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News & Trends (Sorted By Date)
- Applied to build 'green' Asia hub in Singapore (2008-07-10)
-
Siemens job cuts to impact many engineering posts
(2008-07-10)
-
Memristors ready for 2009 debut
(2008-07-10)
- Report: Top OEMs gobbled 76% of chips shipped (2008-07-10)
- Siemens CEO confirms major restructuring, hints job cuts (2008-07-09)
-
Industry giants see more businesses in VC
(2008-07-09)
- Buzz: Intel drops ASML, turns to Nikon for 32nm (2008-07-09)
- Report: KLA-Tencor, Lam trim workforce (2008-07-08)
- Politician opines on $240M Seagate investment (2008-07-08)
- Applied funding arm to build more Indian IC firms (2008-07-08)
- Zarlink refuses to back down from proxy battle (2008-07-08)
-
Tech firms' scores plunge in new green electronics test
(2008-07-07)
- Qimonda, Siltronic team on next-gen transistors (2008-07-07)
- SemIndia scouts new partner after AMD deal expires (2008-07-07)
- Buzz: Sanyo sets up Li-ion battery plant in Hyogo (2008-07-07)
- Nvidia struggles amid product delays, lost share (2008-07-07)
- Fuji Xerox lowers CO2emission in 2007 (2008-07-07)
- Kontron shifts production focus on Asia (2008-07-04)
-
Nvidia covers costs for faulty chips
(2008-07-04)
- Nextreme gets grant to fuel efficiency of thermoelectrics (2008-07-03)
- MPS victorious in case vs. Linear (2008-07-03)
- Spansion all set for Numonyx challenge (2008-07-02)
-
Who calls the shot over at Infineon?
(2008-07-01)
-
Identifying the tech vendor elite
(2008-07-01)
-
CCID notes steady growth of China IC industry in '07
(2008-06-30)
- Sony amends corporate strategy (2008-06-30)
- Matsushita now calls itself Panasonic (2008-06-30)
- Solar cell development center rises in Silicon Valley (2008-06-27)
-
Samsung, Hynix partner on STT-MRAM
(2008-06-27)
- IBM, ETH Zürich establish nanotech lab (2008-06-27)
- Panasonic chronicles environmental endeavors (2008-06-27)
- European IR firm opens production facility in Singapore (2008-06-26)
- SMIC to build fabs, R&D center in Shenzhen (2008-06-25)
- ON Semi taps Tower to supply, co-develop car, computing ICs (2008-06-25)
-
Malaysia foundries zero in on MEMS, analog
(2008-06-25)
-
Bright future for solar cell market, says report
(2008-06-25)
- Anwell, Chinese associate establish solar module JV (2008-06-25)
-
India's VLSI design projects soar to greater heights
(2008-06-24)
- Buzz: Samsung to build IC plant in Philippines (2008-06-24)
-
Taiwan develops low-power chips for mobile markets
(2008-06-24)
- Spansion plans more tech, manufacturing tie-ups (2008-06-23)
- Toshiba compact model ups gate density in 45nm CMOS (2008-06-23)
- Toppan, IBM extend photomask partnership to 22nm (2008-06-23)
-
Reports point to bleak IC, fab-tool markets
(2008-06-23)
- Solar wafer maker signs deal with Intel spin-off (2008-06-23)
- JV eyes 300mm wafer production in Singapore (2008-06-23)
- REC sets up solar plant in Singapore (2008-06-20)
- TI to boost use of proprietary process, fabs (2008-06-20)
- Fujitsu simplifies development of 32nm LSIs (2008-06-19)
- SanDisk, Toshiba team up to produce 3D memory chips (2008-06-19)
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