Test/Packaging: [Test & Packaging/News & Trends][Page 6] News, Tech Articles, App Notes

Market Watch

Wipro test facility rises in Bangalore
Wipro Technologies has launched Tarang, a product qualification and compliance certification facility, in Bangalore, India. The facility will enhance product quality; reduce time to market besides providing cost benefits. The investment in this facility is expected to be around $8.5 million.

News & Trends (Sorted By Date)

UTAC to acquire Bangkok-based SATS provider (2006-04-25)
UTAC opens second facility in Singapore (2006-04-24)
PSi closes China plant, transfer services to Manila (2006-04-10)
Avago takes semiconductor baton from Agilent (2006-04-03)
Taiwan's Chung Hua University upgrades research capabilities (2006-03-31)

12-inch wafers to drive IC growth, says Lam Research (2006-03-30)
Model 2100 TFOS receives orders from multiple Japan, U.S.-based customers (2006-03-27)
Tektronix reports Q3 net sales for fiscal 2006 (2006-03-22)
SMIC to employ UltraFLEX system for high volume wafer testing (2006-03-22)
Oki claims first 160Gbps data transmission trial over 635km (2006-03-21)

UTAC, SMIC launch Chengdu joint venture (2006-03-21)
Rx: New test techniques (2006-03-16)
SV Probe acquires wafer test assets from K&S (2006-03-14)
IDT, KTI ink AMD collaboration (2006-03-08)
RapidIO association hails group's interoperability testing (2006-03-03)

ON Semi JV among China's top 10 semicon assembly companies (2006-03-03)
KLA-Tencor buys ADE for $488 million (2006-02-28)
ST to build Chinese TMP factory (2006-02-21)
The comfort zone (2006-02-16)
Spectroscope twist sees single molecules (2006-02-16)

Synopsys licenses IC package design tech to Sigrity (2006-02-15)
Korean patent court decides on FormFactor case (2006-02-14)
Tessera files patent lawsuit against ChipMOS subsidiary (2006-02-14)
Amitec sets up subsidiary in China (2006-02-10)
SPIL to expand capacity by up to 50 percent (2006-02-08)

Tessera sues ST, ASE, SPIL, STATS, Siliconware (2006-02-06)
Camtek gets $1.9M order from Taiwan (2006-02-02)
Flip-Stack packaging supports wirebond-to-flip-chip transition (2006-01-25)
Dropping prices signal spending restart, says ASML (2006-01-23)
New wafer-level package tech from National (2006-01-12)

Aeroflex appoints Okabe as sales manager for Japan (2006-01-09)
Electroglas posts Q2 results (2005-12-28)
IC packaging providers upbeat (2005-12-27)
Tektronix reports Q2 net sales for fiscal 2006 (2005-12-20)
IP reuse requires a verification strategy (2005-12-16)

Wrestling functional verification (2005-12-16)
ChipMOS, Spansion ink test agreement (2005-12-14)
Xilinx plans independent R&D center in India (2005-12-08)
Telematics needs universal test system (2005-12-01)
When health care was simple (2005-12-01)

Trio-Tech acquires Chinese test, burn-in facility (2005-11-30)
STATS ChipPAC offers copper process for passives (2005-11-24)
KLA touts technology to cut flash defect detection time (2005-11-22)
Model feedback systems efficiently (2005-11-16)
Sumitomo backs packaging firm with $20 million (2005-11-11)

VeriSign to endorse Infineon's PC security system (2005-11-07)
Amkor cuts jobs, hikes prices amid Q3 loss (2005-10-28)
Agilent joins Zigbee Alliance (2005-10-26)
O2Micro to open China facility (2005-10-25)
Renesas to use Ponte Solution yield analysis (2005-10-24)

740 Records, Total 15 Page, The 6 Page

Article review

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