magma, Teseda provide IC implementation, test flow (2004-10-27)
- FSA panel debates crosstalk doom (2004-10-11)
- NEC reorganizes semiconductor assembly, testing operations (2004-10-07)
- EDA growth turns anemic in second quarter (2004-10-07)
- Molex acquires packaging supplier INCEP Technologies (2004-09-21)
- Hitachi Chemical acquires resist materials patent (2004-09-08)
- AMD selects InSite apps for production operations (2004-09-07)
- LSI Logic offers lead-free chip products (2004-08-31)
- Digitaltest, Kasion sign distribution pact (2004-08-30)
- ChipMOS announces plans to acquire FICTA assets (2004-08-27)
- Amkor completes acquisition of Unitive (2004-08-26)
- Speedline forms sales, marketing alliance with Tamura (2004-08-24)
- Shareholders approve STATS, ChipPAC merger (2004-08-09)
- Sharp and Tessera expand packaging agreement (2004-08-05)
- Two firms apply carbon nanotubes to chip packaging (2004-07-14)
- ChipPAC Malaysia achieves ISO/TS16949 certification (2004-06-17)
- Harman selects Teradyne transmission x-ray product (2004-06-17)
- Mentor Graphics to acquire 0-In Design Automation (2004-06-11)
- TSMC selects Atrenta as Reference Flow 5.0 partner (2004-06-10)
- Semiconductor firms unite in lead-free initiative (2004-06-08)
- Coventor, Kyocera deliver package libraries for MEMS apps (2004-06-08)
- Unitive boosts chip performance with latest tech app (2004-05-26)
- IBM jettisons IC-packaging units, sells plants to Amkor (2004-05-21)
- Ethernet compliance-testing house moves to U.S. (2004-05-12)
- ChipMOS to offer gold-bump services using Saturn tool (2004-05-07)
- NxGen to make microZ package from Tessera (2004-05-06)
- Greatek to acquire new IC-packaging equipment (2004-04-28)
- Vate Technology to beef up its mini-BGA output (2004-04-21)
- UTAC to get hold of UTC (2004-04-19)
- HKSTP, ASAT to promote chip packaging in HK, China (2004-04-14)
- Samsung selects Teradyne FLEX test system (2004-04-13)
- Rittal forms electronic packaging business sector (2004-04-01)
- GEM Services to offer Fairchild MOSFET packaging tech (2004-04-01)
- Fairchild to license MOSFET packaging tech to GEM (2004-03-23)
- Cohu sets up production plant in Philippines (2004-03-19)
- 'Over the top' routing boosts PCB speeds (2004-03-19)
- Teradyne blasts U.S. export controls on test gear to China (2004-03-17)
- SEMI: Semiconductor packaging materials market to reach $11.7B (2004-03-16)
- Chipbond buys Ultratech packaging lithography tool (2004-03-10)
- BTU launches plant in Shanghai (2004-02-23)
- Amkor to expand semiconductor package output (2004-02-20)
- Amkor enters purchase deal for Ficta facility in Hsinchu (2004-02-17)
- STATS to merge with ChipPAC (2004-02-12)
- Kulicke & Soffa sells flip-chip business (2004-02-12)
- ASE to acquire IC packaging, testing operation from NEC (2004-02-09)
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Resource Center
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