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Design 101
New Products (Sorted By Date)
- KLA-Tencor metrology tool features wafer monitoring (2002-06-26)
- GSI Lumonics laser trimmer performs in-line device adjustment (2002-06-22)
- Methode ships SFP EMI shield (2002-06-21)
- K&S bonding wire suits fine pitch package (2002-06-18)
- K&S ball bonder targets HDM, SO packages (2002-06-17)
- Assemblion increases throughput of component mounters (2002-06-11)
- Matsushita ships stronger multilayer PCBs (2002-06-11)
- Kyocera alumina multilayer package has low resistance (2002-06-03)
- Assemblion upgrades component mounter (2002-05-29)
- Amkor ships "green" CSPs (2002-05-27)
- Endpoint detector lengthens chamber life (2002-05-23)
- Innoventions launches DDR memory tester (2002-05-22)
- KLA-Tencor Web-based lithography speeds production (2002-05-22)
- Laird provides flame retardant foam, EMI shielding (2002-05-20)
- Nitto Denko PCB substrate is 50 percent thinner (2002-05-13)
- Assemblion rolls out ceramic component mounter (2002-05-09)
- Nitto Denko develops cleaning wafer (2002-05-09)
- KEC surface-mount package has five terminals (2002-05-07)
- Speedline stencil printer reduces print cycle time (2002-05-03)
- AXT rolls out six-inch InP substrate (2002-05-03)
- Gowanda SMT inductors handle harsh soldering (2002-04-24)
- RVSI rolls out gold bump wafer inspection system (2002-04-24)
- SDK develops 150mm InP monocrystal mirror wafers (2002-04-23)
- Ismeca tape-and-reel machine system determines KGD via single test (2002-04-22)
- GSI Lumonics ships laser trimmer for embedded passive components (2002-04-22)
- Loctite offers fiber-optic bonding adhesives (2002-04-22)
- DEK camera has 10-by-7.5mm inspection window (2002-04-19)
- CEO develops 1.5kW laser module for EUV lithography (2002-04-18)
- Renishaw optical linear encoder has 55m to 10nm resolution (2002-04-17)
- Philips IC package is 75 percent smaller (2002-04-17)
- SEI magnesium alloy wire bends, coils at room temperature (2002-04-16)
- SPI tactile sensor measures 0.1psi to 9,000psi (2002-04-16)
- KEC dielectric material has dielectric constant of 38 (2002-04-15)
- Asymtek dispensing system targets high volume inline SMT apps (2002-04-11)
- APE rework machine has automated Z-axis adjustment (2002-04-04)
- Chomerics coating process can apply 12.55m-thick coating (2002-04-02)
- Material testing system provides tension, compression testing (2002-04-01)
- SUSS flip-chip bonder has up to 200kgf handling force (2002-03-22)
- Dow Corning unveils heat dissipation materials (2002-03-22)
- GSI Lumonics upgrades DrillStar-control software (2002-03-22)
- KLA-Tencor enhances lithography simulation software (2002-03-19)
- HEM introduces lead-free solder for power packages (2002-03-18)
- Cymer unveils dual-discharge-chamber technology (2002-03-13)
- Bourns offer lead-free resettable fuses (2002-03-06)
- Kistler rotating cutting force dynamometer performs up to 25,000rpm (2002-03-05)
- Chomerics phase-change material simplifies heatsink removal (2002-03-01)
- APE PCB rework system handles up to 508-by-610mm boards (2002-03-01)
- Assemblion chipshooter performs 40,000 changes per hour (2002-02-28)
- CATC unveils world's first InfiniBand 4X protocol analyzer (2002-02-27)
- Vitronics Soltec machine separates reusable solder from waste (2002-02-26)
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