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Technical Archives (Sorted By Date)
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Attending to signal integrity in complex designs
(2001-10-01)
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Reducing power, area in cell-based designs
(2001-10-01)
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Riding the new roller coaters
(2001-09-01)
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The ramifications of component selection
(2001-08-16)
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Contactless smartcard design using the EM simulation software
(2001-08-09)
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Synthesize SoCs using C-based design flow
(2001-08-01)
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The finer points of autorouting
(2001-07-16)
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Validate EMC design rules with 3D simulation
(2001-07-16)
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Establishing design trade-offs for DFM
(2001-07-01)
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Dimensioning and tolerancing
(2001-07-01)
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DFM guidelines for through-hole technology
(2001-07-01)
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Solution space analysis for high-speed design
(2001-06-22)
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Two mysteries of PCB thermal analysis
(2001-06-16)
- Co-verification speeded up for design (2001-06-16)
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3D design tools for package flexibility
(2001-06-08)
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HDI and microvia design for high-performance
(2001-06-08)
- Stimulating entrepreneurial spirit in Japan (2001-06-01)
- Academia, IC vendors ally for R&D in Japan (2001-06-01)
- Extraction method verifies IP functions (2001-06-01)
- Fitting last year's IP to today's processes (2001-06-01)
- Scripts bind EDA tools (2001-06-01)
- Board tools unite for enhancements (2001-06-01)
- Sequence Design offers tool for timing closure (2001-05-16)
- U.S.-based Indian engineers head home (2001-05-16)
- Syntax raises RTL abstraction level (2001-05-16)
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Moving data across asynchronous clock boundaries
(2001-05-08)
- Cadence, Agere tool would foster IC co-design (2001-05-01)
- The need for an EDA API (2001-05-01)
- Cadence's 'all-in-one' tool gets skeptic reviews (2001-05-01)
- Vendors should count silicon, not tapeout wins (2001-05-01)
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HAL levels the playing field
(2001-05-01)
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Selecting a microvia process
(2001-05-01)
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Modular component design reuse
(2001-05-01)
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Putting automated libraries into the flow
(2001-05-01)
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Timing analysis tools greatly impacts a successful design
(2001-05-01)
- Taiwan takes stocks (2001-04-15)
- Emulation or prototyping for silicon success? (2001-04-15)
- Process design kits take aim at custom ICs (2001-04-15)
- Speed enhancements for Model Tech upgrades (2001-04-15)
- Verification firm starts partners program (2001-04-15)
- Ikos lawsuit against Axis turns more complex (2001-04-15)
- Protel upgrades P-CAD package (2001-04-15)
- Oki, Lexra roll out prototyping boards for SoCs (2001-04-15)
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Hierarchical physical design for million-gate ASICs
(2001-04-15)
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SERA tin evaluation for surface finish
(2001-04-15)
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Solder joint reliability of BGA/CSP for mobile phones
(2001-04-01)
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Which data transfer format is best for the industry?
(2001-04-01)
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Solder joint reliability of BGA/CSP for mobile phones
(2001-04-01)
- Strict 'surgery' on slate for electronics industry (2001-03-01)
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Autorouters accelerate PCB design
(2001-03-01)
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