EDA/IC Design: [EDA/Technical Archives][Page 5] News, Technical Archives, App Notes

Market Watch

Outsourced IC design growth slowed 20% in '08
2009 will be a make or break year for chip design service providers after the recession slowed the growth of outsourced chip design starts last year, according to a survey by Gartner Inc.

Technical Archives (Sorted By Date)

Oki, Lexra roll out prototyping boards for SoCs (2001-04-15)
Hierarchical physical design for million-gate ASICs (2001-04-15)
SERA tin evaluation for surface finish (2001-04-15)
Solder joint reliability of BGA/CSP for mobile phones (2001-04-01)
Which data transfer format is best for the industry? (2001-04-01)

Solder joint reliability of BGA/CSP for mobile phones (2001-04-01)
Strict 'surgery' on slate for electronics industry (2001-03-01)
Autorouters accelerate PCB design (2001-03-01)
Integrating PCB layout with mechanical design (2001-03-01)
One approach for debugging of modified designs (2001-03-01)

Complex designs demand greater attention to data management (2001-03-01)
Flow is shaky for programmable SoCs (2001-03-01)
Solder masks: Examining rules of thumb (2001-02-01)
Direct plate processing for PCBs (2001-02-01)
Techniques for handling electromagnetic interference (2001-01-01)

Contract manufacturing and flip-chip interconnect design (2001-01-01)
Integrated approach for emerging tech designs (2000-12-01)
Chemistry for the 0.13µm copper interconnect process (2000-12-01)
The advantage of using logic BIST for ASIC designs (2000-12-01)
Applying Hubble technology to chip defects (2000-12-01)

SoCs likely to pose heading-off test problems (2000-12-01)
Improving productivity with FPGA design reuse (2000-12-01)
Let us give library development its due (2000-12-01)
The advantages of using PCB design reuse (2000-12-01)
Chip-scale packaging: choices and challenges (2000-11-01)

Increasing IC complexity disrupts the test model (2000-11-01)
Ultrafine-line lithography for next-gen apps (2000-11-01)
Ensuring signal integrity in board design (2000-11-01)
Solving signal integrity problems (2000-11-01)
The need for board-level simulation (2000-11-01)

Controlling radiation through PCB stack-up (2000-10-01)
Enter the world of direct imaging (2000-10-01)
Schottky diodes vs. synchronous rectification using FETs (2000-05-01)
Getting started in wavesoldering (2000-02-01)
Building fault-tolerant embedded systems using TTP/C (1999-11-01)

Slashing design time with the IP evaluation model (1999-10-01)
Design for Test considerations for ATPG (1999-10-01)
Automating design-data management (1999-10-01)
Estimating IC power consumption at the RT Level (1999-10-01)
Achieving SoC Timing Convergence (1999-10-01)

Using parallel-distributed HDL simulation (1999-10-01)
Facing the challenges of advanced IC packages (1999-10-01)
Latest developments for ReFLEX paging (1999-09-09)
RF modules for cellular/PCS handsets (1999-09-09)
Hardware/Software co-development and SoC verification (1999-09-01)

Facing the challenges of advanced IC packages (1999-09-01)
Design of multi-channel modem for remote access server (1999-06-29)
Multi-functional communication device for various data networks (1999-06-29)
Challenges for soft modems in Audio/Modem Riser (AMR) and MDC environments (1999-06-29)
Advances in satellite front-end technology give speed and cost-benefit system test, installation, and free to air operation (1999-06-29)

262 Records, Total 6 Page, The 5 Page

Article review

1 • 2 • 3 • 4 • 5 • 6

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•	LPC2000 secondary bootloader for code update using IAP (2009-07-28)
•	MPC8572E PowerQUICC III Bring-Up Guide (2009-07-13)

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