Application Notes (Sorted By Date)
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Mechanical support components for S.E.C. cartridge processors
(2002-05-10)
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PECVD diamond films for use in silicon microstructures
(2002-05-09)
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360B/37XXXA/B series vector network analyzers
(2002-05-02)
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Focused ion beam machined silicon tips for measurement of steep-sloped features
(2002-04-15)
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Ion source applications: Si-doped DLC
(2002-03-18)
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Common panel meter setup problems
(2002-03-08)
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Evaluation of a new sample introduction system with desolvation
(2001-10-11)
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AlGaN/GaN transistor application notes: Surface morphology
(2001-10-09)
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AlGaN/GaN transistor application notes: Summary of physical parameters
(2001-10-09)
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AlGaN/GaN transistor application notes: Substrate selection
(2001-10-09)
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Wafer characterization
(2001-10-09)
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AlGaN/GaN transistor application notes: Characterization methodsNES epitaxial Films
(2001-10-08)
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AlGaN/GaN transistor application notes: Insulating GaN buffer layers
(2001-10-08)
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Dual footprint layout for 16Mb and 64Mb TSOP packages
(2001-09-25)
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Excelics wafer qualification procedure
(2001-09-21)
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Recommended wire bonding for Excelics FETs
(2001-09-21)
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Device handling recommendations
(2001-09-21)
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Custom thermal test enclosure
(2001-09-13)
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MIL-PRF-19500 Qual chips versus MIL-PRF-38534 Qual chips
(2001-09-11)
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Plated and solder dipped finishes for semiconductor components
(2001-09-11)
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Care and handling of axial lead or SM diodes for testing and PCB mounting
(2001-09-11)
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High growth rate RF nitrogen source
(2001-09-10)
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Cleaning diamond turned and polished mirrors
(2001-09-10)
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Laser damage threshold
(2001-09-10)
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Bonding mirrors to mounts
(2001-09-10)
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Subtraction of transmission sphere reference data
(2001-09-04)
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ABS geometry and MetroPro calculations
(2001-09-03)
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Testing cylindrical surfaces with computer-generated holograms
(2001-09-03)
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Testing cylindrical optics
(2001-09-03)
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MetroPro cylinder tools
(2001-09-03)
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Silver overcoat spray
(2001-09-03)
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ICH/ICH2/ICH2M real-time clock (RTC) accuracy under environmental stress
(2001-08-24)
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Electrostatic handling precautions
(2001-08-20)
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Bonding, handling and mounting procedures for Millimeterwave p-HEMT MMICs
(2001-06-15)
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Packages & packaging
(2001-06-15)
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Surface mounting instructions CR-9, 11, 12, 13, 14 ceramic 16 and 24 PIN packages
(2001-06-15)
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CR-15 package handling and mounting procedure
(2001-06-15)
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Assembly and soldering recommendations
(2001-06-14)
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Surface mount soldering considerations
(2001-06-14)
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Mounting and handling of semiconductor devices
(2001-06-12)
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Land grid array (LGA) handling, mounting and thermal considerations
(2001-06-07)
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Recommended high-volume processing of surface-mount devices
(2001-06-07)
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Lead-free soldering for the attachment of µBGA packages
(2001-06-07)
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Handling, mounting, bonding GaAs MMIC die
(2001-06-06)
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Electrical characterization of packages for use with GaAs MMIC amplifiers
(2001-06-05)
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Optimum PCB and stencil layout for leadframe MLPs
(2001-06-04)
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Moisture effects on the soldering of plastic encapsulated devices
(2001-05-29)
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High-density design with MicroStar BGAs
(2001-05-11)
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Thermal resistance of packages
(2001-04-23)
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Innovative mounting techniques enhance thermal performance of the surface-mount D3Pak Package
(2001-04-20)
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