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Market Watch
New Products (Sorted By Date)
- Debugger supports Infineon's car safety MCUs (2007-07-27)
- New CHS suite enhances user experience (2007-07-25)
- Cyclone III FPGAs support EtherCAT technology (2007-07-23)
- Reconfigurable logic IP rolls for 65nm, 45nm nodes (2007-07-23)
- EMMA-based turnkey solution eases STB development (2007-07-17)
- Isolators deliver higher magnetic immunity, longer life (2007-07-17)
- VIA fields new devices to aid PC2.0 transition (2007-07-13)
- GbE development kit with 65nm Virtex-5 FPGA debuts (2007-07-13)
- Mobile I/O companion ICs target portable products (2007-07-11)
- RTL synthesis tool eases chip-level interconnect design (2007-07-11)
- ST touch sensors use ATLabs capacitive technology (2007-07-09)
- Tool speeds up development of non-volatile FPGAs (2007-07-09)
- 3-D EMF simulator handles massive, complex models (2007-07-06)
- Xilinx delivers ISE 9.2i with lower memory requirements (2007-07-04)
- Signal integrity toolkit checks jitter, boasts new Serdes lib (2007-07-03)
- Tame signal integrity in the fast lane (2007-07-02)
- Universal SMT contact innovates interfaces (2007-07-02)
- A new way to predict LDMOS DC signal behavior (2007-06-29)
- Intel rolls out cables, spec for clusters (2007-06-29)
- Commentary: Hope emerges for analog layout automation (2007-06-25)
- Designing in the age of 3D systems (2007-06-25)
- Surface-mountable CW laser is ultracompact (2007-06-25)
- Platform leverages Serial RapidIO technology (2007-06-25)
- Digital front-end tool rolls for TD-SCDMA (2007-06-22)
- ATX power supply reference design debuts (2007-06-22)
- Automation software supports Vista (2007-06-21)
- FPGA design kit achieves higher abstraction levels (2007-06-20)
- LabVIEW driver for UltraFast devices debuts (2007-06-19)
- Universal graphics module supports UGM 1.0 (2007-06-18)
- PXI Express tools offer up to 400MBps data streaming (2007-06-14)
- TI tips low-end VoIP DSP (2007-06-14)
- CoolRunner-II CPLD starter kit suits low-power apps (2007-06-14)
- Using tolerance analysis method in product selection (2007-06-13)
- IBM takes wraps off 45nm ASIC with SOI (2007-06-13)
- Quad-core system host board has five PCIe lanes (2007-06-13)
- 32bit dual-MAC DSP cores target 2.5G, 3G baseband (2007-06-08)
- USB PHY trims power in 65nm, 45nm SoC designs (2007-06-07)
- New interconnects, signal integrity devices roll (2007-06-04)
- System board is ultrasmall at 16.7cm² (2007-06-01)
- Serial ATA PHY core suits low-power designs (2007-05-31)
- FPGA kits streamline DDR2 SDRAM devt (2007-05-31)
- Tool tackles power integrity issues in ICs, packages, boards (2007-05-31)
- Buck regulators deliver up to 600mA per channel (2007-05-30)
- Routing suite receives 45nm design update (2007-05-30)
- Timing analyzer vows dramatic speedup (2007-05-30)
- Signal integrity models roll for RF design tools (2007-05-28)
- Toolkit for 32bit MCUs has Ethernet function (2007-05-28)
- Ultra-reliable EEPROM block add-on debuts (2007-05-28)
- Tool speeds up development of CMOS imaging apps (2007-05-28)
- 45nm-capable memory characterization tool unveiled (2007-05-25)
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Resource Center
- [Avago] Solutions for Mobile Information Appliances
- [Cypress] Interfacing the QDR(TM) to the XILINX SPARTAN-II FPGA
- [NI] Reduce Costs and Development Time for Embedded System Design
- [ADI] Designing with Switching Regulators in High-Speed A/D Converter Applications
- [Cypress] Embedded Change Just Happens!
- [ADI] The Basics of Video Decoders in Supervision and Inspection
- [NI] Reduce Costs for OEM Solutions
- [ADI] Precision ADC Selection Guide
- [Cypress] PSoC(R) Programmable System-on-Chip Technical Reference Manual (TRM)
- [Cypress] New PSoC Platform
Top Ranked Articles
- IP core supports Serial RapidIO 2.1
- Linking or selecting scan ports with BSCAN2
- Analysis: Change is in the wind at SMIC
- Land grid array (LGA) package rework
- Low-power IP camera ref design delivers 30fps
- Revised crosstalk-aware routing offers better optimized design
- Freescale, Synopsys extend verification tie-up
- 0.11µm 30V process trims costs
- Mentor, Aeroconseil partner for China aviation
- Assembly guidelines for MicroFET-6 packaging
